Search News

Wednesday, February 3, 2021

• French Team on Route Towards an Interposer Prototype for Quantum And Control Chips Integration at Very Low Temperature
• Samsung to expand MRAM applications
• Total MPU Sales Surprise With Strong Gains in 2020, More Upside in 2021
• Xilinx Collaborates with Fujitsu to Support 5G Deployments in the US
• AWS and Arm Demonstrate Production-Scale Electronic Design Automation in the Cloud
• RISC-V Processor Designs Emerge
• Sondrel builds on 7nm design work to offer 5nm
• SiTune Introduces World's First 5G Infrastructure Transceiver Solutions
• IoT security platform delivers fast, comprehensive connectivity and device management for any root-of-trust
• Socionext Adopts TSMC's 5-nanometer Technology for Custom SoCs Targeting Next-Generation Automotive Applications
• SMIC Reports 2020 Fourth Quarter Results
• Arteris IP FlexNoC Interconnect and Resilience Package Supports Socionext's 5nm Automotive Chip Production
• Pulsic Delivers Real-Time, Accurate, Layout Previews to Analog Circuits Designers with the new Animate Preview
• Can Open Source Hardware Emulate Linux?
• Crypto Quantique Opens IoT Security Platform to Multiple RoTs
• Open Source: It's Not Just for Software Anymore

Tuesday, February 2, 2021

• RISC-V Processor Designs Emerge
• Top 10 IC Growth Categories Target Emerging Applications in 2021
• Xylon Announces Availability of Its 2.3 MP HDR Automotive Video Camera
• SmartDV 2020 Revenue Increases by 51%
• SCALINX, Semiconductor Fabless Focusing on Signal Conversion Chips Secures 10.5 Million Euros Funding
• Palo Alto Networks expands IoT security to healthcare
• Renesas Expands Low-Power Industrial and IoT Applications Reach With New RA4M2 MCU Group in Arm Cortex-Based MCU Family
• NXP Launches Flexible IoT Cloud Platform to Securely Manage and Connect Edge Devices
• CEA Is the First Research Center to Acquire A Cryogenic Prober for Testing Quantum Bits
• European project for commercial silicon quantum processor
• Italian startup for 3D chiplet package co-design
• Sondrel supports 5nm Samsung and TSMC nodes
• SCALINX, Semiconductor Fabless Focusing on Signal Conversion Chips Secures 10.5 Million Euros Funding

Monday, February 1, 2021

• ASIL-D DAQ system for automotive battery systems
• Siemens and MaRS partner to accelerate innovation for startups in development of autonomous and connected vehicles
• Open Source: It's Not Just for Software Anymore
• Custom graphics extensions boost RISC-V
• 2020 Global Silicon Revenue Remains Stable as Wafer Area Shipments Edge Up Despite COVID-19 Disruption
• LeapMind Announces Participation in Alliance Program of Xilinx, a Major US FPGA Innovator
• This is How Intel Gets Out of Manufacturing
• Intrinsic ID Reports Strong Growth in 2020 for Its Semiconductor Security Solution as COVID Accelerates Shift to Online Working and Learning
• Rambus Reports Fourth Quarter and Fiscal Year 2020 Financial Results

Sunday, January 31, 2021

• Samsung Electronics Interested in Acquiring Automotive Semiconductor Companies
• Imagination IP in Chinese AI integration
• Reports: NXP, Infineon top Samsung's shopping list
• PUFsecurity Crypto Co-processor PUFiot Passed NIST CAVP Certification
• Jieli joins TempowOS Chipset Partner Program
• Global Semiconductor Sales Increase 6.5% to $439 billion in 2020
• Siemens Digital Industries Software appoints new Senior Vice President and Managing Director for Asia Pacific region
• Synapse Design and Flex Logix Tape Out Mutual Customer ASIC on a New Process in Less Than a Year Using Embedded FPGA (eFPGA) Technology
• Imagination and PaddlePaddle announce collaboration to grow the ecosystem for artificial intelligence (AI) for developers worldwide
• Top-10 IC Growth Categories Target Emerging Applications in 2021
• Advanced DDR Memory Interface PHY's and Controllers IP Cores available in advanced process nodes including TSMC 7FFC
• AnalogX Announces World's Lowest Power SERDES IP in 7nm and 6nm and Expansion Plan

