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Thursday, February 18, 2021
ADAS and Its Unintended Consequences
Moschip Unveils Focused Strategy For Turn-Key ASIC Solutions
Sales of Logic ICs Account for Largest Share of China's IC Market in 2020
aicas and SiFive Bridge Flexibility and Performance with RISC-V, JamaicaVM Integration
Achronix and Logic Fruit Introduce IP Solutions for Test and Measurement Applications
Wednesday, February 17, 2021
Proposed Arm Buyout: Huang on So Many Levels
Mark Redford Named Vice President, Operations & Supply Chain for Palma Ceia SemiDesign - Former Arm Executive
SPARK Microsystems Announces CDN$17.5 Million Financing
PLDA Announces a Unique CXL Verification IP Ecosystem, Delivering Robust Verification That Reduces Time-to-Design for CXL 2.0 Applications
JEDEC Publishes DDR4 NVDIMM-P Bus Protocol Standard
Synopsys Posts Financial Results for First Quarter Fiscal Year 2021
Micro Magic, Inc. Delivers Ultra Low Power 64-Bit RISC-V Core
New Website Dedicated to Advancing PUF Security Technology
TSMC Will Raise to Expand Capacity Amid Chip Shortages
Enabling AI Vision at the Edge
Tuesday, February 16, 2021
Tech: Why TSMC is the world's most underestimated tech giant
New Automotive SoCs Provide a Window to ADAS Trends
Samsung Develops Industry's First High Bandwidth Memory with AI Processing Power
The Promise & Pitfalls of Open Hardware Development
Veriest Solutions and CEVA develop functional safety verification methodology for automotive devices
Renesas Develops Automotive SoC Functional Safety Technologies for CNN Accelerator Cores and ASIL D Control Combining World-Class Performance and Power Efficiency
Arteris IP Adds a Record 28 New Licensees in 2020
CEVA Appoints Jaclyn Liu to its Board of Directors; Bruce A. Mann Retires
Monday, February 15, 2021
Semiconductor Industry: TSMC Invests in Japan for 3D SoIC
SMIC unable to keep up with demand amid shortage and sanctions
La French Tech Unveils 2021 Startup Cohort
New SMUs to optimize battery life in IoT and semiconductors
Globalfoundries to manufacture secure chips for US DoD
ISSCC Plenary: A Bright Foundry Future
CHIPS Alliance Welcomes Antmicro and VeriSilicon to the Platinum Membership Level
CEVA, Inc. Announces Fourth Quarter and Year End 2020 Financial Results
Flex Logix EFLX eFPGA in design for GLOBALFOUNDRIES 22FDX
Objections grow to Nvidia-ARM deal
Imec Showcases World's First Sub-5mW, IEEE 802.15.4z Ultra-Wideband Transmitter Chip
Monday, February 15, 2021
Vitesse and Xilinx Demonstrate OIF Interoperability Enabling 10Gbps Ethernet at OFC 2003
Sunday, February 14, 2021
Silex Insight partners with Crypto Quantique to deliver end-to-end IoT security
5GNR L1/L2/L3 Phy+SW Stack IP available for SoC & FPGA Ue & gNodeB development
videantis passes milestone of enabling 10 million production vehicles
U.S. Department of Defense Partners with GLOBALFOUNDRIES to Manufacture Secure Chips at Fab 8 in Upstate New York
High Performance Computing Demand Puts Premium on Backend Engineering Expertise
Thursday, February 11, 2021
The Arm ecosystem ships a record 6.7 billion Arm-based chips in a single quarter
Comcores sells wireless assets to Analog Devices
Wednesday, February 10, 2021
Siemens and ADS deliver HDAP enablement solutions
TSMC to Raise $9 Billion for Expansion Amid Shortages
Fraunhofer IIS and intoPIX announce joint licensing program for JPEG XS
Lattice FPGAs with High I/O Density Bring Low Power Signal Bridging and Interface Management to Edge Devices
Israeli AI Chip Startup Raises Seed Funding
Tuesday, February 9, 2021
Arteris IP Adds Two Veteran Executives to its Board of Directors
Integrated solution for vehicle ethernet audio video bridging
Cloud-Native Processors for a Cloud-Native World
QuickLogic Launches Qomu - an Open Source SoC Dev Kit That Fits in Your USB Port
eTopus Technology Announces Innovative SerDes Technology for Data Center, Cloud, Edge, and 5G Base Stations
Tiempo Secure announces the availability of its Secure Element IP core on GF 22 FDX and TSMC 16 FFC
Top Five Wafer Capacity Leaders Raise Share of Global Capacity to 54%
Tuesday, February 9, 2021
TSMC Board of Directors Meeting Resolutions
Monday, February 8, 2021
European Semiconductor Sales Fell by 6% in 2020
CEA-Leti Announces EU Project to Create Dynamically Programmable Wireless 6G Environments
Renesas updates R-Car V3H with improved deep learning performance
Time sensitive networking is supporting Ethernet applications
TSMC to set up 3DIC material R&D center in Japan
UK government helps NWF develop GaN foundry process
Device Authority, EPS Global and Intrinsic ID Announce Strategic Partnership
Synopsys Receives Customers' Choice Award for Paper Presented at TSMC 2020 Open Innovation Platform Ecosystem Forum
Fraunhofer IPMS presents TSN IP core designs with low latency for automotive on-board networks
CHIPS Alliance Brings on Rob Mains as New Executive Director
TSMC January 2021 Revenue Report
Palma Ceia SemiDesign Expands Asia Team, Names Bo Liu Senior Director of Engineering in China
Gartner Says Apple and Samsung Extended Their Lead as Top Semiconductor Customers in 2020
Monday, February 8, 2021
Storage system based on WD 100Gb NVMe-oF Bridge ASIC with ePHY IP
Sunday, February 7, 2021
Preconfigured platforms connect IoT applications through the cloud
2021 Auto Industry Outlook: What Can We Expect from BEVs, Connected Cars & Software?
Synopsys Selected for Rapid Assured Microelectronics Prototypes Program
Renesas and Dialog Semiconductor to Join Forces to Advance Global Leadership in Embedded Solutions
Global Unichip Corporation and Flex Logix Achieve First-Time Working Silicon on Joint ASIC Development Using EFLX Embedded FPGA (eFPGA) IP
GUC Monthly Sales Report - Jan 2021
Rianta Releases 800G Optimized Single Channel Ethernet Controller IP Core
DVB-S2X Narrowband Demodulator / Decoder IP Core licensed to a leading US TV Semiconductor Company
Renesas to adopt Crypto Quantique's QuarkLink security platform as part of its microcontroller ecosystem for the IoT
UMC Reports Sales for January 2021
Saturday, February 6, 2021
Xanadu and CMC Microsystems to collaborate on quantum computing
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