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Sunday, September 8, 2024

• Inspired by neurons: Neuromorphic hardware and the future of chip design
• Tenstorrent and Movellus Form Strategic Engagement for Next-Generation Chiplet-Based AI and HPC Solutions
• T2M IP Unveils Advanced H.264 and H.265 HEVC Codec IP Cores for High-Efficiency Video Solutions
• SMIC cuts capex and R&D
• Semidynamics on major recruitment drive for RISC-V software engineers
• Qualitas Semiconductor Enters into Landmark the World's 1st 2nm MIPI DCPHY Licensing Agreement with Leading U.S. Fabless Company
• Lack of Fresh Money Threatens Green Tech Sector
• Alphawave Semi "Redefines Connectivity" in AI Hardware and Edge AI Summit 2024 Presentation on Chiplet Interconnects
• Advancing AI the Brazilian Way: Fostering Innovation Through Collaboration and Open Standards

Thursday, September 5, 2024

• U.S. seeking export controls on quantum computing; limited impact expected for S. Korean firms
• Samsung Partners with TSMC, Its Foundry Rival, on HBM4 Development
• Qualcomm Rumored to Consider Acquiring Parts of Intel's Chip Design Business, with a Focus on PC Segment
• China's DRAM Expansion Raises Concerns, Potentially Impacting Samsung and SK hynix Profits
• Adani Group partners Israel's Tower Semiconductor to build $10 billion chip plant in India: All details

Wednesday, September 4, 2024

• UMC Reports Sales for August 2024
• Two Indian startups showcase innovations at Semicon Taiwan 2024
• Quebec's AI hub drives semiconductor research and development
• Q2 2024 Global Semiconductor Equipment Billings Increased 4% Year-Over-Year, SEMI Reports
• GUC Monthly Sales Report - August 2024
• En route towards the first German quantum computer
• CAST Ships I2C/SPI Controller IP Core for Easier Serial Communication

Tuesday, September 3, 2024

• SiliconAuto adopts Siemens' PAVE360 to accelerate pre-silicon ADAS SoC development
• RISC-V Builds the Backbone of Three New Consumer Devices
• Global Semiconductor Sales Increase 18.7% Year-to-Year in July

Monday, September 2, 2024

• We are speaking, British Embassy, Paris, 3 October 2024 by PQShield
• Samsung and TSMC Unlikely to Be Buyers for Intel's Rumored Foundry Business Sale
• Europe's semiconductor sector calls for immediate 'Chips Act 2.0'
• EnSilica announces first production order for industrial ASIC
• CoreHW and Presto Engineering Announce Ground-breaking Collaboration to Advance Global Penetration of Ultra-low-power RF IoT Devices
• Blue Cheetah Collaborates with LG to Demonstrate Successful Silicon Bring-Up of Chiplet-Based Design

Sunday, September 1, 2024

• Urgent Orders Boost Wafer Foundry Utilization in Q2; Global Top 10 Foundry Revenue Grows 9.6% while VIS Climbs Two Spots, Says TrendForce
• Thalia joins Siemens digital twin marketplace for automotive
• STMicroelectronics joins Quintauris to boost RISC-V adoption
• SiFive and Arkmicro Accelerate RISC-V Adoption in Automotive Electronics with SiFive's Automotive IP for the High-end SoC Market
• Intel considers foundry split, fab cancellations
• Intel and Cadence Collaborate to Advance the All-Important UCIe Standard
• DeepX Hints At Next-Gen AI Chips
• Advanced USB 3.0 IP in 22nm boasting a very low power ULP and ULL Technology Licensed to Over 10 Global Customers
• OpenAI joins Apple in securing TSMC's A16 Angstrom process for in-house AI chip

Saturday, August 31, 2024

• Efficient Computer signs an agreement with GlobalFoundries to build MRAM chips on the GF 22FDX process

Friday, August 30, 2024

• Siemens brings industry leading Capital electrical and electronic systems design software to the cloud as a service
• Technology combinations for complex chip
• Will Intel split itself up after all?

Thursday, August 29, 2024

• Finwave Semiconductor and GlobalFoundries Partner on RF GaN-on-Si Technology for Cellular Handset Applications
• Efficient and GlobalFoundries Partner to Enable a New Category of Ultra Energy-Efficient, High-Performance Processors
• Lip-Bu Tan quit Intel board after "differences" with CEO, says Reuters
• Resiltech and Andes Technology Announce Collaboration to Deliver Advanced STL Solutions for Andes Automotive-Grade RISC-V Processor IP
• Samsung and TSMC competing to dominate 2nd-gen 3nm at global foundry industry
• Arasan Announces immediate availability of its I3C Host / Device Dual Role Controller IP

Wednesday, August 28, 2024

• F5 and Intel collaboration simplifies the security and delivery of AI services
• RISC-V Datacenter Future: SiFive P870-D Delivers Scalability
• Siemens joins Global Battery Alliance to accelerate sustainable battery development
• SK Hynix to apply chiplet tech to memory controller
• Accelerating AI with Essential Chips at GlobalFoundries Technology Summit 2024
• CEVA Wins Prestigious OFweek China Automotive Industry Award 2024
• PQShield and SiFive collaborate to advance post-quantum cryptography in RISC-V
• Xiphera Announces Quantum-Resistant Secure Boot