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Thursday, March 4, 2021

• IAR unveils certified edition of its development toolchain for RISC-V

Wednesday, March 3, 2021

• Silex Insight unleashes their new video codec (Colibri), that will shape the future of AV over IP distribution over 1GbE
• Wanxiang Blockchain Forms RISC-V International Blockchain SIG with Ecosystem Partners
• BrainChip's Success in 2020 Advances Fields of On-Chip Learning and Ultra-Low Power Edge AI
• Airborne System Design Assurance: Aldec Adds 60+ New HDL Rules to ALINT-PRO's DO-254 Plug-In
• Leopard Imaging Collaborates with Socionext, Hailo, and AWS to Launch EdgeTuring
• IAR Systems announces availability of RISC-V development tools with certification for IEC 61508 and ISO 26262
• Thalia successfully completes 20th 22nm analog IP reuse engagement
• Revenue per Wafer Climbs As Demand Surges for 5nm/7nm IC Processes
• GPU shipments soar once more in Q4

Tuesday, March 2, 2021

• FD-SOI Boosts Operating Frequency And Reduces Power Consumption
• TSMC Ranks in Top-10 For Capacity in Three Wafer Size Categories
• GlobalFoundries to invest $1.4 bn to increase output at three units
• BrainChip's Success in 2020 Advances Fields of On-Chip Learning and Ultra-Low Power Edge AI
• 28nm FD-SOI i.MX8 targets low power
• proteanTecs Joins the TSMC IP Alliance Program
• TSMC Ramping Up Production of 5-nm Chips
• Achronix and Mobiveil Announce Partnership to Deliver High-Speed Controller IP and FPGA Engineering Services
• Synopsys Announces Euclide to Accelerate Design and Verification Productivity

Monday, March 1, 2021

• Samsung Invests in Quantum Computing
• RISC-V Fast Tracks Simpler Extensions
• Global Semiconductor Sales Increase 13.2% year-to-year in January
• Wave Goodbye, Hello MIPS as Chapter 11 Resolved

Sunday, February 28, 2021

• Automotive smart camera development with open platform turnkey solutions
• China's most important chipmaker SMIC could be a big winner from the global semiconductor shortage
• AMD, TSMC & Imec Show Their Chiplet Playbooks at ISSCC
• Verisilicon High-Performance and High-Quality AI Video Processor Powers Leading Datacenters
• Metrics Announces an EDA as a Service Partnership Program with Semiconductor Intellectual Property Vendors
• Introducing Dolphin Design's new Audio CODEC for TWS devices with ANC capabilities
• Imperas Donates Latest RV32/64K Crypto (scalar) Architectural Validation Test Suites to the RISC-V Verification Ecosystem
• Velodyne Lidar Licenses TSN IP Core from CAST
• Arasan announces the immediate availability of its MIPI C-PHY / D-PHY Combo IP for SoC Designs on TSMC 22nm Process
• Flex Logix and DARPA Expand Partnership with the Addition of Silicon Proven EFLX eFPGA in 12 and 16 nm Process Technologies for DARPA's Toolbox Initiative

Friday, February 26, 2021

• Is Taiwan a Ticking Time Bomb in the Semiconductor Supply Chain?
• SCALINX takes strides in 5G communication infrastructures and radar markets with 10.5 million euro funding

Thursday, February 25, 2021

• Alphawave IP and Verisilicon Expand Partnership with $54M Multi-Year Exclusive Subscription Reseller Agreement for China Market

Wednesday, February 24, 2021

• TSMC Ranks in Top-10 For Capacity in Three Wafer Size Categories
• MulticoreWare Inc. Becomes CEVA's Trusted Partner for Imaging & Computer Vision
• BrainChip Inc. and NaNose Medical Successfully Detect COVID-19 in Exhaled Breath with Fast High-Accuracy Results
• Samsung's foundry biz market share to increase in Q1 2021
• Palma Ceia SemiDesign Announces Nicky Wilkinson as Director IC Engineering
• Rambus and AMD Extend Patent License Agreement

Tuesday, February 23, 2021

• Synopsys Delivers Breakthrough Performance with New ZeBu Empower Emulation System for Hardware-Software Power Verification
• CEVA's MotionEngine Smart TV Software Comes to More Smart TV brands via LG webOS
• Cadence Completes Acquisition of NUMECA
• CMC Microsystems and Deeplite seek to advance AI R&D
• IoT Product Development Market Challenges and Opportunities 2021-2025
• Top 10 foundries expected to increase revenues by 20%
• Andes Technology and Rambus Collaborate to offer Secure Solution for MCU and IoT Applications
• Xilinx Revolutionizes the Modern Data Center with Software-Defined, Hardware Accelerated Alveo SmartNICs
• AccelerComm Unveils Fully Integrated PUSCH Decoder to Supercharge 5G NR for Performance-Critical Channels
• RISC-V International Unveils Fast Track Architecture Extension Process and Ratifies ZiHintPause Extension
• Tianyihexin Licenses Codasip's L30 for Powering Intelligent Wearable Device Solutions
• North American Semiconductor Equipment Industry Posts January 2021 Billings, Topping $3 Billion for First Time
• Achronix Announces 2020 Financial Results and Business Highlights

Monday, February 22, 2021

• TSMC's 3nm Process On Track For 2 Year, 2X Performance Improvement – Chairman
• SiPearl and Open-Silicon Research Collaborate to Accelerate Custom Silicon for High Performance Computing (HPC) Applications
• Nations' Latest BLE 5 IC Powered By CEVA Bluetooth Low Energy IP
• Tiempo Secure is a winner of the French Government's Great Cybersecurity Challenge to make smart objects more resilient to cyberattacks
• Eureka Technology IP Core Supports NASA's MARS 2020 Perseverance Rover Mission

Sunday, February 21, 2021

• Khronos and EMVA Collaborate to Gather Requirements for Embedded Camera and Sensor API Standards
• China chases semiconductor self-sufficiency
• Imagination's GPU selected by StarFive to create high-performance, small and low-cost BeagleV RISC-V AI single board computer
• Syntiant Adopts Movellus' Clock Network for its Low-Power NDP120 Deep Learning Processor
• CEVA Moves to Standardize DSP-enabled Bluetooth Audio IP with New Bluebud Wireless Audio Platform for TWS Earbuds, Smartwatches and Wearables
• Samsung Foundry Certifies Synopsys IC Validator for 5nm and 4nm Advanced Process Technologies
• IAR Systems introduces 64-bit Arm core support in leading embedded development tools
• CEA-Leti & Dolphin Design Report FD-SOI Breakthrough that Boosts Operating Frequency by 450% and Reduces Power Consumption by 30%
• Chipus Joins FDXcelerator Program Bringing Ultra-Low-Power and Compact Power Management Solution for Hearables and Wearables
• Secure-IC and MosChip Announce Strategic Partnership to Provide Turnkey ASIC Solutions With Embedded Security for Edge Applications