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Thursday, January 21, 2021

• eInfochips Wins Design Services Company of the Year Award from IESA

Wednesday, January 20, 2021

• Samsung wins Intel foundry order; TSMC takes GPU deal
• It's Time to Look at FD-SOI (Again)
• Samsung Foundry Certifies Analog FastSPICE Platform from Siemens for Early Design Starts on 3nm GAA Process Technology
• Foxconn and Winbond Make Strategic Investment in Kneron
• Silvaco Acquires Physical Verification Solution Provider POLYTEDA CLOUD LLC
• Arasan announces its Total eMMC IP solution for TSMC 22nm process
• Faraday Unveils Complete Imaging and Display High-Speed Interface IP Set on UMC 28nm and 40nm Processes
• MediaTek Launches 6nm Dimensity 1200 Flagship 5G SoC with Unrivaled AI and Multimedia for Powerful 5G Experiences

Tuesday, January 19, 2021

• Nordic Development Kit provides easy access to AI and ML
• Powerful FPGA Design Creation and Simulation IDE Adds VHDL-2019 Support & OSVVM Enhancements
• Industry R&D Spending To Rise 4% After Hitting Record in 2020
• Cadence to Acquire NUMECA to Expand System Analysis Capabilities with Computational Fluid Dynamics
• Attopsemi Released White Paper "I-fuse - Most Reliable and Fully Testable OTP"

Monday, January 18, 2021

• What's next for FPGA maker Achronix post-IPO?
• CEA-Leti Reports Machine-Learning Breakthrough That Opens Way to Edge Learning
• Sondrel Selects Synopsys Fusion Design and Verification Platforms to Displace Legacy Design Tools
• Renesas Launches New General-Purpose 64-Bit RZ/G2L Group of MPUs with Latest Arm Cortex-A55 for Improved AI Processing
• Dual Mode Bluetooth v5.2 SW Link Layer, Protocol Stack SW, Profiles licensed for ultra-low power 22nm True Wireless (TWS) Earbuds SoC

Sunday, January 17, 2021

• Protocol and Interface Agnostic Universal D2D Controller for HPC and Chiplets
• TSMC's Massive Investment Plan Gives Samsung Electronics Plenty to Ponder on
• Intel outsources Core i3 to TSMC's 5nm process
• PLDA Announces XpressLINK-SOC CXL Controller IP with Support for the AMBA CXS Issue B Protocol
• TSMC Boosts Capital Expenditure Budget on Strong Outlook
• DCD With EBBM in USA & Greece

Thursday, January 14, 2021

• USB 3.2: A USB Type-C Challenge for SoC Designers

Wednesday, January 13, 2021

• China tech firm releases the world's first RISC-V structured PC
• Jim Keller joins Tenstorrent as President and CTO.
• Qualcomm to Acquire NUVIA
• TSMC to Kick off Mass Production of Intel CPUs in 2H21 as Intel Shifts its CPU Manufacturing Strategies, Says TrendForce
• Andes Technology and Rafael Microelectronics Announce a Strategic Partnership to Provide High Power Efficiency Wireless IP Solutions for IoT Devices
• Gartner Says Worldwide Semiconductor Revenue Grew 7.3% in 2020
• Chips&Media Adds Extraordinary Features in the Next-Generation Video Codec IPs, introducing the WAVE6 Series
• TSMC Reports Fourth Quarter EPS of NT$5.51
• BeagleBoard.org and Seeed Introduce the First Affordable RISC-V Board Designed to Run Linux
• Intel Appoints Tech Industry Leader Pat Gelsinger as New CEO
• Ginger Lee Named Chief Financial Officer for Palma Ceia SemiDesign
• Semiconductor Industry: Continuous Semiconductor Supply Shortage
• SOI Industry Consortium Joins SEMI as Strategic Association Partner
• Arasan Announces the Immediate Availability of its 2nd Generation MIPI D-PHY v1.1 IP for TSMC 22nm Process Technology

Tuesday, January 12, 2021

• Alibaba, Tencent and Baidu spared from US investor blacklist
• AMD's Xilinx Acquisition Moves Forward As Regulatory Waiting Period Expires
• Syntiant Surpasses Milestone of 10 Million Processors Shipped
• Netflix Now Streaming xHE-AAC Audio on Android Mobile
• Arm's powerful compute and graphics platform at the heart of the new Samsung Exynos 2100
• Value of Semiconductor Industry M&A Agreements Sets Record in 2020

Monday, January 11, 2021

• SEGGER introduces new Open Flashloader for direct programming of any RISC-V system
• CEVA Extends its Leadership in High Performance Scalable Sensor Hub DSPs with 2nd Generation SensPro Family
• Secure-IC And Menta Co-Develop Solution To Optimize Embedded Cybersecurity
• Arteris IP FlexNoc Interconnect and Resilience Package Licensed by Hailo for Artificial Intelligence (AI) Chip
• Synopsys and Socionext Expand Collaboration to Deploy HBM2E IP for 5-Nanometer Process in AI and High-Performance Computing SoCs

Sunday, January 10, 2021

• Ambarella introduces CV5 high performance AI vision processor for single 8K and multi-imager AI cameras
• Wi-Fi Alliance Wi-Fi predictions for 2021
• DSP Concepts and Cambridge Consultants work to accelerate audio and voice innovation
• Official Commercial Launch of Efficiera Ultra-Low Power AI Inference Accelerator IP Core
• ESD Alliance Reports Strong Electronic Design Automation Industry Revenue Growth for Q3 2020
• Flex Logix Appoints Dana McCarty as Vice President of Sales and Marketing for AI Inference Products