Search News

Sunday, September 1, 2024

• Urgent Orders Boost Wafer Foundry Utilization in Q2; Global Top 10 Foundry Revenue Grows 9.6% while VIS Climbs Two Spots, Says TrendForce
• Thalia joins Siemens digital twin marketplace for automotive
• STMicroelectronics joins Quintauris to boost RISC-V adoption
• SiFive and Arkmicro Accelerate RISC-V Adoption in Automotive Electronics with SiFive's Automotive IP for the High-end SoC Market
• Intel considers foundry split, fab cancellations
• Intel and Cadence Collaborate to Advance the All-Important UCIe Standard
• DeepX Hints At Next-Gen AI Chips
• Advanced USB 3.0 IP in 22nm boasting a very low power ULP and ULL Technology Licensed to Over 10 Global Customers
• OpenAI joins Apple in securing TSMC's A16 Angstrom process for in-house AI chip

Saturday, August 31, 2024

• Efficient Computer signs an agreement with GlobalFoundries to build MRAM chips on the GF 22FDX process

Friday, August 30, 2024

• Siemens brings industry leading Capital electrical and electronic systems design software to the cloud as a service
• Technology combinations for complex chip
• Will Intel split itself up after all?

Thursday, August 29, 2024

• Finwave Semiconductor and GlobalFoundries Partner on RF GaN-on-Si Technology for Cellular Handset Applications
• Efficient and GlobalFoundries Partner to Enable a New Category of Ultra Energy-Efficient, High-Performance Processors
• Lip-Bu Tan quit Intel board after "differences" with CEO, says Reuters
• Resiltech and Andes Technology Announce Collaboration to Deliver Advanced STL Solutions for Andes Automotive-Grade RISC-V Processor IP
• Samsung and TSMC competing to dominate 2nd-gen 3nm at global foundry industry
• Arasan Announces immediate availability of its I3C Host / Device Dual Role Controller IP

Wednesday, August 28, 2024

• F5 and Intel collaboration simplifies the security and delivery of AI services
• RISC-V Datacenter Future: SiFive P870-D Delivers Scalability
• Siemens joins Global Battery Alliance to accelerate sustainable battery development
• SK Hynix to apply chiplet tech to memory controller
• Accelerating AI with Essential Chips at GlobalFoundries Technology Summit 2024
• CEVA Wins Prestigious OFweek China Automotive Industry Award 2024
• PQShield and SiFive collaborate to advance post-quantum cryptography in RISC-V
• Xiphera Announces Quantum-Resistant Secure Boot

Tuesday, August 27, 2024

• Strategies to Dominate the AI Accelerator Market
• Samsung's Foundry Strategy Focuses on AI/HPC Growth and Enhanced 2nm Process Amid TSMC's Dominance
• Intel pursues successes in the 18A manufacturing process
• Kudelski IoT Security IP Audit Provides High Level of Confidence for Semiconductor Manufacturers Seeking Common Criteria Certification
• GigaDevice Semiconductor expands its Arm MCU product roadmap through Arm Total Access
• Crypto Quantique Unveils Open-Source Randomness Test Suite for Physical Unclonable Functions
• Dolphin Design announces partnership with Fraunhofer IIS to enhance power management in edge AI

Sunday, August 25, 2024

• Senior Intel CPU architects splinter to develop RISC-V processors - veterans establish AheadComputing

Thursday, August 22, 2024

• Siemens recognized as a leader in building decarbonization consulting
• Cadence Launches Fem.AI, Pledges $20M to Kickstart Gender Equity in the AI Workforce
• JEDEC Releases New Standard for LPDDR5/5X Serial Presence Detect (SPD) Contents
• Report says that promise of AI relies on scaling security as edge AI booms
• intoPIX Solutions Tackle the Biggest Challenges in Automotive Imaging at ADAS & Autonomous Vehicle Expo 2024
• Samsung's new 2 nm foundry process to cut chip size by 17%
• PQSecure Joins the Post-Quantum Cryptography Coalition (PQCC)
• Everspin Awarded $14.55M to Provide Continued, Stable On-Shore MRAM Manufacturing
• Synopsys Posts Financial Results for Third Quarter Fiscal Year 2024

Wednesday, August 21, 2024

• European Commission permits 'first-of-its-kind' microchip manufacturing plant
• Chip design software firm Synopsys delivers record revenue as AI accelerates demand
• Going Beyond Ethernet: Securing Automotive Networks with MACsec
• Industrial Maintenance: How AI Can Predict Failures Before They Happen
• New RISC-V Innovations Lead AI to Open Standard
• ESMC Breaks Ground on Dresden Fab