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Wednesday, October 28, 2020
QuickLogic Joins Samsung SAFE IP Partner Program
Marvell to Acquire Inphi - Accelerating Growth and Leadership in Cloud and 5G Infrastructure
Mentor's High Density Advanced Packaging solution certified for Samsung Foundry's most advanced packaging process
intoPIX releases a new range of 8K TICO-XS IP-cores supporting the JPEG XS standard
Cadence Custom/AMS Flow Certified for the Samsung Foundry 3nm Advanced Process Technology for Early Design Starts
Realtek Semiconductor Selects Allegro DVT's H.266/VVC Compliance Streams
SDR RF IP, 100MHz-2.6GHz, for ultra-low power applications from IoT, M2M to 5G available from T2MIP
Tuesday, October 27, 2020
What Can Taiwan's Semiconductor Industry Learn From Japan?
Samsung and VeriSilicon Enable Blaize to Meet Aggressive Time-to-Market Goals for New AI Edge Processor
World's fastest 64bit RISC-V core claims 5GHz speed
Samsung Foundry Adopts Real Intent Meridian CDC for Clock Domain Crossing Sign-off
Rambus IPsec Packet Engine Secures 5G Networking at 10 Gbps
Floadia Raises 1.2 Billion Yen to Develop New Memory Technology That Can Be Disruptor in AI Edge Computing
Analog Bits Announces Analog IP Availability on Samsung Technologies
QuickLogic Announces the ArcticPro 3 eFPGA IP for Samsung 28FDS Process
Truechip Adds New Customer Shipments of Verification IPs For RISC-V Family Including TileLink
DRAM Price Erosion Expected Through the End of 2020
Synopsys and Samsung Release Certified 3nm Gate-All-Around AMS Design Reference Flow for Early Design Starts
Flex Logix Announces Availability and Roadmap of InferX X1 Boards and Software Tools
Synopsys and Samsung Foundry Collaboration Delivers Optimized Reference Methodology for High-Performance Compute Designs
Xilinx Introduces Breakthrough Zynq RFSoC DFE for Mass 5G Radio Deployments
Monday, October 26, 2020
TSMC top patent applicant in Taiwan for sixth straight quarter
Synopsys Expands Portfolio of Automotive VDKs with Support for Infineon's AURIX TC4xx 32-bit Microcontroller Family
Mixel MIPI D-PHY IP Integrated Into Hercules Microelectronics Award-Winning FPGA/Processor
Cortus Announces the Opening of another New Design Centre in Meyreuil (France)
AMD to Acquire Xilinx, Creating the Industry's High Performance Computing Leader
Sunday, October 25, 2020
EvoNexus and GLOBALFOUNDRIES Team to Accelerate Growth of Wireless and IoT Startups
Nvidia-Arm Deal a Boon for RISC-V?
China Forecast to Represent 22% of the Foundry Market in 2020
GlobalFoundries Details Ambitious Technology Roadmap
North American Semiconductor Equipment Industry Posts September 2020 Billings
Synopsys and Samsung Foundry Collaboration Delivers Portfolio of Optimized iPDKs and Methodologies for Advanced Custom Design
Orthogone Technologies Reveals New Brand Identity, Sets 25% Growth Target for 2021
EvoNexus and GLOBALFOUNDRIES Team to Accelerate Growth of Wireless and IoT Startups
Aldec's TySOM Family of Embedded System Development Solutions Now Supports Xilinx PYNQ (Python Productivity for Zynq)
Visit Vidatronic at the Virtual Samsung SAFE Forum on October 28th
Mentor receives 2020 TSMC OIP Partner of the Year awards for EDA solutions
Micro Magic, Inc. Unleashes World's Fastest RISC-V Core
Friday, October 23, 2020
Movellus Delivers Clock Generation Module on TSMC 3nm Process
Wednesday, October 21, 2020
6 Considerations for Integrating Sensors in Vehicles
Synopsys 3DIC Compiler Enables Samsung Tapeout of Advanced Multi-die Packaging of High-Bandwidth Memories for HPC Applications
