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Friday, August 1, 2025

• QpiAI Raises $32M to Build India’s First Full-Stack Quantum-AI Platform

Thursday, July 31, 2025

• Armv9 and CSS Royalties Drive Growth in $1bn Arm Q1 Earnings
• Female-founded semiconductor AI startup SixSense raises $8.5M
• X-CUBE-PQC: Why post-quantum cryptography matters already and how STM32 embedded systems are ready for future attacks
• Rapidus adopts Teamcenter for Semiconductor Lifecycle Management
• Arm considers stepping up investment in chiplet and solution development
• Japan unveils $550B investment to reshape global trade, strengthen chip supply chains, and support TSMC's U.S. expansion under new U.S. tariff deal
• Creonic Releases DVB-S2X Demodulator Version 6.0 with Increased Bitwidth and Annex M Support
• Perceptia Releases Design Kit for pPLL05 on GlobalFoundries 22FDX Platform

Wednesday, July 30, 2025

• SNUG India 2025: AI, Modular Chips, and India's Semiconductor Future
• What It Will Take to Build a Resilient Automotive Compute Ecosystem
• Socionext enters into licensing agreement with aiMotive
• SiMa.ai Expands Strategic Collaboration with Synopsys to Accelerate Automotive AI Innovation
• 'World's First' Photonic AI Processor Installed in Supercomputing Facility
• Silvaco to Acquire Mixel, Inc. a Provider of Low-Power, High-Performance Mixed-Signal Connectivity IP Solutions

Tuesday, July 29, 2025

• Keysight Announces Date of Third Quarter 2025 Financial Results Conference Call
• Keysight Installs World's Largest Commercial Quantum Control System at AIST's Leading-Edge G-QuAT Center
• Semiconductor innovations transforming automotive displays
• Ceva Retains Top Spot in Wireless Connectivity IP in Latest IPnest Report
• Chiplets Are Here - And They're Reshaping Everything
• TSMC Gets 300,000 H20 Chip Order from NVIDIA Amid China Market Boom
• Cadence Found Guilty of Illegally Supplying China Military
• Renesas Introduces 64-bit RZ/G3E MPU for High-Performance HMI Systems Requiring AI Acceleration and Edge Computing
• Smartphone brands to accelerate LPDDR5X adoption as LPDDR4X supply tightens

Monday, July 28, 2025

• Intel issues a new warning
• Cadence Reports Second Quarter 2025 Financial Results
• Rambus Reports Second Quarter 2025 Financial Results
• Chiplet design basics for engineers
• ST announces plans to acquire NXP's MEMS sensors business
• Samsung to produce Tesla's next-gen AI chips in $16.5b foundry breakthrough
• Next-Gen High-Speed Transceiver IP Core Unveiled: Power, Performance, and Protocol Versatility in One Core

Sunday, July 27, 2025

• How Tesla and Samsung's Strategic Alliance is Revolutionizing AI Semiconductors and Accelerating Autonomous Driving

Saturday, July 26, 2025

• L&T Semiconductors eyes global play with Fujitsu General's deal, sharp focus on IP and automotive

Friday, July 25, 2025

• Taiwan deepens semiconductor cooperation with Europe
• Top Automotive Semiconductor Solutions Powering the Cars of Tomorrow
• MIPS and Cyient Collaborate on RISC-V Power Solutions
• Soitec VP: 'In the Near Term, Caution Is the Name of the Game'
• Tech giant Intel cancels investments in Poland, Germany
• China Emerging as Significant Force in RISC-V Development and Adoption
• Intel facing another crossroads: 18A or 14A process node
• Paving the Way for Integrated Photonic Chips
• Silicon Photonics Market to Hit Significant Growth

Thursday, July 24, 2025

• Mike Yeager: 'Simulation Is Now Driving Product Design, Not Just Validating It'
• TSMC's 2nm Production Is Expected to Break Records, With Capacity Surpassing 3nm & Soaring Demand Driven by Massive Interest From Big Tech
• Intel Earnings Call Preview: 14A Strategy, Foundry Challenges, and More
• How the semiconductor industry is grappling with cybersecurity threats
• Keysight Supports Post-Quantum Cryptography Evaluation

Wednesday, July 23, 2025

• ADAS and Lidar Technology Revolutionize Automotive Safety in Modern Vehicles
• UMC Announces Software Acquisition and Upcoming Earnings Release
• TSMC to Exit GaN, Focus on Advanced Packaging
• Mixel Supports Automotive SerDes Alliance (ASA) Motion Link SerDes IP

Tuesday, July 22, 2025

• SEMI Predicts Record $125.5 Billion in Global Semiconductor Equipment Sales for 2025
• How Ireland is powering a sustainable future for the global semiconductor industry
• Arm Zena Compute Subsystems: Paving the Way to Scalable Automated Driving for the AI-Defined Era
• ICTK Obtains 'CC EAL6' Certification, a High Level of Security Assurance for IT Products
• Ansys and SASTRA Deemed University Establish Center of Excellence for Advanced Space and Defense Technologies
• Synopsys strengthens India's role with push for world's first AI-based chip foundry
• Designing the future: AI innovation accelerated through university collaboration
• Samsung shortsightedly rejected Nvidia CEO Jensen Huang's reported HBM production and Foundry business proposals in 2018
• Arteris Selected by Whalechip for Near-Memory Computing Chip

Monday, July 21, 2025

• Top 5% Companies Sweep Profits in Global AI Semiconductor Industry
• Siemens and UMC collaborate to advance EM/IR drop analysis with mPower technology
• EnSilica cuts post-quantum cryptography (PQC) silicon area with three-in-one IP block
• 12-bit 5Msps High-Speed, Silicon-Proven ADC IP Core Available for Immediate Licensing
• Axiomise Partners With Bluespec to Verify Its RISC-V Cores