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Wednesday, November 11, 2020
Nestwave Recognized for IoT Innovation in 2020 Mobile Breakthrough Awards Program
Google Partners with SkyWater and Efabless to Enable Open Source Manufacturing of Custom ASICs
Silvaco Acquires Memory Compiler Technology of Dolphin Design SAS
Xilinx and Samsung Deliver Industry's First Adaptable Computational Storage Drives
CXL Consortium Releases Compute Express Link 2.0 Specification
Lattice Accelerates Development of Low Power FPGA-Based Custom Solutions with Lattice Design Group
De-RISC first anniversary, a H2020 project which will create the first RISC-V, fully European platform for space
Efinix Announces Trion Titanium Tapeout at TSMC 16 nm Process Node
CEVA's High-Performance DSP Solution to Power Renesas' Next-Generation Automotive SoC
Synopsys Acquires In-chip Monitoring Solutions Leader Moortec
Vidatronic Achieves up to 10X Speedup Using the Cadence Spectre X Simulator
Faraday's 22nm Fundamental IP Adopted for Intelligent IoT Devices
Imagination launches multi-core IMG Series4 NNA - the ultimate AI accelerator delivering industry-disruptive performance for ADAS and autonomous driving
Time-Sensitive Networking Market is Projected to Reach USD 1 Billion by 2026
Solving the problem of growing ASIC respins
Hyundai Embraces Nvidia for Future Fleet AI, IVI Services
CEA-Leti, Intel Expand Collaboration on 3D Packaging
Tuesday, November 10, 2020
Sound United Adds MPEG-H 3D Audio format to Denon & Marantz Home Theater Components
TSMC October 2020 Revenue Report
Advanced Packaging: Interview with Intel's Ramune Nagisetty
Monday, November 9, 2020
Korea's Semiconductor Exports to China Increasing
TSMC to spend US$3.5b on Arizona subsidiary
Kameleon Security and Xilinx Collaborate on New Cybersecurity Solution for Servers, Cloud Computing and Data Centers
Avery Design Debuts QEMU Virtual Host to SystemVerilog PCIe VIP HW-SW Co-simulation Solution for Pre-silicon System-level Simulation of NVMe SSD and PCIe Designs
PLDA Announces CXL 2.0 Support in their XpressLINK Family of CXL Controller IP
Graphcore leverages multiple Mentor technologies for its massive, second-generation AI platform
Synopsys Announces Industry's First CXL 2.0 VIP Solution for Breakthrough SoC Performance
Pinnacle Imaging Systems Announces Denali 3.0 ISP
Silex Insight delivers state-of-the-art security features to the award-winning Secure Vault technology from Silicon Labs
CAST Releases MIPI I3C Basic Slave Controller IP Core
Sunday, November 8, 2020
MosChip Technologies appoints Semiconductor Business Veteran, Swamy Irrinki As "Vice President of Marketing and Business Development" to Oversee and Drive Continued Business Growth
Cadence Achieves Industry-First ASIL B(D) Compliance Certification for Automotive Radar, Lidar and V2X DSP IP
UMC Reports Sales for October 2020
European Processor Initiative: Second year of activities
Thursday, November 5, 2020
Open-Source RISC-V ISA Offers More
CEVA SenslinQ Platform Wins 2020 ASPENCORE World Electronics Achievement Award
Driven by Accelerating Demand for Leading 5G RF Solutions, GLOBALFOUNDRIES and Soitec Announce RF-SOI Wafer Supply Agreement
Learn the Latest on RISC-V and Vector Processing at All Six Andes Technology Corporation's Presentations at the 2020 RISC-V Summit
Wednesday, November 4, 2020
Advanced packaging to have 31% CAGR 2019-25
GUC Monthly Sales Report - Oct 2020
New Wave Design and Verification Appoints New President
PLDA XpressSWITCH IP for PCIe technology first ever switch soft IP to pass PCI-SIG's PCIe 4.0 compliance tests
eMemory NeoFuse IP Qualified on GLOBALFOUNDRIES Advanced High Voltage Platform for OLED Applications
CEVA, Inc. Announces Third Quarter 2020 Financial Results
5G and Interconnect Are Pushing Innovations in Wireless
Tuesday, November 3, 2020
300mm Fab Spending to Boom Through 2023 With Two Record Highs, SEMI Reports
China to Expand Its Semiconductor Industry
Taiwan's TSMC begins hiring drive for its US foundry
Virtual electronica: Focus on Technical Trends and Innovations
How AI Impacts Memory & Interconnect Technology
Arm has launched a CPU monster that will get Intel and AMD very worried
Telink TLSR9 Wireless Audio & IoT RISC-V SoC integrates RISC-V DSP/SIMD P-extension
CEA-Leti today announced a new collaboration with Intel on advanced 3D and packaging technologies for processors to advance chip design.
Samsung Elec to fully employ 5-nano process to make own phones and others
28FDSOI "SoC White Box" SERDES & Controller IPs' are available for immediate licensing
Arteris IP FlexNoC Interconnect Products Licensed by Bosch for Multiple Automotive Chips
Imagination's new BXS GPU enables automotive graphics in Texas Instruments processor family
55 BCDLite Solution Positions GLOBALFOUNDRIES for Continued Leadership in Audio Amplifiers for Mobile Devices
Monday, November 2, 2020
Rambus Announces New Stock Repurchase Program
Cadence Wins Four 2020 TSMC OIP Partner of the Year Awards
Xylon Announces a New Version of logiVIEW Multiview 3D Video Transformation Engine IP Core
Movellus Joins GLOBALFOUNDRIES Ecosystem Program, as Partner Providing Application-Optimized PLLs, DLLs, & Comprehensive Clocking Solutions
Rambus Reports Third Quarter 2020 Financial Results
NeuLinker Licenses Codasip Bk5 and Studio for Powering Innovative AI and Blockchain Solutions
Inaccel announces record-breaking speed on facial detection test using an FPGA cluster
Aldec Introduces Hardware Assisted RTL Simulation Acceleration for Microchip FPGA Designs
Sunday, November 1, 2020
Telink and Andes Announce the TLSR9 SoC with RISC-V Processor
Silicon Wafer Shipments Slip in Third Quarter 2020 but Strong for Year
Q3 Global Semiconductor Sales Increase 11 Percent Compared to Q2
Sondrel announces tape-out of its largest chip design
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