GlobalFoundries Offers Ambitious Tech Plans, While Eying an IPO
TSMC Sees HPC As Next Inflection Point
PLDA demonstrates successful PCIe 5.0 Link Training at 32 GT/s with its PCIe 5.0 controller and Broadcom PHY
Arm partners with Mentor to offer complete verification service
M31 Technology Receives 2020 TSMC OIP Partner of the Year Award for Specialty Process IP
SmartDV to Exhibit at Virtual Samsung SAFE Forum 2020 with Portfolio of Design and Verification IP
SmartDV Appoints Karthik Gopal as Asia General Manager
eMemory Receives 2020 TSMC OIP Partner of the Year Award for Embedded Memory IP
Synopsys Helps Advance IBM's Vision of 1,000 Times Improvement in AI Compute Performance during the Coming Decade
TSMC Bets on HPC for Future Growth
Tuesday, October 20, 2020
Soitec reports FY'21 second quarter revenues
Tenstorrent achieves best-in-class PPA and First-Pass Silicon Success for Datacenter AI Processor SoC with INVECAS advanced ASIC engineering capabilities
Alphawave IP Receives Prestigious 2020 TSMC OIP Partner of the Year Award for High-Speed SerDes IP
Arm Awarded TSMC OIP Partner of the Year Award for Processor IP for Six Years in a Row
TSMC Recognizes Synopsys Collaboration with Four OIP Partner of the Year Awards for IP and EDA Solutions
IAR Systems brings functional safety tools to RISC-V with certification for IEC 61508 and ISO 26262
Faraday Brings Advanced Audio ASIC Solutions to the Music Entertainment Industry
Microchip Acquires High-Level Synthesis Tool Provider LegUp to Simplify Development of PolarFire FPGA-based Edge Compute Solutions
Silicon Creations Named 2020 TSMC OIP Partner of the Year for Analog / Mixed-Signal IP
Monday, October 19, 2020
Sequitur Labs Joins NVIDIA Partner Network to Protect Critical IP at the Edge
Chips&Media showcase at Samsung Foundry SAFE FORUM 2020 as an IP partner
Veridify Security Welcomes Happiest Minds as Systems Integrator Partner
Taiwan Semiconductor's Technology Dominance And Its Impact On Customers And Suppliers
Codasip Announces a New Design Center in France
Cadence Reports Third Quarter 2020 Financial Results
TSMC 12FFC silicon proven SERDES Phy IPs' for HDMI 2.1, PCIe Gen5, DDR4, USB 4 & MIPI Interfaces available immediately for your next SoC
Flex Logix Announces Working Silicon Of Fastest And Most Efficient AI Edge Inference Chip
Breakthrough Synopsys IC Validator Technologies Deliver Faster Physical Signoff Convergence
TSMC Announces 2020 OIP Partner of the Year Awards for Excellence in Accelerating Silicon Innovation
SK hynix to Acquire Intel NAND Memory Business
Sunday, October 18, 2020
TSMC revenue for 2020 to rise by 30% despite losing Huawei
Hardware Is Back, Says CEA-Leti's CEO
riscvOVPsim gets Risc-V vector instructions
'Samsung set to win over TSMC in the end'
GreenWaves Technologies Announces Next Generation GAP9 Hearables Platform Using GLOBALFOUNDRIES 22FDX Solution
Perforce Software Accelerates SoC Development With Methodics IPLM 3.0 Launch
Dolphin Design's SPEED platforms receive the "Solar Impulse Efficient Solution" Label, rewarding profitable solutions that protect the environment.
Dialog Semiconductor Licenses its Non-Volatile Resistive RAM Technology to GLOBALFOUNDRIES for 22FDX Platform, Targeting IoT and AI
Synopsys Accelerates Power Electronics System Design with Virtual Prototyping Solution
Wipro to acquire Eximius Design, strengthens leadership in VLSI and systems design services
Latest NPU adds to Arm's AI Platform performance, applicability, and efficiency
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