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Tuesday, July 16, 2024

• Samsung Completes Validation of Industry's Fastest LPDDR5X for Use with MediaTek's Flagship Mobile Platform
• Expedera Achieves ISO 26262 ASIL-B Automotive Safety Certification
• Navigating the RISC-V Ecosystem
• Qualitas Semiconductor Announces First Domestic Development of PCIe 6.0 PHY IP
• Electronic System Design Industry Posts $4.5 Billion in Revenue in Q1 2024, ESD Alliance Reports (PRNewsfoto/SEMI)
• Crypto Quantique partners with silicon IP distributors across Asia to deliver quantum-driven chip security
• Allegro DVT Launches The Industry's First Real-Time VVC/H.266 Encoder IP

Monday, July 15, 2024

• AI-driven SRAM demand needs integrated repair and security
• Samsung to mass-produce HBM4 on 4 nm foundry process

Sunday, July 14, 2024

• OPENEDGES Successfully Validated Its 7nm HBM3 Testchip
• L&T Semiconductor to acquire chip design company SiliConch
• L&T Semiconductor Technologies Partners with CP Plus to develop Semiconductor Chips for CCTV Camera Solutions
• Advanced MIPI DSI Tx & Rx Controller IP Cores: Low-Power, Cost-Effective Solutions for Modern Display SoCs

Friday, July 12, 2024

• Alphawave Semi to form South Korean office
• Can Softbank Be An AI Supercomputer Player? Will Arm Lend A Hand?

Thursday, July 11, 2024

• SiFive Becomes First IP Supplier to Achieve Automotive ISO/SAE 21434:2021 Product Certification
• SEALSQ RISC-V Semiconductors is Pioneering Sustainability Through Decentralized Processing
• HCLTech delivers another solid quarter with revenue growth of 5.6% YoY (CC)
• Graphcore joins SoftBank Group to build next generation of AI compute

Wednesday, July 10, 2024

• TSMC June 2024 Revenue Report
• STMicroelectronics Integrates Ceva Cellular IoT Platform in its NB-IoT Industrial Module
• Samsung Electronics To Provide Turnkey Semiconductor Solutions With 2nm GAA process and 2.5D Package to Preferred Networks
• Keysight Joins the AI-RAN Alliance to Advance AI Innovations in Mobile Networks
• HBM4 memory standard is almost ready, according to JEDEC
• From wireless communication specialist to system provider

Wednesday, July 10, 2024

• Generative AI is Set To Be Adopted By 85% Of The Software Workforce Over The Next Two Years

Tuesday, July 9, 2024

• RISC-V Thrives Through Research, International Collaboration
• Pusan National University proposes backscatter comms for low-power IoT
• New MIPI SDCA Specification Simplifies Audio Software Architecture and Driver Requirements, Optimizing Integration of Audio Devices into Open Host Platforms
• JEDEC Approaches Finalization of HBM4 Standard, Eyes Future Innovations

Tuesday, July 9, 2024

• Imec’s Virtual Fab Strives for More Sustainable Chip Production

Monday, July 8, 2024

• Tiny titans: Unveiling the power of 2nm and 1nm chips
• Sustainable and intelligent infrastructure in Zermatt
• SiliconIntervention announces an innovative Fractal-D Audio Amplifier Family
• Siemens advances integrated circuit test and analysis at 5nm and below
• Samsung Electronics To Provide Turnkey Semiconductor Solutions With 2nm GAA Process and 2.5D Package to Preferred Networks
• MIPI C-PHY / D-PHY Combo IP (4.5Gbps) and CSI Tx Controller IP Cores, to meet the highest standards of performance and reliability for a wide range of applications
• Microchip Technology Expands Processing Portfolio to Include Multi-Core 64-bit Microprocessors
• Japan's semiconductor revival
• Imec's Virtual Fab Strives for More Sustainable Chip Production

Monday, July 8, 2024

• JEDEC® Announces Publication of Compute Express Link® (CXL®) Support Standards

Sunday, July 7, 2024

• Vybium, develops European AI/ML accelerators based on the Stream Computing NPU IP
• QuickLogic Announces $5.26 Million Contract Award
• JEDEC® Announces Publication of Compute Express Link® (CXL®) Support Standards
• GUC Monthly Sales Report - June 2024
• Global Semiconductor Sales Increase 19.3% Year-to-Year in May
• Addressing AI While Keeping the MIPSiness In MIPS

Thursday, July 4, 2024

• HCLTech sweeps top honors in the Institutional Investor Research Annual Asia Executive Team survey

Wednesday, July 3, 2024

• UMC Reports Sales for June 2024
• TSMC Reportedly Secures 3nm Order After Tapeout for Google's Tensor G5
• Quantum communication : How will 'quantum-secure' communication technologies develop in future?
• METASAT Project Celebrates 18 Months of Innovation: Key Developments in Satellite Technology
• How RISC-V is changing the server market
• EU project to develop advanced navigation for satellites