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Thursday, November 26, 2020

• China moves closer to self-reliance in 7nm chip production
• TSMC confirms 3nm tech for 2022, could enable epic 80 billion transistor GPUs

Wednesday, November 25, 2020

• SMIC gets massive orders- customer demand is strong
• intoPIX demos newest compression technologies shaping the future of lossless quality wired/wireless transmission: 4K/8K JPEG XS, TICO-RAW and FlinQ - lowest latency & power, highest quality
• IAR Systems delivers extended optimization and trace capabilities for RISC-V development
• intoPIX demos newest compression technologies shaping the future of lossless quality wired/wireless transmission : 4K/8K JPEG XS, TICO-RAW and FlinQ - lowest latency & power, highest quality
• Faraday Supplies 28eHV Memory Compilers for Mobile OLED Display Driver IC
• Innatera raises EUR 5M to bring neuromorphic intelligence to the sensor-edge
• The Growing Market for Specialized Artificial Intelligence IP in SoCs

Tuesday, November 24, 2020

• TSMC adopts 3D stacking tech for chips along with Google and AMD
• SK Telecom develops AI processor
• proteanTecs CEO to present Universal Chip Telemetry™ at the Taiwan Semiconductor Executive Summit (TSES)
• China to spend $165bn on 5G
• TSMC's 3 nm plant in southern Taiwan reaches construction milestone
• Gyrfalcon Launches AI-X: Full-Stack Solution for Edge-AI Development

Monday, November 23, 2020

• IRIS Switzerland Adopts Silvaco TCAD Software for the Development of Photodiodes for Autonomous Driving Applications
• 5G and eSIM technologies will help grow industrial IoT connections to 37b by 2025
• 3 Basic Facts About Automotive Sensor Degradation
• Taiwan Semiconductor Research Institute signs access deal with Arm
• Intel to Keep Its Number One Semiconductor Supplier Ranking in 2020

Sunday, November 22, 2020

• AI Accelerator Targets Video Analytics at the Edge
• Beyond 5G – Is it time to start thinking about 6G?
• Mythic launches industry-first AI analog matrix processor
• North American Semiconductor Equipment Industry Posts October 2020 Billings
• Audio Weaver + TalkTo reference design now available on Qualcomm QCS400 series of audio System-on-Chips (SoCs)
• China TSMC Rival HSMC Runs Out of Cash, Ex-CEO Says
• CEVA's Bluetooth Low Energy 5.2 Platform is First IP to Receive Bluetooth SIG Qualification

Saturday, November 21, 2020

• U.S.-Taiwan dialogue prioritizes cooperation in semiconductor sector

Thursday, November 19, 2020

• Coventor and CMC Microsystems expand collaboration to further enable innovation in semiconductor and microsystem technology development
• Wi-Fi HaLow Reference Platform Available from Palma Ceia SemiDesign

Wednesday, November 18, 2020

• Synopsys Acquires Precision Optical Measurements Provider LIGHT TEC
• Arm Expands microNPU IP for Application Processors
• Xilinx Collaborates With Texas Instruments to Develop Energy Efficient 5G Radio Solutions
• AI Startup Deep Vision Powers AI Innovation at the Edge
• Ferroelectric Memory GmbH (FMC) Raises $20 Million to Accelerate Next-Generation Memory for AI, IoT, Edge Computing, and Data Center Applications
• Secure Thingz supports next-generation Secure Install technologies for IP Protection and malware prevention
• Mentor joins Nano 2022 R&D program to foster innovation in semiconductor design and verification

Tuesday, November 17, 2020

• 18 New AI Startups in France in 2020 vs. 120 in 2019
• SiMa.ai Adopts Arm Technology to Deliver a Purpose-built Heterogeneous Machine Learning Compute Platform for the Embedded Edge
• Introducing new Arm Roadmap Guarantee and other Arm IoT initiatives for accelerating Endpoint AI
• Dialog launches partner programme for its open industrial IoT edge server
• Foundry Revenue Expected to Increase by 23.8% YoY in 2020, with Advanced Nodes and 8-Inch Capacities Being Key to Industry Competitiveness in 2021, Says TrendForce
• Fugaku Tops Supercomputer Rankings Again as Arm HPC Ecosystem Expands
• First Intel Structured ASIC for 5G, AI, Cloud and Edge Announced
• Wafer Capacity by Feature Size Shows Strongest Growth at <10nm
• Bouffalo Lab Standardizes on SiFive RISC-V Embedded CPU Core IP for New IoT Products
• BrainChip Appoints Todd Vierra Director of Technical Sales

Monday, November 16, 2020

• Dialog Semiconductor Introduces SmartServer™ IoT Partner Ecosystem for Edge Solutions in Smart Buildings and Factories
• NTLab joined Samsung Foundry IP Ecosystem
• Kandou can do more with $92.3 million
• NXP, AWS create cloud platform for vehicle data services
• Arteris IP Achieves Major Milestone: 150th Licensee
• Kandou Raises $92.3 Million in Series C Funding
• GUC Die-to-Die (D2D) Total Solution Opening the New Era of Flagship SoC
• Ultra-low power GNSS Multi-Constellation Digital IP Core licensed to a European Semiconductor company for battery powered IOT & Wearable applications
• Marvell Announces Industry's First 112G 5nm SerDes Solution for Scaling Cloud Data Center Infrastructure

Sunday, November 15, 2020

• First steps to European multicore RISC-V chip for space
• Alibaba's Ultra High-Performance Superscalar Processor - XuanTie910
• Apple M1 Processor, Passing on the Chiplets
• SimpleMachines, Inc. Debuts First-of-its-Kind High Performance Chip
• BrainChip Demonstrates How Its Akida Technology Is Delivering the Next-Generation of AI at the Edge at First-Ever AI Field Day
• Lattice Expands Radiant Software Tool Capabilities