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Tuesday, August 13, 2024

• Akeana™ exits stealth mode with comprehensive RISC-V processor portfolio, challenging the semiconductor industry status quo
• Efinix Topaz RISC-V SoC FPGA Family for High Volume and Mass Market Applications
• Intel 18A Advanced Packaging is Key to Tech Leadership
• Akeana™ exits stealth mode with comprehensive RISC-V processor portfolio, challenging the semiconductor industry status quo
• OPENEDGES Unveils UCIe Chiplet Controller IP, Expanding Design Portfolio
• Ceva Expands its Market Share Leadership in Wireless Connectivity IP, Strengthening its Solutions for Smart Edge AI/IoT applications
• Chiplet interconnect pioneer Eliyan gains additional financial backing from AI chip ecosystem with strategic investment from VentureTech Alliance

Monday, August 12, 2024

• Synopsys's Plans to Buy Ansys for $35B Falls on UK Regulatory Radar
• Rapidus to Fully Automate 2nm Fab, Claiming Chip Delivery Times at One-Third of Its Competitors
• Agnisys Joins Arm Partner Program and Releases Solution Brief for Functionally Safe Arm-Based SoC Design
• Linux Foundation Welcomes the Open Model Initiative to Promote Openly Licensed AI Models
• Fraunhofer IPMS remains important research partner for GlobalFoundries Dresden
• AMD Completes Acquisition of Silo AI to Accelerate Development and Deployment of AI Models on AMD Hardware
• SMIC Reports 2024 Second Quarter Results
• TSMC July 2024 Revenue Report
• Rupert Baines joins Nanusens board
• Secure-IC signs International Collaboration with Taiwan Quantum Safe Association and PQC-CIA
• 16-Bit, 5MSPS SAR ADC IP Core Silicon-Proven: Delivers Superior Dynamic Performance with Flexible Resolution Modes for Next-Generation Applications
• Qualitas Semiconductor Expands Licensing Agreement with Key South Korean Fabless company
• TSMC's Expansion beyond 2nm Taking Shape? Angstrom-Class Fabs Possibly in Southern Taiwan
• EU project joins forces towards the era of scalable control technology for quantum processors

Sunday, August 11, 2024

• Korea's Memory Exports to Taiwan Surge 225% in 1H 2024 Driven by Strong HBM Demand

Thursday, August 8, 2024

• Raspberry Pi Launch New RP2350 Microcontroller and Pico 2 Development Board with RISC-V Support
• The Uberization of Engineering
• Scaling sustainability impact
• Simplifying AI Deployment from the Cloud to Edge and Endpoint

Wednesday, August 7, 2024

• Femtosense Combines AI Chiplet with MCU for Audio SiP
• Why Transceiver-Rich FPGAs Are Suitable for Vehicle Infotainment System Designs
• ZeroPoint Technologies introduces zstd Decompression Hardware IP
• Ceva, Inc. Announces Second Quarter 2024 Financial Results
• UMC Reports Sales for July 2024
• QuickLogic Announces Partnership with CTG to Strengthen Aerospace & Defense Supply Chain
• Imec demonstrates logic and DRAM structures using High NA EUV Lithography
• NVM Express Releases NVM Express Specifications to Unify AI, Cloud, Client, and Enterprise Storage

Tuesday, August 6, 2024

• Consult Red Announces Strategic Partnership with CAST, Inc.
• AI, 3D printing, electrification drive automotive supply chain
• NVM Express Releases NVM Express Specifications to Unify AI, Cloud, Client, and Enterprise Storage
• Silvaco To Present at the Rosenblatt 4th Annual Technology Summit
• Samsung Electronics Begins Mass Production of Industry's Thinnest LPDDR5X DRAM Packages for On-Device AI
• Intel Foundry Achieves Major Milestones

Monday, August 5, 2024

• ZeroPoint Technologies introduces LZ4 Compression and Decompression Hardware IP
• Imec: Getting High-Precision Sensors to Market
• Global Semiconductor Sales Increase 18.3% in Q2 2024 Compared to Q2 2023; Quarter-to-Quarter Sales Up 6.5%
• NEO Semiconductor Announces the Development of its 3D X-AI Chip; Targeted to Replace Existing HBM Chips and Solve Data Bus Bottlenecks
• Worldwide Silicon Wafer Shipments Increase 7% in Q2 2024, SEMI Reports
• Arteris Announces Financial Results for the Second Quarter 2024 and Third Quarter and Full Year 2024 Guidance
• Alphawave Semi Appoints Chief Accounting Officer, Sameer Ladiwala
• Crypto Quantique appoints ITEC to sell its IoT device security technology in Israel
• T2M-IP Unveils MIPI D-PHY v2.5 Tx and DSI Tx Controller v1.2: Silicon-Proven, Low-Power, Cost-Effective IP Core Solutions for Advanced SoCs
• GUC Monthly Sales Report - July 2024

Friday, August 2, 2024

• DDR5 Gains Enhanced Security, Reliability, and Power Management Features
• Intel once again confirms future Intel 10A node, Intel 14A process progresses smoothly

Thursday, August 1, 2024

• HCLTech recognized as Microsoft Partner of the Year for Dynamics 365 Service
• Renesas Completes Acquisition of Altium
• M31 cooperates with Tower Semiconductor to develop advanced SRAM and ROM solutions for its 65nm Power Management Platform
• Chip index collapses 7% as Arm punctures AI optimism
• Arm's calendar Q2 revenues up 39% y-o-y
• Scaling sustainability impact