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Wednesday, May 8, 2024

• GlobalFoundries' Q1 2024 Revenue Down 16% YoY, Decline Limited by Automotive Growth
• Qualitas to raise funds for research into UCIe PHY IP for chiplets
• X-Silicon Announces a NEW Low-Power Open-Standard Vulkan-Enabled C-GPUâ„¢ - a RISC-V Vector CPU Infused with GPU ISA and AI/ML acceleration in a Single Processor Core
• Sondrel awarded new Video Processor ASIC design and supply contract for a leading provider of High-Performance Video systems
• Ceva, Inc. Announces First Quarter 2024 Financial Results
• Arm revenues up 47%; shares fall
• Silvaco Announces Pricing of Initial Public Offering
• X-Silicon Announces a NEW Low-Power Open-Standard Vulkan-Enabled C-GPU™ - a RISC-V Vector CPU Infused with GPU ISA and AI/ML acceleration in a Single Processor Core
• Softbank reported to be in talks to buy Graphcore
• VESA Elevates PC and Laptop HDR Display Performance with Updated DisplayHDR Specification
• SAPEON Enhances AI Accelerator with proteanTecs Reliability and Performance Monitoring

Tuesday, May 7, 2024

• FMD's Albert Heuberger: Supporting Heterogeneous System Integration
• TSMC crunch heralds good days for advanced packaging
• Credo Schedules Fourth Quarter and Fiscal Year 2024 Financial Results Conference Call
• Cybersecurity professionals say generative AI can be exploited in cyberattacks - but it can also be a powerful defense
• TSMC Certifies a Host of Top EDA Tools for New Process Nodes
• Rapidus and Fraunhofer IZM join Forces for High-End Performance Packaging
• Samsung tapes out 3nm mobile processor, closing gap with TSMC
• sureCore announces successful tape-out of cryogenic IP demonstrator
• Arasan's Total MIPI Camera IP solution with CSI and C-PHY achieve ISO26262 Certification

Monday, May 6, 2024

• Kudelski IoT Selected as One of Zoom's Authorized Hardware Certification Testing Labs
• Apple M4 moves to TSMC N3E
• Siemens delivers end-to-end silicon quality assurance for next-generation IC designs with new Solido IP Validation Suite
• UMC Reports Sales for April 2024
• Synopsys collaborates with TSMC on 2nm IP portfolio and photonics ICs

Monday, May 6, 2024

• PCI-SIG® Announces CopprLinkâ„¢ Cable Specifications for PCIe® 5.0 and 6.0 Technology

Sunday, May 5, 2024

• Why Synopsys is selling its application security testing business
• BrainChip, Gaisler work on AI in space
• GUC Monthly Sales Report - April 2024
• Q3 FY24 Quarterly Activities Report: Weebit Nano advancing negotiations with partners and customers; demonstrates ReRAM robustness
• oneNav announces the first L5-direct GNSS receiver technology
• Synopsys Enters Definitive Agreement to Sell its Software Integrity Business to Clearlake Capital and Francisco Partners
• Zhuhai Chuangfeixin: OTP IP Based on 55nm High-Voltage Process Successfully Qualified for Listing
• Arm Brings Transformers to IoT Devices
• Arteris Announces Financial Results for the First Quarter 2024 and Second Quarter and Full Year 2024 Guidance
• A Conversation with GlobalFoundries Europe's Manfred Horstmann
• Fabless semiconductor startup Mindgrove launches India's first indigenously designed commercial high-performance MCU chip
• BrainChip and Frontgrade Gaisler to Augment Space-Grade Microprocessors with AI Capabilities
• Announcing Availability of Silicon-Proven 12bit 1Msps SAR ADC IP Core for Whitebox Licensing with Royalty Free

Friday, May 3, 2024

• Arm Brings Transformers to IoT Devices

Thursday, May 2, 2024

• Alphawave Semi announced today a refocussing of the Board of Directors after reaching the three-year milestone since the Company's IPO
• Synopsys and Samsung Electronics Collaborate to Achieve First Production Tapeout of Flagship Mobile CPU with Leading Performance on Samsung Foundry's GAA Process

Wednesday, May 1, 2024

• Intel aims to produce scalable silicon-based quantum processors
• Radiation-Tolerant PolarFire® SoC FPGAs Offer Low Power, Zero Configuration Upsets, RISC-V Architecture for Space Applications
• GOWIN's progress in global automotive market gathers momentum with award of ISO 26262 certification for its FPGA design environment
• Worldwide Silicon Wafer Shipments Dip 5% in Q1 2024, SEMI Reports
• Radiation-Tolerant PolarFire® SoC FPGAs Offer Low Power, Zero Configuration Upsets, RISC-V Architecture for Space Applications
• PCI-SIG® Announces CopprLink™ Cable Specifications for PCIe® 5.0 and 6.0 Technology

Tuesday, April 30, 2024

• Synopsys 3DIO Solution for Multi-Die Integration (2.5D/3D)
• The End of an Era: Zilog Discontinues the Z80 Microprocessor
• Radiation-Tolerant RISC-V FPGA for Linux in space
• Rapid Silicon Introduces Revolutionary Rapid eFPGA Configurator for Hassle Free Embedded FPGA Evaluation
• QuickLogic Releases Aurora 2.6 with Expanded Operating System Support and Up to 15% Faster Performance
• Packetcraft Delivers Bluetooth Software Enabling Channel Sounding to Early Access Licensees

Monday, April 29, 2024

• Samsung Q1 profit up 10x
• Synopsys Introduces Polaris Assist: AI-Powered Application Security Assistant
• TSMC Certifies Ansys Multiphysics Platforms, Enabling Next-Gen AI and HPC Chips
• Silvaco Announces Launch of Initial Public Offering

Sunday, April 28, 2024

• Rambus Reports First Quarter 2024 Financial Results
• STMicroelectronics hits 71% renewable electricity, targets 100% by 2027
• Rambus Expands Chipset for Advanced Data Center Memory Modules with DDR5 Server PMICs
• Siemens' tools certified for TSMC N2
• Arm China's ex-CEO sets up RISC-V company
• EDA toolset parade at TSMC's U.S. design symposium
• TSMC's A16 Process Moves Goalposts in Tech-Leadership Game
• Altera in negotiation on private equity partner
• CAN FD Controller & LIN 2.1 Controller IP Cores, Available for Immediate Licensing with Proven Automotive Compatibility