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Thursday, April 1, 2021

• Key Driving Forces Changing Automotive Electronics System

Wednesday, March 31, 2021

• Optimizing Package System Integration Maximizes System Performance
• SMIC Profit Up 43.3% In 2020 But Growth Uncertainty Lingers
• SMIC Announces audited 2020 Annual Results
• Truechip Adds New Customer Shipments Of Verification IPs For DDR, LPDDR And I3C v1.1
• SiFive and DARPA collaborate to bring the power of RISC-V to Technology Innovation
• CAVP – NIST ACVTS – Are you still with me?

Tuesday, March 30, 2021

• Arm's solution to the future needs of AI, security and specialized computing is v9
• Codasip to Offer Secure Boot Solutions with Veridify Tools
• Huawei will negotiate with Apple and Samsung to use 5G patents
• Lattice Brings Best-in-Class Embedded Vision Optimized FPGA to Automotive Applications

Monday, March 29, 2021

• 5 Emerging IoT Technologies You Need To Know In 2021
• Driver's Responsibility Must Be a Yes-or-No Question
• UK standard for self-driving car safety oversight
• ReRAM Machine Learning Embraces Variability
• SEMI Promoting Cybersecurity Adoption
• Arm processors: Everything you need to know now
• TSMC head says drive to onshore chip supply chain is 'unrealistic'
• Intel 2.0
• Xylon's New Wireless Vehicle Router Enables Remotely Supervised Test Data Harvesting on Roads Around the World
• Magnachip Enters into Definitive Agreement with Wise Road Capital in a Take Private Transaction Valued at $1.4 Billion

Sunday, March 28, 2021

• Strong Growth for 5G Mobile Devices
• Will Voice Control Become the Dominant User Interface?
• Insights on Intel's Standalone Foundry Business
• GUC Enlists AWS Partner proteanTecs to Increase ASIC Reliability and Quality at Scale
• Imperas releases free ISS for RISC-V CORE-V developers in the OpenHW ecosystem
• Intel Surprises with $20B Expansion of Foundry Business
• Intel Drops a Bomb, Not the Ball

Thursday, March 25, 2021

• GUC and Ansys Expedite Advanced-IC Designs for Next-Generation Applications with State-of-the-Art Simulation Workflow
• Siemens delivers next-generation, comprehensive hardware-assisted verification system

Wednesday, March 24, 2021

• Intel Investing $20B in Building Foundry Business
• CEA-Leti Goes For Optical Phased Arrays to Cut LiDAR Cost
• North American Semiconductor Equipment Industry Posts February 2021 Billings, Surpassing $3 Billion for Second Consecutive Month
• PLDA Joins ETP4HPC to share its expertise in High Speed Interconnect Solution IP with the European High Performance Computing Ecosystem
• Revenue of Top 10 IC Design (Fabless) Companies for 2020 Undergoes 26.4% Increase YoY Due to High Demand for Notebooks and Networking Products, Says TrendForce
• Imagination launches IMG Labs to create breakthrough technologies
• Intel CEO Pat Gelsinger Announces "IDM 2.0" Strategy for Manufacturing, Innovation and Product Leadership
• Mitacs and OpenHW Group partner on $22.5M first-of-its-kind open-source research program

Tuesday, March 23, 2021

• More resilient cybersecurity for IoT devices
• CEVA Unveils MotionEngine Scout, a Highly-Accurate Dead Reckoning Software Solution for Indoor Autonomous Robots
• GLOBALFOUNDRIES and Cadence Add Machine Learning Capabilities to DFM Signoff for GF's Most Advanced FinFET Solutions
• WISeKey Partners with Cortus to Secure Automated Vehicles Capable of Controlling All Aspects of Driving Without Human Intervention
• Achronix Adopts Movellus Maestro Clock Network for Its Speedster7t FPGAs
• Synopsys Collaborates with Keysight Technologies to Deliver Integrated Custom Design Flow for 5G Designs
• Cadence Successfully Tapes Out Tensilica SoC on GLOBALFOUNDRIES 22FDX Platform Using Adaptive Body Bias Feature

Monday, March 22, 2021

• One-Way Data Transfer Secures Industry 4.0 Networks
• Software Driving Changes in Automotive Industry
• Europe Aiming for Manufacturing Capacities for 2nm
• Intel's tilt to foundry opens a door to upstart RISC-V technology
• Valtrix and Codasip Cooperate on Verification of RISC-V Systems
• (Re)Shoring Up Semiconductor Manufacturing

Sunday, March 21, 2021

• Will Fan-Out Wafer-Level Packaging Keep Moore's Law Valid?
• Apple to Build New Mobile Wireless Design Center in Munich
• OpenPOWER Foundation Provides Microwatt for Fabrication on Skywater Open PDK Shuttle
• Global Semiconductor Materials Market Sets New High With 5% Expansion in 2020, SEMI Reports
• Flex Logix raises $55M to accelerate market adoption of AI inference and eFPGA solutions
• Chip Makers Must Learn New Ways to Play "D"