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Monday, October 7, 2024

• UK announces sustainable electronics centre
• Accelerating Europe's Photonics Lab-to-Fab Journey
• Xylon's Updated logiHSSL IP Core Seamlessly Connects Infineon AURIX Microcontrollers with AMD Adaptive SoCs and FPGAs
• Alphacore teams with Southwest Advanced Prototyping HUB at ASU to advance national security with nearly $30 million in federal funding award
• Boosting Efficiency and Reducing Costs: Silvaco's Approach to Semiconductor Fabrication
• PQShield achieves first FIPS 140-3 certification
• Electronic System Design Industry Posts $4.7 Billion in Revenue in Q2 2024, ESD Alliance Reports
• intoPIX to Showcase Innovative Automotive Imaging Solutions at AutoSens Europe 2024
• NVMe Updates Expand Discoverability, Security
• Bluetooth® V6.0 Channel Sounding RF Transceiver IP Core in 22nm & 40nm for ultra-low power distance aware Bluetooth connected devices
• GUC Monthly Sales Report - September 2024
• UMC Reports Sales for September 2024
• Global Semiconductor Sales Increase 20.6% Year-to-Year in August
• A New Phase for Quantum Competition in Europe

Saturday, October 5, 2024

• Samsung ports Tizen OS to RISC-V

Friday, October 4, 2024

• Murata opens silicon capacitor production line at French manufacturing site

Thursday, October 3, 2024

• Significant EU funding for VTT's semiconductor development - supporting the growth of the semiconductor industry
• Uncovering Silent Data Errors with AI
• South Korean AI IC Design Companies Shifting to Dual-Foundry Model with Both Samsung and TSMC

Wednesday, October 2, 2024

• Crypto Quantique collaborates with ADLINK to simplify and enhance device security in industrial PCs
• Xiphera Partners with IPro for the Israeli Chip Design Market
• Launching MosChip DigitalSkyâ„¢ for Building Connected Intelligent Enterprises
• Crypto Quantique collaborates with ADLINK to simplify and enhance device security in industrial PCs

Wednesday, October 2, 2024

• ST and Qualcomm announce strategic wireless/IoT collaboration

Tuesday, October 1, 2024

• Siemens collaborates with GlobalFoundries to certify Analog FastSPICE for the foundry's high-performance processes
• Faraday Enhances 3D-IC Design Service with Ansys Multiphysics Analysis
• EXTOLL collaborates with Frontgrade Technologies for High-Speed SerDes IP
• Achronix Releases Groundbreaking Speedster AC7t800 Mid-Range FPGA, Driving Innovation in AI/ML, 5G/6G and Data Center Applications

Monday, September 30, 2024

• Will Intel's restructuring affect Samsung's foundry business?
• Synopsys Software Integrity Group Rebrands as Black Duck ‐ A New Era in Application Security
• STMicroelectronics and Qualcomm Expand Collaboration to Drive Wireless IoT Solutions
• Samsung's New 3nm GAA Technology Has Failed To Attract New Customers Because Of Unstable Yields, With Industry Watchers Forecasting A $385 Million Loss
• RaiderChip brings Meta Llama 3.2 LLM HW acceleration to low cost FPGAs
• QuickLogic Delivers eFPGA IP Targeting TSMC N12e Process in Record Time
• MulticoreWare collaborates with Arm to optimize and advance x265 video encoding on AWS Graviton4
• First IBM Quantum Data Centre opens in Europe
• Comcores announces the launch of the Centralized Network Configurator for TSN-based networks
• BrainChip Introduces Lowest-Power AI Acceleration Co-Processor

Monday, September 30, 2024

• Unveiling the Availability of Industry's First Silicon-Proven 3nm, 24Gbps UCIeâ„¢ IP Subsystem with TSMC CoWoS® Technology

Monday, September 30, 2024

• M31 Honored with MSCI ESG 'A' Rating ‐ Advancing Toward a New Milestone in Sustainability
• A Q&A with Quantum Systems Accelerator Director Bert de Jong

