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Wednesday, December 23, 2020

• Chip Startups are Gaining Traction in Auto Industry
• United States, Europe and China Leading AI Development

Tuesday, December 22, 2020

• iWave Unveils the Implementation of ARINC 818-2 IP Core On Microsemi PolarFire FPGA
• WiLAN Subsidiary Acquires Substantial Patent Portfolio from MediaTek
• North American Semiconductor Equipment Industry Posts November 2020 Billings
• New iPhone Models Become Key to Qualcomm's Top Spot in 3Q20 Revenue Ranking of Global Top 10 IC Design (Fabless) Companies, Says TrendForce

Monday, December 21, 2020

• Top deals in 2020

Sunday, December 20, 2020

• Rianta Releases AES Crypto and HMAC Acceleration ASIC IP Cores
• Retune DSP's Wake Word Engine Now Available for CEVA Audio/Voice DSPs
• MosChip Technologies Achieves ISO 9001:2015 Certification
• Creonic Participates in Horizon 2020 EPIC Research Project

Thursday, December 17, 2020

• Global semiconductor shortage puts pressure on tech supply chain
• CEA-Leti Scientists Present In-Memory Computing Pathways for Edge-AI & Neural Networks with 3D Architectures & Resistive-RAM
• SMIC Undergoes Management Team Shakeup – Again
• What To Expect From the IC Industry in 2021
• Latest Release of Lattice sensAI Solutions Stack Delivers up to 6X Performance Boost on Award-Winning CrossLink-NX FPGAs
• Secure-IC announces the availability of its protection technologies in the cloud

Wednesday, December 16, 2020

• 5 Companies Owned by Nvidia
• France awards Soitec-led European consortium for semiconductor innovation
• SK Hynix's Foundry in China Starts Volume Production
• IAR Systems enables Linux-based Continuous Integration and automated workflows for RISC-V
• AWS Deploys Synopsys VCS on Arm-based AWS Graviton2 to Accelerate SoC Development
• Xiphera contributes to Linux kernel
• Andes Technology Passes DUNS Registered Certificate
• Mentor Finally Becomes Siemens EDA From January 2021
• Nimbix Announces First Multi-cloud HPC Platform With Support For Arm
• AccelerComm join the O-RAN ALLIANCE to improve interoperability and maximize spectral efficiency
• SMIC Management Team Undergoes Shakeup - Yet Again
• Probing the Apple M1's Hidden Depths
• Samsung Foundry Certifies Cadence System Analysis and Advanced Packaging Design Tool Flow for 2.5/3D Chip Designs

Tuesday, December 15, 2020

• China's No 1 chipmaker SMIC gives ex-TSMC veteran top role, highlighting need for pragmatism amid push for home-grown tech
• The Electric Vehicles Are Coming!
• AIStorm Raises $16M in Oversubscribed Series B Funding to Commercialize AI-in-Sensor Chips
• Vulkan SDK, Tools and Drivers are Ray Tracing Ready
• UVM Reference Implementation Aligned with IEEE 1800.2-2020 Standard
• Sofics and Hardent join Mixel's MIPI ecosystem to provide designers a complete MIPI solution

Monday, December 14, 2020

• SensiML Introduces Free Community Edition of Analytics Toolkit
• Platform combines low-power SoC with energy-efficient AI software
• CEA Combines 3D Integration Technologies & Manycore Architectures to Enable High-Performance Processors for Exascale
• Xenergic's SRAM For Next Generation Of Ultra-Low Power Products
• Eta Compute Closes $12.5 Million Series C Funding Led By Synaptics

Sunday, December 13, 2020

• Redtree Solutions offers Agile Analog IP across Europe
• RISC-V And Marvell Technologies Advances Enable Storage Solutions
• Mentor changes its name to Siemens EDA
• Time holds the key to 6G
• Omni Design Augments Partnership to Accelerate Product Development
• Mass production of CoreHW RF Switch has started
• CORE-v CVE4 RTL Freeze Milestone Achieved
• Synthara targets breakthrough edge-AI chips with support from a global coalition of investors and R&D partners
• Cartesiam Transforms Edge AI Development for Industrial IoT
• Nextera Video and Adeas Announce SDI Core, SMPTE ST 2022-8, and NMOS IS-09 as the Latest Additions to their Industry-Leading SMPTE ST 2110 Video over IP FPGA Core Set
• Lattice Propel Accelerates Time-to-Market for Embedded Processor-based Designs on Latest Nexus Platform FPGAs
• Blaize Delivers First Open and Code-free AI Software Platform Spanning the Entire Edge AI Application Lifecycle
• Telechips selects the latest Arm IP for its next-generation automotive SoC