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Friday, January 30, 2026

• Qualitas Semiconductor Secures Strategic IP Licensing Agreement for MIPI Solutions

Thursday, January 29, 2026

• Chips for Defence; an EU initiative
• Europe’s leadership in photonic chips under threat
• Lightmatter and Cadence Collaborate to Accelerate Optical Interconnect for AI Infrastructure
• Veeco and imec develop 300mm compatible process to enable integration of barium titanate on silicon photonics
• NanoXplore and STMicroelectronics deliver European FPGA for space missions
• MosChip Completes 28-nm SoC for India’s Space Center
• Tenstorrent Announces Participation in CHASSIS Program, Joint Initiative for Automotive Chiplet Technology
• The OpenHW Foundation unveils the first industry-ready RISC-V ecosystem to advance European digital sovereignty
• MIPS Takes ‘Software-First Approach’ With New RISC-V NPUs
• Keysight Launches Wireless Coexistence Test Solution to Accelerate Compliance and Innovation
• Chiplet Summit Announces Pre-Conference Day Schedule
• NVIDIA Looks to Intel’s 18A/14A Process and EMIB Packaging for Next-Gen Feynman AI Chips, Signaling a Major Foundry Shift Beyond TSMC

Wednesday, January 28, 2026

• Nuclei Announces Strategic Global Expansion to Accelerate RISC-V Adoption in 2026
• TES is extending its PMU IP portfolio for X-FAB’s XT018 - 0.18µm BCD-on-SOI technology.

Tuesday, January 27, 2026

• Lightmatter and GUC Partner to Produce Co-Packaged Optics (CPO) Solutions for AI Hyperscalers

Monday, January 26, 2026

• Microservice Store Announces Security Manager (iSM) for Embedded Systems
• Rapidus sets sights on 2nm chip production as investment interest grows
• DCD-SEMI to Exhibit at SEMICON Korea 2026 with EU Mission Hub
• 2026 Outlook With Mahesh Tirupattur of Analog Bits
• Korea, Italy agree to deepen ties in AI, chips, space and beyond
• Warning signs for semiconductor market in AI boom
• Keysight Powers the Future of e-Mobility with Test Solutions for High-Power and Megawatt Charging
• Software-Defined Systems: Reshaping the Future of Modern Cars
• Cadence Unwraps DSP IP Purpose-Built for Next-Gen Voice AI and Audio
• Frontgrade Gaisler is proud to be a part of the ePERFECT project
• LPDDR6 Has Arrived ! Innosilicon Technology Delivers LPDDR6 Subsystem IP to Leading Clients
• QuickLogic Announces Orders for Strategic Radiation Hardened FPGA Development Kit
• TSMC to Cut Fab14 Mature-Node Capacity by 15%-20% to Reflect Changing Demand Mix
• Microservice Store Launches Embedded Microservices: The Foundational Technology for the Digital Marketplace in Embedded Systems

Friday, January 23, 2026

• PlexusAV And IntoPIX Strengthen IPMX Ecosystem With New P-AVN-4 Featuring JPEG XS TDC
• YorChip and Sofics Expand UCIe PHY Across TSMC Nodes

Thursday, January 22, 2026

• Vietnam breaks ground on first semiconductor chip plant in Hanoi
• Synopsys Announces New Converge Conference, March 11-12, to Drive Intelligent Systems Innovation
• CEA-Leti Demonstrates Combined MicroLED and Organic Photodetector Architecture For Display-Integrated Optical Sensing
• CEA-Leti Advances Silicon-Integrated Quantum Cascade Lasers for Mid-Infrared Photonics
• Italy’s Quiet Exposure to China in Automotive and Power Chips
• Keysight Collaborates on Airbus UpNext SpaceRAN Demonstrator to Advance 5G NTN Innovation
• EU Council backs creation of AI gigafactories in Europe
• Spiking Performance in AI Applications
• TES offers PKCS IP Core for System-on-Chip (SoC) Designs
• 'ReRAM is the replacement for (NAND) flash': $170 billion US tech company backs tiny startup in race to find the holy Grail of universal memory
• Siemens Introduces New Type of Digital Twin Software for SDV Development
• Samsung Reportedly Moves Custom HBM Logic Die to 2nm Foundry Process for the First Time
• Why Quobly, STMicro, Soitec See Quantum as a Manufacturing Challenge
• Dolphin Semiconductor Marks its First Anniversary with Major Expansion Push and Active Merge & Acquisition Strategy
• Cadence Unveils Tensilica HiFi iQ DSP Purpose-Built for Next-Generation Voice AI and Audio Applications

Monday, January 19, 2026

• TSMC Reports Fourth Quarter EPS of NT$19.50
• Sassine Ghazi 2026 Letter to Stakeholders: Re-engineering Engineering in the Age of AI
• Portugal enters the European semiconductor map
• Why PICs Power Next-Gen Data Centers and Quantum-Safe Security
• NVIDIA Includes Ethernet Photonics in New Six-Chip AI Rubin Platform
• Defending the Digital Highway: Cybersecurity for Software-Defined Vehicles
• Keysight Unveils Machine Learning Toolkit to Accelerate Device Modeling and PDK Development
• TSMC Will Struggle to Meet AI Demand for Years, Analysts Say
• Chips&Media Accelerates AI-Based Video IP Evolution and Autonomous Driving Reference Expansion
• Processors for Smart Manufacturing
• SiFive to Power Next-Gen RISC-V AI Data Centers with NVIDIA NVLink Fusion
• Breakthrough in silicon switches: Prof. Hua Wang’s IDEAS Group presents new class of high-frequency switches in "Nature Electronics"
• Samsung perfecting 2nm Exynos 2600 yields, TSMC eyes 1.6nm in 2026
• Samsung to close down one of its 8-inch foundry fabs within the year
• T2M Presents TGE200 RISC-V IP Core: Ultra-Low-Power for IoT & MCU Platforms