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Thursday, January 21, 2021
eInfochips Wins Design Services Company of the Year Award from IESA
Wednesday, January 20, 2021
Samsung wins Intel foundry order; TSMC takes GPU deal
It's Time to Look at FD-SOI (Again)
Samsung Foundry Certifies Analog FastSPICE Platform from Siemens for Early Design Starts on 3nm GAA Process Technology
Foxconn and Winbond Make Strategic Investment in Kneron
Silvaco Acquires Physical Verification Solution Provider POLYTEDA CLOUD LLC
Arasan announces its Total eMMC IP solution for TSMC 22nm process
Faraday Unveils Complete Imaging and Display High-Speed Interface IP Set on UMC 28nm and 40nm Processes
MediaTek Launches 6nm Dimensity 1200 Flagship 5G SoC with Unrivaled AI and Multimedia for Powerful 5G Experiences
Tuesday, January 19, 2021
Nordic Development Kit provides easy access to AI and ML
Powerful FPGA Design Creation and Simulation IDE Adds VHDL-2019 Support & OSVVM Enhancements
Industry R&D Spending To Rise 4% After Hitting Record in 2020
Cadence to Acquire NUMECA to Expand System Analysis Capabilities with Computational Fluid Dynamics
Attopsemi Released White Paper "I-fuse - Most Reliable and Fully Testable OTP"
Monday, January 18, 2021
What's next for FPGA maker Achronix post-IPO?
CEA-Leti Reports Machine-Learning Breakthrough That Opens Way to Edge Learning
Sondrel Selects Synopsys Fusion Design and Verification Platforms to Displace Legacy Design Tools
Renesas Launches New General-Purpose 64-Bit RZ/G2L Group of MPUs with Latest Arm Cortex-A55 for Improved AI Processing
Dual Mode Bluetooth v5.2 SW Link Layer, Protocol Stack SW, Profiles licensed for ultra-low power 22nm True Wireless (TWS) Earbuds SoC
Sunday, January 17, 2021
Protocol and Interface Agnostic Universal D2D Controller for HPC and Chiplets
TSMC's Massive Investment Plan Gives Samsung Electronics Plenty to Ponder on
Intel outsources Core i3 to TSMC's 5nm process
PLDA Announces XpressLINK-SOC CXL Controller IP with Support for the AMBA CXS Issue B Protocol
TSMC Boosts Capital Expenditure Budget on Strong Outlook
DCD With EBBM in USA & Greece
Thursday, January 14, 2021
USB 3.2: A USB Type-C Challenge for SoC Designers
Wednesday, January 13, 2021
China tech firm releases the world's first RISC-V structured PC
Jim Keller joins Tenstorrent as President and CTO.
Qualcomm to Acquire NUVIA
TSMC to Kick off Mass Production of Intel CPUs in 2H21 as Intel Shifts its CPU Manufacturing Strategies, Says TrendForce
Andes Technology and Rafael Microelectronics Announce a Strategic Partnership to Provide High Power Efficiency Wireless IP Solutions for IoT Devices
Gartner Says Worldwide Semiconductor Revenue Grew 7.3% in 2020
Chips&Media Adds Extraordinary Features in the Next-Generation Video Codec IPs, introducing the WAVE6 Series
TSMC Reports Fourth Quarter EPS of NT$5.51
BeagleBoard.org and Seeed Introduce the First Affordable RISC-V Board Designed to Run Linux
Intel Appoints Tech Industry Leader Pat Gelsinger as New CEO
Ginger Lee Named Chief Financial Officer for Palma Ceia SemiDesign
Semiconductor Industry: Continuous Semiconductor Supply Shortage
SOI Industry Consortium Joins SEMI as Strategic Association Partner
Arasan Announces the Immediate Availability of its 2nd Generation MIPI D-PHY v1.1 IP for TSMC 22nm Process Technology
Tuesday, January 12, 2021
Alibaba, Tencent and Baidu spared from US investor blacklist
AMD's Xilinx Acquisition Moves Forward As Regulatory Waiting Period Expires
Syntiant Surpasses Milestone of 10 Million Processors Shipped
Netflix Now Streaming xHE-AAC Audio on Android Mobile
Arm's powerful compute and graphics platform at the heart of the new Samsung Exynos 2100
Value of Semiconductor Industry M&A Agreements Sets Record in 2020
Monday, January 11, 2021
SEGGER introduces new Open Flashloader for direct programming of any RISC-V system
CEVA Extends its Leadership in High Performance Scalable Sensor Hub DSPs with 2nd Generation SensPro Family
Secure-IC And Menta Co-Develop Solution To Optimize Embedded Cybersecurity
Arteris IP FlexNoc Interconnect and Resilience Package Licensed by Hailo for Artificial Intelligence (AI) Chip
Synopsys and Socionext Expand Collaboration to Deploy HBM2E IP for 5-Nanometer Process in AI and High-Performance Computing SoCs
Sunday, January 10, 2021
Ambarella introduces CV5 high performance AI vision processor for single 8K and multi-imager AI cameras
Wi-Fi Alliance Wi-Fi predictions for 2021
DSP Concepts and Cambridge Consultants work to accelerate audio and voice innovation
Official Commercial Launch of Efficiera Ultra-Low Power AI Inference Accelerator IP Core
ESD Alliance Reports Strong Electronic Design Automation Industry Revenue Growth for Q3 2020
Flex Logix Appoints Dana McCarty as Vice President of Sales and Marketing for AI Inference Products
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