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Friday, December 27, 2024

• EnSilica PLC Demonstrates Strong Growth and Market Position in ASIC Industry

Thursday, December 26, 2024

• Chiplets Extend Automotive SoC AI and GPU Capability
• 7 top IoT trends to watch in 2025 and beyond
• South Korea accelerates world's largest semiconductor complex
• Cadence Appoints Moshe Gavrielov to Board of Directors
• Software-Defined Vehicles: 'State-of-the-Art' and Challenges with AD and ADAS Computing Systems
• China Becomes a Contender in Quantum Computing
• TSMC Sets Key Milestone in Japan as Kumamoto Fab Begins Mass Production

Wednesday, December 25, 2024

• L&T Technology Services Marks 10 Years of Engineering Excellence with Siemens
• Gen3 UCIe IP elevates chiplet link speeds

Monday, December 23, 2024

• Arm vs. RISC-V in 2025: Which Architecture Will Lead the Way?
• Infineon Ranked Among World's Most Sustainable Companies
• TSMC, Intel, Samsung Foundry ready to battle over the start of 2nm production next year
• GUC Joins Arm Total Design Ecosystem to Strengthen ASIC Design Services

Sunday, December 22, 2024

• Synopsys' $35 bln Ansys acquisition to be approved in EU, sources say
• Everything Goes Up! Top Trends of 2024
• Micon Global and Silvaco Announce New Partnership
• QuickLogic Announces $6.575 Million Contract Award for its Strategic Radiation Hardened Program

Saturday, December 21, 2024

• Arm loses out in Qualcomm court case, wants a re-trial

Friday, December 20, 2024

• Alphawave Semi Scales UCIeâ„¢ to 64 Gbps Enabling >20 Tbps/mm Bandwidth Density for Die-to-Die Chiplet Connectivity

Thursday, December 19, 2024

• Europe okays Italy's €1.3 billion subsidy for chiplet fab
• With an Eye on TSMC, Rapidus Foundry Approaches 2nm Process
• Jury is out in the Arm vs Qualcomm trial
• Alphawave Semi Scales UCIe™ to 64 Gbps Enabling >20 Tbps/mm Bandwidth Density for Die-to-Die Chiplet Connectivity
• Synopsys Responds to U.K. Competition and Markets Authority's Phase 1 Announcement Regarding Ansys Acquisition
• Ceva Seeks To Exploit Synergies in Portfolio with Nano NPU

Wednesday, December 18, 2024

• Enhancements to Creonic's DVB-S2X IP Cores for Greater Flexibility and Performance
• Third day for Arm vs Qualcomm trial
• RaiderChip Hardware NPU adds Falcon-3 LLM to its supported AI models
• VeriSilicon unveils next-generation high-performance Vitality architecture GPU IP series

Tuesday, December 17, 2024

• Soitec: Silicon Photonics to Power Next-Gen AI Data Centres
• Cadence Rolls Out System Chiplet to Reorganize the SoC
• Siemens extends Veloce hardware-assisted verification support of EPGM Ethernet to 1.6 Tbps
• Samsung Reportedly Considering Partnership with TSMC to Jointly Produce Exynos 2500
• Crypto Quantique adds TRNG to its quantum-derived, side-channel protected PUF hardware IP block
• ARM versus Qualcomm court case opens
• Andes Technology Partners with ProvenRun to Strengthen RISC-V Trusted Execution Environment
• Reimagining Video Excellence at CES 2025 with intoPIX

Monday, December 16, 2024

• Fraunhofer IAF expands technology capabilities for chiplet innovations within the APECS pilot line
• Chiplet Summit Features the Latest Chip Design Technology
• QuickLogic Announces Appointment of Andy Jaros as Vice President of IP Sales
• Synopsys and SiMa.ai Announce Strategic Collaboration to Accelerate Development of Automotive Edge AI Solutions
• BrainChip Awarded Air Force Research Laboratory Radar Development Contract
• M31 Unveils Full Range of Automotive IP Solutions at ICCAD Illuminating the Future of Automotive Chip Development
• sureCore teams with Sarcina to package cryo chips
• Dolphin Semiconductor transfers HQ to Canada
• Synopsys and SiMa.ai Announce Strategic Collaboration to Accelerate Development of Automotive Edge AI Solutions
• BrainChip Awarded Air Force Research Laboratory Radar Development Contract
• M31 Unveils Full Range of Automotive IP Solutions at ICCAD Illuminating the Future of Automotive Chip Development
• sureCore teams with Sarcina to package cryo chips
• Dolphin Semiconductor transfers HQ to Canada

Monday, December 16, 2024

• NVIDIA and TSMC Unveil Silicon Photonics Innovations at IEDM 2024
• Samsung and TSMC locked in intense 2nm chip competition
• SEMICON Korea 2025 to Spotlight Edge Technologies Shaping the AI Era
• European chiplet pilot line starts operations

Sunday, December 15, 2024

• Frontgrade Gaisler Leads European Initiative for Ultra Deep Sub-Micron Semiconductor Technology for Space Applications
• Industry Grade ASIL-B IP Cores licensed to Power Next-Gen Automotive Systems
• Frontgrade Gaisler Licenses BrainChip's Akida IP to Deploy AI Chips into Space