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Friday, November 29, 2024

• Apple Orders M5 Chips from TSMC for Next-Gen Devices

Friday, November 29, 2024

• Advanced Packaging and Chiplets Can Be for Everyone

Thursday, November 28, 2024

• Interconnected devices and security: how to protect the Internet of Things?
• Advanced Packaging and Chiplets Can Be for Everyone
• VeriSilicon partners with LVGL to enable advanced GPU acceleration for wearable devices and beyond
• Germany budgets for extra euro-billions in chip subsidies
• At COP29, Leonardo's solutions to combat climate change
• Infineon wins German Sustainability Award 2025
• Leonardo in EECONE, for a sustainable electronics supply chain

Wednesday, November 27, 2024

• HighTec C/C++ Compiler Suite Supports Andes' ISO 26262 Certified RISC-V IP for Automotive Safety and Security Applications
• Imagination DXS GPU IP recognised as game-changer for the car industry
• Silicon Creations Collaborates with Interex Semiconductor to Distribute High-Performance IPs in India
• Siemens' Solido SPICE now certified for multiple leading-edge Samsung Foundry processes

Tuesday, November 26, 2024

• Samsung Electronics Restructures Leadership, Reinforces Focus on Semiconductor Innovation
• TSMC May Bring 2nm Manufacturing Node to the U.S. After 2025
• Government of India creating enabling environment for Semiconductor Design Community with direct access to National Chip Design Infrastructure
• Think Silicon and LVGL Accelerate Graphics Libraries for Microcontrollers

Tuesday, November 26, 2024

• Samsung Receiving Industry's First Global Recognition for Environmental Sustainability of its Semiconductor Solutions

Monday, November 25, 2024

• Using AI to build next generation wireless systems
• Integrated silicon photonics: making the quantum future a reality
• Tower Semiconductor Releases 300mm Silicon Photonics Process as a Standard Foundry Offering
• France to buy Atos supercomputing, quantum business for €1.1bn
• Renesas Extends Line-up For Industrial Ethernet and Multi-Axis Motor Control Solutions with High Performance Quad-Core Application Processor
• CryoMem Suite of Memory IP for QC is Now Available For Licensing
• sureCore now licensing its CryoMem range of IP for Quantum Computing
• Availability of New 16-bit 5MSps SAR ADC in 40nm Node Sets New Standards for High-Performance Data Conversion
• Alphawave Semi Drives Innovation in Hyperscale AI Accelerators with Advanced I/O Chiplet for Rebellions Inc
• Andes Technology Collaborates with Lauterbach to Deliver RISC-V Trace Solution

Sunday, November 24, 2024

• GlobalFoundries and IDEMIA Secure Transactions to Enable Next-Generation Smart Card IC on GF 28ESF3 Platform
• US backs GlobalFoundries' semiconductor growth with $1.5 billion
• Role of FD-SOI in Powering AI-Driven IoT Applications
• Siliconally Releases SinglePHY 100BASE-T1 22FDX, an Automotive Ethernet PHY IP

Friday, November 22, 2024

• Redefining Hearing Aids with Cadence DSPs

Thursday, November 21, 2024

• HPC customer engages Sondrel for high end chip design
• EU looks to change rules on technology transfer, patent pools

Wednesday, November 20, 2024

• Universal AI RISC-V processor does it all - CPU, GPU, DSP, FPGA
• Ubitium Debuts First Universal RISC-V Processor to Enable AI at No Additional Cost, as It Raises $3.7M
• TSMC drives A16, 3D process technology
• Solid Sands and VyperCore Collaborate to Ensure C/C++ Compliance in New Accelerator Chip Design
• SC24 Observations: China, Politics, RISC-V and CXL
• Optical Transmission Modulation Methods Advance
• GlobalFoundries awarded $1.5bn subsidy
• Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
• China's Huawei, SMIC 'to Ramp Production' of Newest AI Chip
• Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy

Tuesday, November 19, 2024

• Renesas Introduces Industry's First Complete Memory Interface Chipset Solutions for Second-Generation DDR5 Server MRDIMMs
• Nordic Simplifies Wireless Integration With New Low-Power SoCs
• Japan proposes $1.3bn investment in Rapidus
• GlobalFoundries and U.S. Department of Commerce Announce Award Agreement on CHIPS Act Funding for Essential Chip Manufacturing
• Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
• CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
• Capgemini, Mistral AI and Microsoft collaborate to further accelerate adoption of generative AI technologies
• Cadence Unveils Arm-Based System Chiplet

Monday, November 18, 2024

• Infineon and Siemens collaborate to bring AURIX TC4x to next generation software-defined vehicles
• Dnotitia Unveils the World's First Hardware-Accelerated Vector Database, Seahorse, at Super Computing 2024
• CAST Adds New SafeSPI Controller to its Functional Safety IP Core Product Line
• Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards