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Wednesday, June 19, 2024
Movellus Introduces Aeonic Powerâ„¢ Product Family for On-Die Voltage Regulation
Tuesday, June 18, 2024
onsemi selects Czech Republic for SiC production for advanced power semiconductors
Slide Shows Samsung May be Developing a RISC-V CPU for In-memory AI Chip
Intel 3 '3nm-class' process technology is in high-volume production
Rapidus Set to Open 2-nm Pilot Fab, CEO Says
EU proposes budget cuts to tech programmes in 2025
Why do defects occur in battery production? Explainable AI supports process optimization.
Global partnership unveils quantum-safe hardware root-of-trust for cellular IoT
Alphawave Reveals Multiprotocol I/O Chiplet Tapeout, Collabs with Arm, Samsung
YorChip announces Low Latency 200G Chiplet for edge AI
M31 Announces the Launch of Advanced LPDDR Memory IP to Support HPC Applications
Dream Chip and Cadence Demo Automotive SoC Featuring Tensilica AI IP at embedded world 2024
Movellus Introduces Aeonic Power™ Product Family for On-Die Voltage Regulation
OPENEDGES to Premiere PHY Vision 2.0 at Design Automation Conference 2024
Monday, June 17, 2024
Are We Prepared for Cyberthreats in The New Era of Transportation?
Samsung Foundry Struggles with Yield and Power Efficiency Issues
Intel 3 Represents an Intel Foundry Milestone
QuickLogic Joins Intel Foundry Accelerator IP and USMAG Alliance Programs
Faraday to Exhibit Next-gen ASIC Solutions at DAC 2024
Sequans Announces a New $15 Million Licensing Agreement
Sunday, June 16, 2024
Imec unveils CMOS-based 56Gb/s zero-IF D-band beamforming transmitter, featuring superior output power and energy efficiency
Initial members join CHERI Alliance to drive adoption of memory safety and scalable software compartmentalization
EU is mandating Digital Product Passports
Friday, June 14, 2024
Japan to send 200 engineers to U.S. for AI chip training at Tenstorrent
Codasip Claims 'Best-in-Class' RISC-V Core for Power-Conscious Designs
Wednesday, June 12, 2024
Cadence and Samsung Foundry Accelerate Chip Innovation for Advanced AI and 3D-IC Applications
Axiomise Heads to RISC-V Summit Europe June 25-27 in Munich
Flow Computing Emerges from Stealth with Licensable, On-Die Parallel Processing Enabling 100X Improved Performance For Any CPU Architecture
Alphawave Semi Tapes Out Industry-First, Multi-Protocol I/O Connectivity Chiplet for High-Performance Compute and AI Infrastructure
Consortium led by Crosshill Oy signs defense technology development agreement for F-35 Program with Lockheed Martin
Samsung Showcases AI-Era Vision and Latest Foundry Technologies at SFF 2024
Rapidus and IBM Expand Collaboration to Chiplet Packaging Technology
Siemens collaborates with Samsung Foundry to expand 3D-IC enablement tools, optimize other EDA solutions for foundry's newest processes
Sondrel secures major funding today
ADTechnology announces next-generation platform "ADP600" at Samsung Foundry Forum 2024
Synopsys Achieves Certification of its AI-driven Digital and Analog Flows and IP on Samsung Advanced SF2 GAA Process
Tuesday, June 11, 2024
SEMIFIVE Collaborates with OPENEDGES on Chiplet Development
Silvaco Announces Initiatives to Enhance Workforce Development in Semiconductor Industry
SureCore Balances Power and Cooling Costs With Cryogenic Memory
Alphawave Semi to Showcase Next-Generation PCIe® 7.0 IP Platform for High-Performance Connectivity and Compute at PCI-SIG® DevCon 2024
Rambus Unveils PCIe 7.0 IP Portfolio for High-Performance Data Center and AI SoCs
SEMIFIVE joins Arm Total Design with plans to develop Arm Neoverse-powered HPC Platform
Monday, June 10, 2024
Siemens and KU Leuven collaborate to research Digital Twin for Smart and Sustainable Products
Alphawave Semi Expands Partnership with Samsung Foundry to Further Drive Innovation at Advanced Semiconductor Nodes
Arteris Selected by Esperanto Technologies to Integrate RISC-V Processors for High-Performance AI and Machine Learning Solutions
Monday, June 10, 2024
HCLTech and Arm Collaborate on Custom Silicon Chips Optimized for AI Workloads
Sunday, June 9, 2024
Sondrel offers leading edge chip design teams
Global Semiconductor Sales Increase 15.8% Year-to-Year in April; New Industry Forecast Projects Market Growth of 16.0% in 2024
eXpreso eFPGA Compiler Achieves 98.6% Packing Density
Synopsys Accelerates Trillion Parameter HPC & AI Supercomputing Chip Designs with Industry's First PCIe 7.0 IP Solution
intoPIX Launches Titanium at InfoComm, Boosting professional AV-over-IP Workflow Efficiency
Introducing USB 3.0, PCIe 2.0 and SATA 3.0 Combo PHY IP Cores to empower Next Gen Connectivity Chipsets
OPENEDGES Announces Silicon-Proven Success of its LPDDR5X Combo PHY IP on Samsung Foundry's SF5A Technology
Friday, June 7, 2024
Nuvoton Develops OpenTitan® based Security Chip as Next Gen Security Solution for Chromebooks
Thursday, June 6, 2024
Andes RISC-V CON: Deep Dive into Automotive, AI Application Processors and Security Trend
Efabless Welcomes Weebit Nano's ReRAM to Its Custom Chip Design Platform
TSMC May 2024 Revenue Report
Nuvoton Develops OpenTitan® based Security Chip as Next Gen Security Solution for Chromebooks
MediaTek Joins Arm Total Design to Shape the Future of AI Computing
Mobiveil's PSRAM Controller IP Lets SoC Designers fully Leverage AP Memory's Ultra High Speed (UHS) PSRAM Memory
Sigasi Redefines Chip Design Creation, Integration, Validation Leveraging Shift-Left Principles
Andes Technology Announces the Annual ANDES RISC-V CON on June 11th at the DoubleTree San Jose Hotel
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