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Friday, November 15, 2024

• Siemens Launches TIA Portal Version 20 Focused on Improved Performance
• RISC-V for HPC at SC24

Thursday, November 14, 2024

• TSMC grabs US$11 billion for Arizona fabs from US Chips Act
• Siemens presents next-generation AI-supported software for electronic system design
• QuickLogic to Showcase Advanced eFPGA Hard IP Solutions at Space Tech Expo Europe 2024
• Imec Chipset Alliance Aims to Expand AI to Cars
• Imec Chiplet Alliance Aims to Expand AI to Cars
• Grass Valley Adds JPEG XS Support to AMPP, Powered by intoPIX FastTicoXS Technology, Enhancing Cloud-Based Live Production
• Alphawave Semi Partners with PCISig, CXL Consortium, UCIe Consortium, Samtec and Lessengers to Showcase Advances in AI Connectivity at Supercomputing 2024
• AI Software Startup Moreh Partners with AI Semiconductor Company Tenstorrent to Challenge NVIDIA in AI Data Center Market

Wednesday, November 13, 2024

• Renesas' New R-Car SoC Supports Centralized Car Compute
• Renesas Unveils Industry's First Automotive Multi-Domain SoC Built with 3-nm Process Technology

Tuesday, November 12, 2024

• What RISC-V Means for the Future of Chip Development

Monday, November 11, 2024

• TI opens its first product distribution centre in Europe
• Silvaco Reports Third Quarter 2024 Financial Results
• Silicon Creations Celebrates Milestone with Delivery of 1,000th Production License for Fractional-N PLL
• LG and Tenstorrent Expand Partnership to Enhance AI Chip Capabilities
• intoPIX JPEG XS Powers Village Island's VICO-2L-XS for Cost-effective SDI/IP Conversion
• CHERI builds global chip security alliance
• CHERI Alliance Officially Launches, Adds Major Partners including Google, to Tackle Cybersecurity Threats at the Hardware Level
• Achronix and BigCat Wireless Collaborate to Deliver Unprecedented Power Efficiency and Performance for 5G/6G Wireless Applications
• Siemens extends Veloce hardware-assisted verification and validation with new Innexis shift-left software
• SEMIFIVE Collaborates with Synopsys to Develop Advanced Chiplet Platform for High-Performance Multi-Die Designs
• Samsung Reportedly Joins TSMC in Halting 7nm and Below AI Chip Supplies to China
• NanoXplore acquires Dolphin Design's ASIC business and strengthens its strategic position in aerospace
• lowRISC and SCI Semiconductor Partner to Create First CHERIoT Commercial Tapeout
• Kudelski IoT Launches Quantum-Resistant Security IP, Future-Proofing Semiconductors Against Emerging Quantum Threats
• intoPIX and Media Links: Powering Next-Generation IP Media Transport with JPEG XS at InterBEE 2024
• Arteris and MIPS Partner on High-Performance RISC-V SoCs for Automotive, Datacenter and Edge AI

Sunday, November 10, 2024

• Where the Future Begins: Samsung Showcases Pioneering Innovations for AI and Automotive Technologies at electronica 2024 in Munich
• Will Europe become the world's foundry for photonic chips?
• U.S. restricts TSMC's export of advanced chips to China
• Oriole Networks Selects EnSilica as ASIC Partner and Contract Award for Photonics Controller ASIC
• Oriole Networks Selects EnSilica as ASIC Partner and Contract Award for Photonics Controller ASIC
• Imagination DXS GPU officially certified as ASIL-B compliant
• Flex Logix Acquired By Analog Devices
• DMP Released Next-Generation AI Accelerator IP "ZIA A3000 V2" - Industry-leading PPA efficiency to propel the future of edge AI
• Delivering industry-leading solutions with Comprehensive Automotive Grade Silicon IP Portfolio with ISO 26262 and ASIL Certifications

Thursday, November 7, 2024

• IonQ Strengthens Quantum Computing Capabilities through Partnerships with imec and NKT Photonics
• Siemens launches fully electronic e-Starter with semiconductor technology
• MIPS Releases P8700, Industry's First High-Performance AI-Enabled RISC-V Automotive CPU for ADAS and Autonomous Vehicles
• Last-Time Buy Notifications For Your ASICs? How To Make the Most of It
• Global battery passport boost from pilot schemes
• CEA-Leti to Present Breakthroughs in Memory, RF, FDSOI at IEDM

Thursday, November 7, 2024

• Merck KGaA, Darmstadt, Germany and Intel Launch Academic Research Program in Europe for More Sustainable Semiconductor Manufacturing

Wednesday, November 6, 2024

• TSMC and GlobalFoundries finalize CHIPS Act funding agreements
• Sondrel announces that it is opening up its library of IP for licensing
• Panasonic Automotive Systems and Arm Partner to Standardize Software-Defined Vehicles
• Logic Fruit Technologies Launches JESD204D Transmitter and Receiver IP - Advancing High-Bandwidth Data Solutions
• Ceva, Inc. Announces Third Quarter 2024 Financial Results

Tuesday, November 5, 2024

• Arm Achieves Record Q2 Results
• Tessolve to Acquire Germany's Dream Chip Technologies
• ST plans integrated automotive microcontroller line
• Revolutionize AIoT with MYC-LR3576: The Ultimate Rockchip Octa-core Arm Processor Solution
• Renesas Announces Additional Key Leadership Changes
• Orca Semi Unveils IO-Link Comms Transceiver for the Smart Factory
• M31 Launches USB4 IP for TSMC 5nm Process
• Comcores Announces Strategic Sales Partnership with Micon Global
• Bill Gropp on 'Different Approaches to AI'
• Arteris Announces Financial Results for the Third Quarter 2024 and Fourth Quarter and Full Year 2024 Guidance

Monday, November 4, 2024

• Tenstorrent to Build Japanese Engineering Talent with US-Based AI and RISC-V Training
• Tenstorrent Expands Deployment of Arteris' Network-on-Chip IP to Next-Generation of Chiplet-Based AI Solutions
• Siemens' Tessent In-System Test software enables advanced, deterministic testing throughout the silicon lifecycle
• Samsung set to scale back foundry production
• Renesas Brings the High Performance of Arm Cortex-M85 Processor to Cost-Sensitive Applications with New RA8 Entry-Line MCU Groups
• Jolt Capital buys and invests in Dolphin Design's carved-out mixed-signal IP activities
• GlobalFoundries revenue drops 6% to $1.74 bn
• EnSilica plc - Audited Full Year Results for the Year Ended 31 May 2024