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Thursday, March 18, 2021

• Samsung, TSMC Spending to Dominate Advanced IC Technology Nodes

Wednesday, March 17, 2021

• Japanese AI processor firm picks Risc-V for partner CPU
• SMIC and Shenzhen government to invest $2.35 billion to build new foundry in China
• Sondrel designs its first Radiation-Hard chip
• Siemens' Veloce Virtual Network App Certified for IxVerify 3.0
• More than Chiplets | Facebook Enters the Fray
• SiFive and ArchiTek Enable Secure, Private, Flexible Edge AI Computing With AiOnIc Processor
• Global Fab Equipment Spending Poised to Log Three Straight Years of Record Highs, SEMI Reports
• Smart Lighting Platform "end to end" Management Solution licensed by leading European Lighting Company
• Advanced Nodes Boosting Foundry Revenues

Tuesday, March 16, 2021

• South Korea and China Increase Patent Applications in Europe
• US$150 billion needed in 5 years to catch up with TSMC: IC Insights
• Arasan announces its next generation of C-PHY/ D-PHY Combo IP Core compliant with the latest MIPI Specifications
• Panasonic Starts Licensing IP Core for Semiconductors Complying with the IEEE 1901-2020 International Standard
• Samsung and TSMC Seeking to Spend Their Way to Worldwide Domination of Advanced IC Technology
• Cadence Unveils Next-Generation Sigrity X for Up to 10X Faster System Analysis
• Synopsys Launches Industry's First Complete IP Solution for PCI Express 6.0

Monday, March 15, 2021

• James Mitarotonda Joins Rambus Board of Directors
• Qualcomm Completes Acquisition of NUVIA
• Lattice Partners with DARPA Toolbox Initiative to Accelerate Technology Innovation
• Ron Black Joins Codasip as Executive Chairman
• Socionext's latest generation of smart display controllers uses APIX3 technology from Inova Semiconductors
• Secure-IC Announces Partnership With U.S. DARPA To Foster Security Technology Innovation
• QuickLogic Joins DARPA Toolbox Initiative to Provide Mil/Aero/Defense Grade Programmable Logic
• Xilinx Expands into New Applications with Cost-Optimized UltraScale+ Portfolio for Ultra-Compact, High-Performance Edge Compute
• Alphawave IP and EnSilica Announce Partnership for Expansion in the United Kingdom and Europe

Sunday, March 14, 2021

• 2 charts show how much the world depends on Taiwan for semiconductors
• MIPS, China's Loongson CPU Are Both Going All-in on RISC-V
• A high-performance and optimized Video IP: Chips&Media at the Semiconductor360 Live 2021
• Rockley Selects Synopsys for Silicon Photonics Design Solutions
• NUVIA Selects Avery Design for Next Generation PCIe Verification

Thursday, March 11, 2021

• First software-defined 5G New Radio demonstration over GEO satellite
• Cornami Partners with Inpher, Pioneer in Secret Computing, to Deliver Quantum-Secure Privacy-Preserving Computing on Encrypted Data
• Open RF Association and MIPI Alliance Sign Cooperation Framework (Liaison) Agreement

Wednesday, March 10, 2021

• AI Drives Memory Interconnect Evolution
• https://www.eetimes.com/ai-drives-memory-interconnect-evolution
• OpenHW Group and Mitacs announce OpenHW Accelerate
• Tortuga Logic Announces Expansion of Product Portfolio with Development of New Security Governance Platform
• SiPearl passes a key milestone for Rhea's launch by moving into an accelerated simulation phase with Siemens' Veloce platform
• Allegro DVT Releases New Versions of its Encoder and Decoder IPs with Support for 12-bit sample size and 4:4:4 Chroma Format
• Mixel, Rambus and Hardent Collaborate to Deliver State-of-the-Art Integrated MIPI Display Subsystem Solution
• Vtool Appoints EmergeTek as Cogita Sales Representative

Tuesday, March 9, 2021

• QuickLogic, SparkFun and Crowd Supply Launch the SparkFun Thing Plus - QuickLogic EOS S3 Development Kit
• Eta Compute's Low Power AI Vision Board Accelerates Design, Test, and Deployment of Transformative Embedded Vision Solutions
• USB 4.0, USB 3.2, USB 3.1, USB 3.0, USB 2.0, Device, Hub, Host & Dual Mode proven Interface IP Controllers are available immediately to License
• Compound Photonics Partners with GLOBALFOUNDRIES to Manufacture World's First Monolithic Microdisplay for Real-Time AR
• TSMC February 2021 Revenue Report
• IC Insights Raises Its 2021 IC Market Forecast from 12% to 19% Growth
• 10 Millionth Achronix Speedcore eFPGA IP Core Shipped

Monday, March 8, 2021

• Hsinchu Baoshan R&D center to work on 3nm process: TSMC
• TSMC together with Apple are developing 2nm process technology
• Alphawave and PLDA Announce a Collaboration to Create Tightly-Integrated Controller and PHY IP Solutions for Interconnects Including PCIe 5.0, CXL and PCIe 6.0
• AMD and Xilinx Special Meetings of Stockholders to be Held on April 7, 2021
• Synopsys ARC EV Processor Enables Kyocera Document Solutions to Launch AI-enabled Multifunctional Printer SoC
• EPI EPAC1.0 RISC-V core boots Linux on FPGA
• GLOBALFOUNDRIES 22FDX RF Solution Provides the Basis for Next-Gen mmWave Automotive Radar
• Codasip Announces Commercial Add-ons to SWeRV Core EH1

Sunday, March 7, 2021

• Wait, What? MIPS Becomes RISC-V
• Progress in Importation of US Equipment Dispels Doubts on SMIC's Capacity Expansion for Mature Nodes for Now, Says TrendForce
• Intel stung for $2bn in Waco judgment
• Intel to Collaborate with Microsoft on DARPA Program
• UMC Reports Sales for February 2021
• Automakers Will Go Fabless
• GUC Monthly Sales Report - February 2021