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Thursday, October 15, 2020
China is catching up: SMIC foundry is now able to produce 7 nm chips
Wednesday, October 14, 2020
Global Silicon Wafer Shipments on Track for 2020 Recovery and 2022 Record High, SEMI Reports
TSMC Reports Third Quarter EPS of NT$5.30
GLOBALFOUNDRIES Accelerating Innovation in IoT and Wearables with Adaptive Body Bias Feature on 22FDX Platform
GreenWaves Technologies Announces Next Generation GAP9 Hearables Platform Using GLOBALFOUNDRIES 22FDX Solution
Xilinx and Spline.AI Develop X-Ray Classification Deep-Learning Model and Reference Design on AWS
CSEM joins forces with GLOBALFOUNDRIES to deliver best-in-class Bluetooth Dual-Mode silicon IP for next generation portable audio
JEDEC Announces Publication of JEDEC Module Sideband Bus
Industry's first security microcontrollers for a complete IoT lifecycle management solution
Tuesday, October 13, 2020
Synopsys and Samsung Foundry Announce Reference Flow for Predictable Execution of ASIL D-Compliant SoC Design for Automotive Applications
Synopsys and SiMa.ai Collaborate to Bring Machine Learning Inference at Scale to the Embedded Edge
How will artificial intelligence impact automotive IP protection strategies?
Lattice Semiconductor Wins Two Medals at 2020 LEAP Awards
Chinese chipmaker SMIC makes breakthrough in '7nm-like process'
China Forecast to Represent 22% of the Foundry Market in 2020
TriEye Shortens Time to Market for Next-Generation CMOS-Based SWIR Image Sensors with the Cadence Spectre X Simulator
Monday, October 12, 2020
South Korea pushes for AI semiconductors as global demand grows
Imagination extends mobile GPUs to automotive and data centres with 6Tflop B-Series
NVIDIA Reportedly Moving Ampere to 7 nm TSMC in 2021
Arteris IP FlexNoC Interconnect Again Licensed by KYOCERA for Enterprise Printing and Imaging Solutions
Synopsys Demonstrates Industry's First PCI Express 5.0 IP Interoperability with Intel's Future Xeon Scalable Processor
Innosilicon Achieves World-First Tapeout Success on SMIC N+1 Process
Innosilicon selects Imagination's new BXT Multi-Core GPU IP for cloud computing
Imagination launches IMG B-Series: Doing more with multi-core
Cadence Brings Verification IP to the Chip Level with New System VIP Solution
New Cadence Clarity 3D Transient Solver Delivers Up to 10X Faster System-Level EMI Simulation
Synopsys to Enable New Levels of Insight into SoC Designs and Systems with Industry's First Silicon Lifecycle Management Platform
MIPI Alliance and IEEE Sign Agreement to Bring Automotive SerDes Standard to Broader Ecosystem
OPENEDGES AI Accelerator (NPU) & Memory Subsystem IP licensed for Eyenix AI-powered surveillance camera chipset
Synopsys Names Shankar Krishnamoorthy General Manager of the Digital Design Group
Sunday, October 11, 2020
Arm co-founder: Nvidia takeover would create another US tech monopoly
Menta Appoints ETSI as United States East Coast Representative
AMD and Xilinx: A Match Made in Silicon Valley?
Attend Andes Technology's Presentation "A RISC-V Out-of-Order Processor" at the Linley Processor Conference
Visit Vidatronic at the Virtual GLOBALFOUNDRIES Technology Conference (GTC) - EMEA on October 16th
Numem Selected by NASA for 'DNN Radiation Hardened Co-Processor Companion Chip to NASA's Upcoming High-Performance Spaceflight Computing Processor'
Cadence Pegasus Verification System Certified for TSMC N16, N12 and N7 Process Technologies
AMD-Xilinx Deal: Bringing The Fight To The Data Center
Synopsys IC Compiler II Delivers First-Pass Silicon Success for Graphcore's Multi-Billion Gate AI Processor
AMD Reported to Be Negotiating Purchase of Xilinx
intoPIX Ships v2.0 of FastTICO-XS SDK for x86-64 CPU platforms to speed up JPEG-XS workflows
Thursday, October 8, 2020
Imec presents alternative metals in advanced interconnect and contact schemes as a path to 2nm technology nodes
Wednesday, October 7, 2020
proteanTecs Announces Market and Regional Expansions
Synopsys DesignWare CXL IP Supports AMBA CXS Protocol Targeting High-Performance Computing SoCs
Instrumentation Technology Systems adds intoPIX TICO-XS to their upcoming NetVIDxs
Huang "Confident" Nvidia-Arm Deal Will Get Past Regulators
Attopsemi's I-fuse Memory Solution Now Qualified and Available on X-FAB's 130nm RF-SOI Technology
TSMC September 2020 Revenue Report
UMC Reports Sales for September 2020
Intento Design Expands Analog Automation with IDX-PVT, Eliminating the Need for Design-by-Verification
Pushing the boundaries of performance and security to unleash the power of 64-bit computing
Think Silicon to introduce a new Inference Micro GPU Architecture based on RISC-V at Linley Fall Virtual Processor Conference
Cadence Announces Complete DDR5/LPDDR5 IP Solution for TSMC N5 Process Technology
Tuesday, October 6, 2020
Arm CEO Simon Segars discusses AI, data centers, getting acquired by Nvidia and more
SmartDV Unveils SmartConf Testbench Generator
CAST Introduces Ultra-Low Latency TSN Ethernet Switch IP Core
VSORA Introduces Small Footprint, Low-Power PetaFLOPS Platform Enabling L4/L5 Autonomous Driving
Everactive Adopts Movellus Sub-Microwatt Clocking Solution for its Batteryless IIoT System
Monday, October 5, 2020
AI Requires Tailored DRAM Solutions: Part 3
European Semiconductor Sales Drop, Global Sales Rise
Top 10 Tech Industry Trends for 2021
'Samsung AI Forum 2020' Explores the Future of Artificial Intelligence
Efinix® Announces Availability of Reconfigurable Acceleration Platform
Eximius Design Joins TSMC Design Center Alliance Program
Renesas Launches Arm Cortex-M33-based RA6M4 MCU Group with Superior Performance and Advanced Security for IoT Applications
Sunday, October 4, 2020
Nvidia Presents the DPU, a New Type of Data Center Processor
China's Chip Sector Faces Possible Impact as SMIC Assesses Export Restrictions Placed by U.S.
ESD Alliance Reports Strong Electronic Design Automation Industry Revenue Growth for Q2 2020
TurboConcepts successfully completes research project FlexDEC-5G for designing FEC decoders for 5G
Imagination Technologies Group Ltd. Announces new CEO Simon Beresford-Wylie
Intel's Roadmap: A Closer Look at Process Technologies and Production Plans
Arm Spins-out Cerfe Labs to Advance Development of CeRAM Memory Technology
Toshiba Information Systems Adopts Blue Pearl Software Visual Verification Suite by to Improve Quality and Accelerate FPGA and ASIC Development
China's Semiconductor Industry to Brace for Impact as SMIC Assesses Export Restrictions Placed by U.S., Says TrendForce
Global Semiconductor Sales Increase 4.9 Percent Year-to-Year in August
GUC Monthly Sales Report - September 2020
OpenFive and AnalogX to Provide Optimized Chip-to-Chip Interface IP Solutions
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