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Sunday, October 20, 2024

• The pace quickens for cryptography
• SiFive HiFive Premier P550 Development Boards Now Shipping
• EnSilica plc - Award of £2 million Controller ASIC Design Services Contract
• Codasip enables secure Linux by donating CHERI RISC-V SDK to the CHERI Alliance
• Arteris and SiFive Deliver Pre-verified Solution for the Datacenter Market
• Andes Announces the AndesCore™ AX66 supporting RVA23, Multi-cluster, Hypervisor and Android
• Andes Announces the AndesCore™ 46-Series Family and the 3rd generation Vector Processor AX46MPV with Matrix Extension

Friday, October 18, 2024

• Arteris Evolves Its Network-on-Chip Tiling to Accelerate AI Designs

Friday, October 18, 2024

• Synopsys DesignWare USB 2.0 and Ethernet IP Enables First-Pass Silicon Success for STMicroelectronics

Friday, October 18, 2024

• Imagination Technologies announces OpenVG 1.1 conformance for POWERVR SGX range of scalable graphics cores

Thursday, October 17, 2024

• TSMC Reports Third Quarter EPS of NT$12.54
• The role of RISC-V in the European Processor Initiative - Interview with Roger Espasa

Thursday, October 17, 2024

• Outlook 2025: Embracing the chiplet journey

Wednesday, October 16, 2024

• Thalia adds analog and mixed-signal IP reuse to Siemens' Cre8Ventures Digital Twin Marketplace
• Samsung offers first 24Gb GDDR7 DRAM for AI computing
• Rebellions Builds Chiplet Roadmap, Merges with Sapeon
• Ex-Samsung executive wants a slice of self-driving car market
• EnSilica - Design and Supply contract award for a controller ASIC for automotive and industrial markets

Tuesday, October 15, 2024

• Successful tape out of Chip Interfaces' JESD204D IP by a tier 1 semiconductor company
• Samsung Foundry Pushes Up The Race Against TSMC In "Process Superiority", Starts Prepping 2nm & 1.4nm Production Lines
• Rebellions partners with Arm on AI computing chiplet Techs
• Intel and AMD form x86 Ecosystem Advisory Group
• Efabless Goes the Custom Route for Edge ML
• ADTechnology Partners with Arm, Samsung Foundry, and Rebellions on AI CPU Chiplet Platform

Monday, October 14, 2024

• Weebit Nano expands global sales infrastructure to support increased demand
• Silvaco Announces Preliminary Unaudited Revenue for Q3 and Updates Full Year 2024
• Rambus Unveils Industry-First Complete Chipsets for Next-Generation DDR5 MRDIMMs and RDIMMs to Deliver Breakthrough Performance for Data Center and AI
• eMemory Join Forces with Siemens on Groundbreaking SRAM Repair Toolset: Pre-integrated Tessent MemoryBIST with NeoFuse OTP
• Codasip unveils versatile automotive-grade embedded RISC-V core
• CEA-Leti Launches OpenTRNG, an Open-Source Project For True Random Number Generators Using Ring-Oscillator-Based Architectures
• CAST Partners with KiviCore for Post-Quantum Cryptography
• Cadence Announces Fem.AI Alliance to Lead Gender Equity Revolution in the AI Workforce
• Axiomise 7th birthday - we are proud to be at DVCon Europe
• Arteris Network-on-Chip Tiling Innovation Accelerates Semiconductor Designs for AI Applications
• Arm Total Design Ignites Growing Ecosystem of Arm-based Silicon for a Sustainable AI Datacenter
• AI and Semiconductors: A Symbiotic Relationship
• Agile Analog announces MoU to support new Southern Taiwan IC Design Industry

Sunday, October 13, 2024

• TSMC "already planning" for more European fabs
• Supercharging Automotive Production Line With AI-Powered Manufacturing
• Siemens Updates Simcenter Testlab for Advanced Manufacturers
• SEMIFIVE Extends Partnership with Arm to Advance AI and HPC SoC Platforms
• SEMIFIVE Concluded Mass Production Contract for AI Chip with HyperAccel
• Samsung's Next Move? Early HBM4 Mass-production and 2nm Foundry Solutions Could Be the Cure
• Kernkonzept and Lauterbach Make Virtualized RISC-V Systems Possible
• Exclusive Interview: Antti Rauhala Discusses CoreHW's CHW3021 Radio Front-End IC
• DisplayPort Rx PHY and Controller IP Cores in multiple Leading Technology Nodes for Next-Generation Video SoCs
• Credo Announces PCI Express 6 /7, Compute Express Link CXL 3.x Retimers, and AEC PCI Express Product Line at OCP Summit 2024

Friday, October 11, 2024

• September foundry sales: a tale of differing fortunes

Thursday, October 10, 2024

• Infineon intensifies collaboration on CO2 reduction targets with suppliers and honors top performers with Green Awards
• IEDM: CFETs make progress at 5nm and 7angstrom

Thursday, October 10, 2024

• Deeptech Keysom completes a €4M fundraising and deploys the first "no-code" tool dedicated to the design of tailor-made processors

Thursday, October 10, 2024

• Bluetooth® V6.0 Channel Sounding RF Transceiver IP Core in 22nm & 40nm for ultra-low power distance aware Bluetooth connected devices

Wednesday, October 9, 2024

• Why Chiplets Are the Next Big Innovation in Silicon
• TSMC September 2024 Revenue Report
• SensiML Expands Platform Support to Include the RISC-V Architecture
• Deeptech Keysom completes a €4M fundraising and deploys the first "no-code" tool dedicated to the design of tailor-made processors
• Crypto Quantique teams up with Attopsemi to simplify the implementation of PUF technology in MCUs and SoCs
• Bosch, Tenstorrent to collaborate on standardizing automotive chips
• Arm, ASE, BMW Group, Bosch, Cadence, Siemens, SiliconAuto, Synopsys, Tenstorrent and Valeo commit to join imec's Automotive Chiplet Program

Wednesday, October 9, 2024

• MIPI Alliance Announces OEM, Expanded Ecosystem Support for MIPI A-PHY Automotive SerDes Specification
• How Poland became key to Europe's semiconductor sovereignty
• Silicon Labs and Kudelski IoT Partner to Accelerate Matter Device Certification
• Rambus to Announce Third Quarter Fiscal Year 2024 Results
• Intel Architects Start RISC-V Business with AheadComputing
• LDRA Announces Extended Support for RISC-V High Assurance Software Quality Tool Suite to Accelerate On-Target Testing of Critical Embedded Applications

Tuesday, October 8, 2024

• Secure-IC unveils its Securyzrâ„¢ neo Core Platform at Embedded World North America 2024

Tuesday, October 8, 2024

• Quantum Tunneling and PUFs: The Future of IoT Security
• MosChip Reaches Embedded World North America 2024 With its DigitalSky
• Efabless Unveils New Custom Chip Platform Designed for Edge ML Products
• Debug and Trace Support for Synopsys ARC-V Processor IP
• Revolutionizing High-Performance Silicon: Alphawave Semi and Arm Unite on Next-Gen Chiplets
• Intel, TSMC to detail 2nm processes at IEDM
• OPENEDGES Technology Achieves ISO 26262 ASIL-B Certification
• Secure-IC unveils its Securyzr™ neo Core Platform at Embedded World North America 2024
• Faraday and Kiwimoore Succeed in 2.5D Packaging Project for Mass Production
• Silicon Labs Series 3 Platform Guides the IoT Evolution