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Tuesday, July 30, 2024

• Faraday Reports Second Quarter 2024 Results
• BAE Systems Partners with Siemens for Industry 4.0 Revolution
• Alphawave Semi Launches Industry's First 3nm UCIe IP with TSMC CoWoS Packaging
• Rambus Expands Industry-Leading Memory Interface Chip Offering to High-Performance PCs with DDR5 Client Clock Driver
• Rambus Reports Second Quarter 2024 Financial Results

Monday, July 29, 2024

• RAAAM Memory Technologies Secures 5.25M€ from the European Innovation Council for its Groundbreaking On-Chip Memory Solution

Monday, July 29, 2024

• Weebit Nano to present test results of ReRAM performance on GlobalFoundries 22FDX® wafers at FMS 2024

Monday, July 29, 2024

• It is reported that TSMC's A14 process will be put into risk trial production in the first half of 2026
• Tessolve partners with SigmaSense to develop their innovative DSP-based sensing ASIC
• Weebit Nano to present test results of ReRAM performance on GlobalFoundries 22FDX® wafers at FMS 2024
• RAAAM Memory Technologies Secures 5.25M€ from the European Innovation Council for its Groundbreaking On-Chip Memory Solution
• Raaam signs lead licensee for SRAM replacement technology
• Release of Post-Quantum Cryptographic Standards Is Imminent
• Silicon-Proven 14-Bit 4.32 GSps Wide Band ADC IP Core with Time-Interleaved Pipeline Architecture Now Available for Whitebox Licensing with No Royalty Fees

Friday, July 26, 2024

• New leap in Belgian quantum communication infrastructure: imec, UGent and Belnet realize first QKD links

Friday, July 26, 2024

• HCLTech launches Enterprise AI Foundry on Microsoft Azure
• DDR5 Gets More Security, Power Management Features
• Leveraging Safety Processor Expertise to Develop RISC-V Based Automotive Implementations
• Fractile raises $15m seed funding to develop radical new AI chip and unlock exponential performance improvements from frontier AI models

Thursday, July 25, 2024

• Ceva Bluetooth Low Energy and 802.15.4 IPs Bring Ultra-Low Power Wireless Connectivity to Alif Semiconductor's Balletto Family of MCUs
• Systems Designed Today Must Support Post-Quantum Cryptography Tomorrow
• Agile Analog delivers customizable IP on GlobalFoundries' FinFet and FDX processes
• Ian Walsh appointed as Sondrel's Regional VP for America
• Conference on Battery Direct Recycling 2024
• Sustainability vs. Progress: The Tightrope Walk of AI Chip Manufacturing
• The transformational impact of AI

Wednesday, July 24, 2024

• Alphawave IP Q2 revenues up 98% y-o-y
• Experts urge EU to increase investment in photonics
• Imec achieves record-low charge noise for Si MOS quantum dots fabricated on a 300mm CMOS platform
• Imagination Technologies announces new capital investment from Fortress Investment Group
• Efinix Releases Topaz Line of FPGAs, Delivering High Performance and Low Power to Mass Market Applications
• Alphawave Semi: Q2 2024 Trading and Business Update
• Comcores supports BAE systems as a key partner with JESD204C IP

Tuesday, July 23, 2024

• Infineon and Amkor Sign MoU to Boost Supply Chain Sustainability
• Faraday Adds Video Interface IP to Support All Advanced Planar Nodes on UMC Platform

Monday, July 22, 2024

• MIPI C-D Combo PHY and DSI Controller IP Cores, Silicon Proven, Immediate licensing at a Competitive Price for Your Next Project
• TSMC Reports Second Quarter EPS of NT$9.56
• U.S.-China Tech War Likely to Escalate, Analysts Say
• JEDEC Unveils Plans for DDR5 MRDIMM and LPDDR6 CAMM Standards to Propel High-Performance Computing and AI
• Samsung Slows Opening of Texas Fab Despite CHIPS Stimulus
• Source Photonics Licenses 800G Transceiver Module Designs from Intel
• China's EDA startup X-Epic forced to lay off staff, says report

Sunday, July 21, 2024

• Tenstorrent launches new Wormhole high-performance AI chip using RISC-V architecture

Friday, July 19, 2024

• Who Leads the Semiconductor Foundry Market?
• ARM SoC with GPU for space AI
• Tata Technologies partners with Arm to drive innovation in software-defined vehicles (SDVs)
• RISC-V Shows Ambitious Prospects in Europe

Thursday, July 18, 2024

• Andes and MachineWare Collaborate on Early RISC-V Software Development for AndesCoreâ„¢ AX45MPV

Thursday, July 18, 2024

• Resilient and Sustainable Supply of Functionally Reliable Materials: Fraunhofer Develops Digital Ecosystem
• EU and South Korea announce winners of four co-funded semiconductor projects
• TSMC Introduces "Foundry 2.0" to Include Packaging, Testing, Mask making and Others
• John Chubb becomes Sondrel's CEO
• CXL Fulfills AI's Need for Open Industry Standard Interconnect