Thursday, January 28, 2021

• China aims to strengthen its semiconductor supply chain with new standards group that includes Huawei, SMIC

Wednesday, January 27, 2021

• IoT Everywhere
• Palma Ceia SemiDesign Announces PCS1100 Wi-Fi 6E 4x4:4 Transceiver
• Synopsys Demonstrates Silicon Proof of DesignWare 112G Ethernet PHY IP in 5nm Process for High-Performance Computing SoCs
• MPEG LA Announces Development of VVC (Versatile Video Coding) Pool License
• Xilinx Reports Third Quarter Fiscal Year 2021 Results
• Faraday Reports Fourth Quarter 2020 Revenues at NT$1,430 Million, 2020 Annual Revenues NT$5,495 Million, Mass Production Up 18% YoY
• EdgeQ Adds Former Qualcomm CEO Paul Jacobs & CTO Matt Grob as Advisors to Disrupt the Current Closed RAN Ecosystem with RISC-V based Highly Programmable 5G and AI Platform
• Intrinsic ID's QuiddiKey PUF Selected by Fungible in Drive to Secure Next Gen Data Centers
• Palma Ceia SemiDesign Announces PCS1100 Wi-Fi 6E 4×4:4 Transceiver
• Amber Solutions Closes 2020 With Series B Funding Totaling More Than $8.5 Million
• RV64X: A Free, Open Source GPU for RISC-V
• Adopt the intoPIX JPEG XS Plugin for Adobe Premiere and ease your live video workflow
• UMC profit surges on robust semiconductor demand

Tuesday, January 26, 2021

• PathPartner Announces PT605 System on Module (SoM) & Smart Camera Reference Design Kit based on Qualcomm® QCS605 SoC
• HDL Design House Partners with Marketing Platform AnySilicon
• North American Semiconductor Equipment Industry Posts December 2020 Billings
• Gowin Semiconductor Announces AEC-Q100 Automotive Grade FPGA Availability
• EvoNexus partners with Arm to Accelerate Launch of New Semiconductor Startups
• Synopsys Delivers Industry's First Integrity and Data Encryption Security IP Modules for PCI Express 5.0 and Compute Express Link 2.0 Specifications
• Mirabilis Design integrates Fast Functional Processors into VisualSim Architect to close the software design, development and validation loop
• Patent report highlights AI boom
• Edge AI SoC for smart tiny devices
• Korea's Presence in Automotive Semiconductor Market Hardly Noticeable
• Palma Ceia SemiDesign Names Robert Young Chief Technology Officer
• IC Insights Releases the New 2021 Edition of The McClean Report
• Andes Technology Corp. Announces EdgeQ to Deliver Converged 5G and AI Silicon Platform with AndesCore RISC-V License for the 5G Open Radio Access Network
• Flex Logix Pairs its InferX X1 AI Inference Accelerator with the High-Bandwidth Winbond 4Gb LPDDR4X Chip to Set a New Benchmark in Edge AI Performance

Monday, January 25, 2021

• The world is dangerously dependent on Taiwan for semiconductors
• 5G Mixes, Matches Memories
• U-blox Integrates Cellular and GNSS in a Single SiP
• CEA-Leti Reports Breakthrough High-Performance Gyroscope For Automotive, Aeronautic and Industrial Applications
• Imperas extends RISC-V processor verification ecosystem
• Edge AI company AlphaICs raises $8 million in funding round led by Emerald Technology Ventures and Endiya Partners
• USB 4.0, USB 3.2, USB 3.0, USB 2.0 Silicon Proven PHYs in TSMC, UMC & SMIC Foundries available from T2MIP
• CXL gathers speed with 2.0 spec

Sunday, January 24, 2021

• VSORA AD1028 Named "Best Processor IP" by The Linley Group
• SMIC urges China's chipmakers to embrace advanced packaging as Moore's Law slows nanometre node progress and US sanctions bite
• Imperas Leads The RISC-V Processor Verification Ecosystem
• KeyASIC Inked Technologies and IP Deal of RM21Mil
• Avery Design Announces CXL 2.0 VIP
• 2020 Activities, Outlook for 2021 & Update of the Financial Objectives: Kalray Aims to Become a European Champion in Intelligent Processors