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Sunday, September 22, 2024

• Codeplay Brings RISC-V Support to the oneAPI Construction Kit
• XtremeSilica Successfully Ships First SDRAM Controller for Tapeout GF40nm
• VyperCore plans 5nm RISC-V server chip and card
• TSMC and Samsung consider major chip manufacturing plants in UAE
• Synopsys Enters Definitive Agreement with Keysight Technologies For Sale of Optical Solutions Group
• RAAAM Memory Technologies and NXP Semiconductors Announce Collaboration to Implement High Density On-Chip Memory
• Omni Design Technologies extends partnership with EnSilica and expands Swiftâ„¢ Data Converter IP portfolio
• Omni Design Technologies extends partnership with EnSilica and expands Swift™ Data Converter IP portfolio
• JEDEC® Adds to Suite of Standards Supporting Compute Express Link® (CXL®) Memory Technology with Publication of Two New Documents
• JEDEC® Adds to Suite of Standards Supporting Compute Express Link® (CXL®) Memory Technology with Publication of Two New Documents
• Comcores and Extoll successfully completed the interoperability test of Comcores JESD204C IP core and Extoll SerDes PHY
• Analog Bits to Demonstrate Power Management and Embedded Clocking and High Accuracy Sensor IP at the TSMC 2024 Open Innovation Platform Ecosystem Forum
• Analog Bits to Demonstrate Numerous Test Chips Including Portfolio of Power Management and Embedded Clocking and High Accuracy Sensor IP in TSMC N3P Process at TSMC 2024 North America Technology Symposium
• Alphawave Semi - Interim results for the six months ended 30 June 2024
• €10m for European IoT 5G satellites

Thursday, September 19, 2024

• TSMC's Strategic Win: Full-Scale Semiconductor Production Starts Ahead of Schedule

Wednesday, September 18, 2024

• Synopsys Enters Definitive Agreement with Keysight Technologies For Sale of Optical Solutions Group
• Cryptomathic and PQShield form strategic alliance to offer PQC solutions for code signing and data protection in compliance with latest NIST and CNSA recommendations
• Advanced Packaging Drives New Memory Solutions for the AI Era

Tuesday, September 17, 2024

• SiFive Highlights Key Inflection Points Driving RISC-V Adoption for AI and Introduces Intelligence XM Series for AI Workload Acceleration
• RaaS, a collaborative initiative, adopted Menta's eFPGA technology for RaaS Edge Computing platform
• Cracks Emerge in U.S. CHIPS Act
• Chiplet Summit 2024 Shows How Advanced Packaging Keeps Moore's Law Alive
• Cadence Tensilica HiFi 5 DSPs Used in NXP's Next-Gen Audio DSP Family
• Cadence boss on what's wrong with India's semiconductor plan
• Alphawave Semi to Showcase Latest Advances in AI Connectivity IP at ECOC 2024

Monday, September 16, 2024

• Ultralight Edge AI Platform Unveiled
• More than 30 Projects, Overview of China's Semiconductor Industry Project Progress in 2024
• Intel signs up AWS for AI chips, splits off foundry business
• How the FPGA Came To Be, Did General Electric invent the PLD and EPLD in 1971?
• Chinese researchers develop ultra-efficient AI processor
• Andes core wins control slot in Rivos' RISC-V SoC
• Joachim Kunkel Joins Arteris Board of Directors
• Intel and AWS Expand Strategic Collaboration, Helping Advance U.S.-Based Chip Manufacturing

Monday, September 16, 2024

• Taking 5G into space

Sunday, September 15, 2024

• A message from Intel CEO Pat Gelsinger to employees regarding the next phase of Intel's transformation
• The CAN XL Controller IP Core with a complete safety package is now available for immediate licensing to high-end automotive and consumer applications
• Thalia launches AI-powered Layout Automation software with AMALIA 24.3
• Omni Design Technologies Partners with Aura Intelligent Systems on Next Generation Radar
• intoPIX Pre-Releases New JPEG XS IP-Cores & SDK with Master and Proxy Encoding at IBC 2024
• Expedera Appoints Siyad Ma as New CEO to Drive Expansion, Innovation
• Arm Accelerates AI From Cloud to Edge With New PyTorch and ExecuTorch Integrations to Deliver Immediate Performance Improvements for Developers

Saturday, September 14, 2024

• Samsung Secures US AI Chip Firm "Ambarella" Orders For Its 2nm Process, Signaling A Breakthrough

Thursday, September 12, 2024

• The Funding Gap in Green Technology: A Barrier to Progress
• SEALSQ Adopts RISC-V the Open-Standard RISC-V Architecture; Achievement Aligns with Rising Global Demand for Edge-AI and Machine Learning Applications
• NIST Releases First 3 Finalized Post-Quantum Encryption Standards
• Logic Design Solutions launches a new version of its NVMe HOST IP Targeting embedded recorder systems
• Enosemi and GlobalFoundries announce the availability of silicon-validated electronic-photonic design IP available in the GF Fotonix platform
• Arm Announces Appointment of Young Sohn to its Board of Directors

Wednesday, September 11, 2024

• Samsung's 2nm Yield Rate at Most 20%, Withdraws Personnel from Texas Taylor Plant
• intoPIX Launches Access Program for Titanium Viewer and Titanium Show Apps at IBC 2024 Amsterdam
• Imagination Announces Highest Performance Automotive GPU IP with FuSa Advancement
• Chevin Technology, Alpha-Data & Correct Designs collaborate to deliver fast and secure data offload for NASA-JPL's Airborne Visible/Infrared Imaging Spectrometer-3 (AVIRIS-3)
• Axiomise launches Essential Introduction to Practical Formal Verification Training

Tuesday, September 10, 2024

• Bluetooth 6.0 Channel Sounding is Here
• Sondrel appoints new Head of Projects
• Rivos Selects Andes NX45 for Control Functions in Upcoming High-Performance RISC-V SoC
• Logic Fruit Launches the Advanced Kritin iXD 6U VPX Single Board Computer (SBC)
• China wants to challenge the U.S. in AI – here's what Chinese giants are doing with the tech