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Wednesday, August 19, 2020

• Arm and DARPA Sign Partnership Agreement to Accelerate Technological Innovation
• Synopsys IC Validator, Running on AMD EPYC Processor Powered Azure Virtual Machines, Verifies AMD Radeon Pro VII GPU Design in Under Nine Hours
• OpenFive Enhances Differentiated IP Portfolio with Die-to-Die Interface Controllers for HPC and Chiplet Markets
• Subaru Selects Xilinx to Power New-Generation EyeSight System
• Synopsys Posts Financial Results for Third Quarter Fiscal Year 2020
• Electronics Supply Chains Splitting Between China and U.S.
• Clue Technologies adopts OneSpin's verification solution for avionic computing systems
• DRAM Capex Spending Expected to Decline 20% in 2020
• Synopsys Appoints Sassine Ghazi as Chief Operating Officer
• prpl Foundation Releases prplWRT Open-Source CPE Software

Tuesday, August 18, 2020

• Proof of concept security platform protects IoT and 5G private networks
• Alibaba XT910 RISC-V Core Faster Than Kirin 970 SoC; Threat To ARM?
• NSITEXE Adopts Synopsys HAPS Prototyping to Validate Data Flow Processor IP
• Moortec Provides In-Chip Sensing Fabrics on TSMC N6 Process Technology
• RIOS Laboratory and Imagination announce partnership to grow the RISC-V ecosystem
• US Tightens Chip Export Screws on Huawei
• CEVA's Wi-Fi 6 Solution Becomes World's First IP to Achieve Wi-Fi CERTIFIED 6 Status from the Wi-Fi Alliance
• Intel Looks to Regain Innovation Lead

Monday, August 17, 2020

• Samsung ramps up foundry business as manufacturer of IBM's 7nm CPU
• Mixel's Patented D-PHY RX+ IP Extends Market Share with Automotive Microcontrollers
• SiFive and Innovium Announce Collaboration to Accelerate Innovation in Data Center Networking
• Rianta Releases 800G MACsec ASIC/SoC IP Core for Next-Gen Data Center and 5G Backhaul Applications
• Semiconductor Industry Luminary Fred Weber Joins Movellus as Corporate Advisor
• S2C and Mirabilis Design Teamup to Deliver a Heterogeneous Solution for SoC Architecture Exploration and Verification
• The Landmark IPO of VeriSilicon (688521.SH) on Shanghai STAR Market
• Nuvoton Accelerates the Development of its MCU Designs with the Cadence Palladium Z1 Enterprise Emulation Platform

Sunday, August 16, 2020

• Arm co-founder: Nvidia sale is because Softbank over-invested in firm
• SiFive founds business unit to mix Risc-V and Arm cores on silicon
• IBM Reveals Next-Generation IBM POWER10 Processor
• eInfochips provides SOC engineering services to Astera Labs in developing industry's first PCIe 4.0 & 5.0 Smart Retimer SoC.
• Silicon Creations' SerDes Technology Designed into Novatek 8K TV SoC on TSMC 12nm Process
• SiFive Announces OpenFive, an Industry-Leading Custom Silicon Business Unit
• BrainChip Inc and Magik Eye Inc. Partner to Combine Best of AI with 3D Sensing for Total 3D Vision Solution
• Movellus Named to EETimes' Silicon 100 Emerging Startups to Watch List

Thursday, August 13, 2020

• Blaize Delivers Breakthrough for AI Edge Computing

Wednesday, August 12, 2020

• SMIC says it has improved the yield rate of its 14nm manufacturing node
• Spin Memory Unveils New Method of Designing Memory to Shake Up $100B Chip Market
• Alchip Technologies Opens 5nm ASIC Design Capabilities
• CHIPS Act Targets Post-Globalized Industry
• Samsung Announces Availability of its Silicon-Proven 3D IC Technology for High-Performance Applications
• Synopsys Introduces Integrated Electric Vehicle Virtual Prototyping Solution
• Cobham Advanced Electronic Solutions' RadHard Microelectronics Assist in Study of Sun and Earth Connection
• BrainChip Inc Appoints Vice President of Worldwide Sales
• Startup Claims Low-power IoT Geolocation Without a Positioning Chipset
• Cadence Delivers Machine Learning-Optimized Xcelium Logic Simulation with up to 5X Faster Regressions

Tuesday, August 11, 2020

• Dialog Semiconductor's FusionHD™ NOR Flash Memory Compatible and Qualified with its SmartBond™ Bluetooth Low Energy Wireless MCUs
• Demand for Edge AI Chips to Surpass Cloud AI by 2025
• Brain simulator AI platform processes 3 billion synapses/s
• Gowin Semiconductor Adds Korea Certification For Their Bluetooth Low Energy Enabled MSoC FPGA Modules
• China-Based HiSilicon's Time in the Top-10 Ranking May be Short Lived
• Qualcomm's licensing model declared legal
• CEVA NB-IoT IP Achieves Monumental Milestone; Awarded Full Certification from Deutsche Telekom
• Tachyum Demo Shows Prodigy will be Faster than NVIDIA and Intel Chips

Monday, August 10, 2020

• Lack of ADAS Benchmarks Is Haunting Car Industry
• QuickLogic Joins CHIPS Alliance to Expand Open Source FPGA Efforts
• SiFive Secures $61 Million in Series E Funding

Sunday, August 9, 2020

• CEVA, Inc. Announces Second Quarter 2020 Financial Results
• Huawei to end production of leading edge mobile chipsets
• Imec presents low-power 60 GHz radar chip for contactless health tracking in battery-powered devices
• One on One with RISC-V CTO Mark Himelstein
• UMC Reports Sales for July 2020
• TSMC July 2020 Revenue Report
• Mentor extends industry-leading EDA software support for Samsung Foundry's 5/4nm process technologies
• Truechip Announces Customer Shipment Of USB4 And eUSB Verification IPs
• Covid-19 Expected to Limit Growth Rates For Many IC Products in 2020