Sunday, September 29, 2024

• Unveiling the Availability of Industry's First Silicon-Proven 3nm, 24Gbps UCIe™ IP Subsystem with TSMC CoWoS® Technology
• Siemens brings industry leading Capital electrical and electronic systems design software to the cloud as a service
• Qualcomm and Sequans Complete Sale of 4G IoT Technology
• Paul Williamson on Edge AI, Llama 3.2 on Arm
• Global Semiconductor Industry Plans to Invest $400 Billion in 300mm Fab Equipment Over Next Three Years, SEMI Reports
• Flexible RISC-V processor offers prospect of low-cost smart objects
• Breakthrough in lithium-metal solid-state battery technology

Friday, September 27, 2024

• Paul Williamson on Edge AI, Llama 3.2 on Arm

Thursday, September 26, 2024

• Dnotitia Announces Strategic Partnership with Korea University Anam Hospital and Advanced Medical Imaging Research Institute to Develop LLM-based Medical AI Solutions

Wednesday, September 25, 2024

• The paradox of semiconductors - EU governance between sovereignty and interdependence
• Quside and PQShield Partner to Launch Integrated Quantum-Safe Cryptographic Solution for Enhanced Digital Security
• Europe takes a quantum leap: LUMI-Q consortium signs contract to establish quantum computer in the Czech Republic
• Alphawave Semi Wins Fifth Consecutive TSMC OIP Ecosystem Forum Partner of the Year Award
• TSMC and Cadence Collaborate to Deliver AI-Driven Advanced-Node Design Flows, Silicon-Proven IP and 3D-IC Solutions
• Synopsys and TSMC Pave the Path for Trillion-Transistor AI and Multi-Die Chip Design
• Silicon Creations Awarded TSMC's 2024 Open Innovation Platform Partner of the Year for Mixed Signal IP
• Siemens extends collaboration with TSMC to advance integrated circuit and systems design
• SIAE Microelettronica Selects Ensilica as Key Partner to Design ASICs for Next-Generation Telecom Equipment
• MIPI Alliance Releases A-PHY v2.0, Doubling Maximum Data Rate of Automotive SerDes Interface To Enable Emerging Vehicle Architectures
• M31 Launches ONFi5.1 I/O IP on TSMC 5nm Process
• EXTOLL collaborates with BAE Systems as a Key Partner for High-Speed SerDes IP
• EnSilica joins TSMC Design Center Alliance
• eMemory Won TSMC OIP Partner of the Year Award for the Outstanding Development of its NVM IP on Advanced Nodes

Tuesday, September 24, 2024

• Security Concerns Plague Emerging Chip Architecture
• Intel More Likely to Divest Units Than Seek Buyout
• EU Launches €73M Quantum Chip Funding to Support Technological Sovereignty and Semiconductor Innovation
• CEA-Leti Announces Launch of FAMES Pilot Line As Part of EU Chips Act Initiative
• Boosting Efficiency and Reducing Costs: SilvacoÂ’s Approach to Semiconductor Fabrication
• Silvaco Expands its Victory TCAD and Digital Twin Modeling Platform to Planar CMOS, FinFET and Advanced CMOS Technologies
• Samsung develops automotive SSD based on 8th-generation V-NAND
• Preferred Networks Inc. adopts Siemens' PowerPro software for next-generation AI chip design
• Introducing a Versatile 1G Ethernet PHY IP Core with BroadR-Reachâ„¢ Technology for Automotive and Industrial Applications
• Introducing a Versatile 1G Ethernet PHY IP Core with BroadR-Reach™ Technology for Automotive and Industrial Applications
• Certus Semiconductor releases I/O library in TowerJazz's 65nm process
• Alphawave Semi and Arm to Present on Chiplets for Architecting Next-Generation Terabit AI Networks at the TSMC OIP Ecosystem Forum North America