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Thursday, December 12, 2024

• India's Semiconductor revolution: Opportunities for engineers
• Innovation and Collaboration: Powering Sustainable Exponential Growth

Thursday, December 12, 2024

• European Night: Celebrating European tech innovators at CES 2025

Wednesday, December 11, 2024

• Marvell partners with Micron, Samsung, and SK hynix on custom HBM
• TrendForce: Advanced Processes, Chinese Policies Drive 3Q 2024 Global Top 10 Foundry Revenue to Record Highs
• Silicon industry veteran Oreste Donzella joins Sondrel board as Non-Executive Director
• MosChip selects Cadence tools for the design of HPC Processor "AUM" for C-DAC
• Powering the NVM and Embedded Chip Security Technologies
• BBright Expands Ultra HD Capabilities with intoPIX JPEG XS Technology in its V2.2 Decoder Platform
• BOS and Tenstorrent Unveil Eagle-N, Industry's First Automotive AI Accelerator Chiplet SoC

Wednesday, December 11, 2024

• MosChip selects Cadence tools for the design of HPC Processor “AUM” for C-DAC

Tuesday, December 10, 2024

• Democratizing Chiplets
• TSMC founder: Intel should have prioritized AI over foundry
• Nordic's Thingy prototypes IoT products
• PIMIC Unveils Business Strategy, and Silicon Technology to Revolutionize AI at the Edge
• Jmem Tek and Andes Technology Partner on the World' s First Quantum-Secure RISC-V Chip
• Synopsys Announces Industry's First Ultra Ethernet and UALink IP Solutions to Connect Massive AI Accelerator Clusters
• Cadence and Rapidus Collaborate on Leading-Edge 2nm Semiconductor Solutions for AI and HPC Applications
• Quobly announces key milestone for fault-tolerant quantum computing
• CEA-Leti Demonstrates Embedded FeRAM Platform Compatible with 22nm FD-SOI Node
• MosChip selects Cadence tools for the design of HPC Processor "AUM" for C-DAC

Monday, December 9, 2024

• Rapidus Collaborates with Synopsys to Shorten Semiconductor Design Cycles
• UMC's Collaboration with Suppliers to Build a Sustainable Supply Chain Contributes to 2.64 Million Tons of Carbon Reduction
• ST rolls out AI-microcontroller family
• Rambus and Micron Technology Extend Patent License Agreement
• Crypto Quantique upgrades QuarkLink IoT device security platform for post-quantum cryptography (PQC)
• Comprehensive ADC/DAC and AFE IP Solutions: Enabling Next-Generation Applications Across Varying Technology Nodes
• TSMC November 2024 Revenue Report
• Micon Global Selected as Sales Representative for Blue Cheetah Analog Design

Sunday, December 8, 2024

• Samsung foundry 'relief pitcher' Han Jin-man vows to improve 2-nm yields
• Arasan Announces immediate availability of its SPMI IP (System Power Management Interface)
• Sondrel now shipping chips as part of a complete turnkey project
• Avant Technology Appointed as Sales Representative in Asia for EnSilica's eSi-Crypto IP
• UPMEM selects Semidynamics RISC-V AI IP for Large Language Model Application

Thursday, December 5, 2024

• Secure-IC wins KES Innovation Award 2024
• GlobalFoundries Receives Funding to Accelerate GaN Chip Manufacturing
• TSMC Achieves New Milestone With Its 2nm Process, As Trial Production Yields Exceed 60 Percent, Which Was Better Than Expected
• TSMC to Begin Mass Production of 2nm Chips Next Year
• CXL Consortium Announces Compute Express Link 3.2 Specification Release
• Alphawave IP - Announcement regarding leadership transition
• Synopsys Posts Financial Results for Fourth Quarter and Fiscal Year 2024
• Global Semiconductor Sales Increase 22.1% Year-to-Year in October; Annual Sales Projected to Increase 19.0% in 2024
• UMC Reports Sales for November 2024
• Qualitas Semiconductor's MIPI D-PHY IP Powers Mass Production of Renesas AI MPU

Thursday, December 5, 2024

• Samsung Press Conference at CES 2025 'AI for All: Everyday, Everywhere'

Wednesday, December 4, 2024

• Imagination PowerVR Driver Being Extended To Work On RISC-V
• Intel Foundry Fails To Impress Once Again, 18A Process "Yield Rates' Are Reported To Be Only 10% Making Mass-Production Impossible
• YorChip and Digitho developing breakthrough 2D Chiplet Packaging for Mass Markets
• Advanced Processes and Chinese Policies Drive 3Q24 Global Top 10 Foundry Revenue to Record Highs, Says TrendForce
• Ceva-NeuPro-Nano Wins Product of the Year Award at Prestigious EE Awards Asia Event
• GUC Monthly Sales Report - November 2024

Wednesday, December 4, 2024

• Alphawave Semi Joins UALinkâ„¢ Consortium to Accelerate High-Speed AI Connections

Tuesday, December 3, 2024

• TSMC's Role In Shaping the Global Semiconductor Landscape: Trends And Innovations for 2025
• SiFive Empowers AI at Scale with RISC-V Innovation
• Soitec and Globalfoundries Collaborate in the Production of High-Performance Rf-Soi Semiconductors
• Silvaco Joins SMART USA Institute to Propel Digital Twin Innovations Under CHIPS Manufacturing USA Program
• Now Gelsinger is gone, what is Intel's Plan B?
• Kudelski IoT and PUFsecurity Combine IoT Security Strengths to Meet the Challenges of Increasing Global Regulation
• Comcores Announces Availability of its Ultra-Compact Ethernet TSN End Station Controller IP for Automotive Networks
• AST SpaceMobile and Cadence Collaborate to Advance the World's First and Only Planned Space-Based Global Cellular Broadband Network
• Alphawave Semi Joins UALink™ Consortium to Accelerate High-Speed AI Connections
• X-FAB Releases Embedded Flash Solution on its 110nm Automotive BCD-on-SOI Technology

Tuesday, December 3, 2024

• SK Hynix to produce HBM4 on 3 nm foundry process in 2025

Monday, December 2, 2024

• Europe's chip market shrinks as WSTS trims forecasts for 2025
• SmartDV Licenses SDIO IP Family to Ranix for V2X Products
• Marvell Unveils Industry's First 3nm 1.6 Tbps PAM4 Interconnect Platform to Scale Accelerated Infrastructure
• Post-Quantum Cryptography: Moving Forward
• Intel CEO's Departure Leaves Top U.S. Chipmaker Adrift
• Allegro DVT Launches TV 3.0 Test Suite for Brazil's Next Generation Digital Terrestrial Television System
• Arteris Deployed by Menta for Edge AI Chiplet Platform
• Comprehensive ADC/DAC and AFE IP Solutions: Empowering Next-Gen Applications Across Diverse Technology Nodes

Sunday, December 1, 2024

• IP players prominent in chiplet's 2024 diary
• TSMC 2024 Supply Chain Management Forum Presents Awards to Outstanding Suppliers
• TSMC's Path to Semiconductor Foundry Leadership: Insights from Morris Chang's Memoir
• Tenstorrent closes $693M+ of Series D funding led by Samsung Securities and AFW Partners
• Intel Announces Retirement of CEO Pat Gelsinger