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Monday, August 5, 2024

• ZeroPoint Technologies introduces LZ4 Compression and Decompression Hardware IP
• Imec: Getting High-Precision Sensors to Market
• Global Semiconductor Sales Increase 18.3% in Q2 2024 Compared to Q2 2023; Quarter-to-Quarter Sales Up 6.5%
• NEO Semiconductor Announces the Development of its 3D X-AI Chip; Targeted to Replace Existing HBM Chips and Solve Data Bus Bottlenecks
• Worldwide Silicon Wafer Shipments Increase 7% in Q2 2024, SEMI Reports
• Arteris Announces Financial Results for the Second Quarter 2024 and Third Quarter and Full Year 2024 Guidance
• Alphawave Semi Appoints Chief Accounting Officer, Sameer Ladiwala
• Crypto Quantique appoints ITEC to sell its IoT device security technology in Israel
• T2M-IP Unveils MIPI D-PHY v2.5 Tx and DSI Tx Controller v1.2: Silicon-Proven, Low-Power, Cost-Effective IP Core Solutions for Advanced SoCs
• GUC Monthly Sales Report - July 2024

Friday, August 2, 2024

• DDR5 Gains Enhanced Security, Reliability, and Power Management Features
• Intel once again confirms future Intel 10A node, Intel 14A process progresses smoothly

Thursday, August 1, 2024

• HCLTech recognized as Microsoft Partner of the Year for Dynamics 365 Service
• Renesas Completes Acquisition of Altium
• M31 cooperates with Tower Semiconductor to develop advanced SRAM and ROM solutions for its 65nm Power Management Platform
• Chip index collapses 7% as Arm punctures AI optimism
• Arm's calendar Q2 revenues up 39% y-o-y
• Scaling sustainability impact

Wednesday, July 31, 2024

• Samsung Sees Solid Demand for 3nm in 2H24, Aiming a Ninefold Increase in AI/HPC Sales by 2028
• Samsung set to ship HBM3E chips in H2 after strong H1
• Europe launches 'AI Factories'
• QuickLogic Signs Distribution Agreement with Astute Electronics to Expand Global Reach
• Weebit Nano and DB HiTek tape-out ReRAM module in DB HiTek's 130nm BCD process
• Sondrel's SFA 100 is ideal for AI at the Edge
• FuriosaAI and GUC Partner on RNGD, the Most Efficient AI Accelerator for LLMs
• Weebit Nano moves closer to availability at DB HiTek; tapes out first chip

Tuesday, July 30, 2024

• Faraday Reports Second Quarter 2024 Results
• BAE Systems Partners with Siemens for Industry 4.0 Revolution
• Alphawave Semi Launches Industry's First 3nm UCIe IP with TSMC CoWoS Packaging
• Rambus Expands Industry-Leading Memory Interface Chip Offering to High-Performance PCs with DDR5 Client Clock Driver
• Rambus Reports Second Quarter 2024 Financial Results

Monday, July 29, 2024

• RAAAM Memory Technologies Secures 5.25M€ from the European Innovation Council for its Groundbreaking On-Chip Memory Solution

Monday, July 29, 2024

• Weebit Nano to present test results of ReRAM performance on GlobalFoundries 22FDX® wafers at FMS 2024

Monday, July 29, 2024

• It is reported that TSMC's A14 process will be put into risk trial production in the first half of 2026
• Tessolve partners with SigmaSense to develop their innovative DSP-based sensing ASIC
• Weebit Nano to present test results of ReRAM performance on GlobalFoundries 22FDX® wafers at FMS 2024
• RAAAM Memory Technologies Secures 5.25M€ from the European Innovation Council for its Groundbreaking On-Chip Memory Solution
• Raaam signs lead licensee for SRAM replacement technology
• Release of Post-Quantum Cryptographic Standards Is Imminent
• Silicon-Proven 14-Bit 4.32 GSps Wide Band ADC IP Core with Time-Interleaved Pipeline Architecture Now Available for Whitebox Licensing with No Royalty Fees

Friday, July 26, 2024

• New leap in Belgian quantum communication infrastructure: imec, UGent and Belnet realize first QKD links

Friday, July 26, 2024

• HCLTech launches Enterprise AI Foundry on Microsoft Azure
• DDR5 Gets More Security, Power Management Features
• Leveraging Safety Processor Expertise to Develop RISC-V Based Automotive Implementations
• Fractile raises $15m seed funding to develop radical new AI chip and unlock exponential performance improvements from frontier AI models

Thursday, July 25, 2024

• Ceva Bluetooth Low Energy and 802.15.4 IPs Bring Ultra-Low Power Wireless Connectivity to Alif Semiconductor's Balletto Family of MCUs
• Systems Designed Today Must Support Post-Quantum Cryptography Tomorrow
• Agile Analog delivers customizable IP on GlobalFoundries' FinFet and FDX processes
• Ian Walsh appointed as Sondrel's Regional VP for America
• Conference on Battery Direct Recycling 2024
• Sustainability vs. Progress: The Tightrope Walk of AI Chip Manufacturing
• The transformational impact of AI

Wednesday, July 24, 2024

• Alphawave IP Q2 revenues up 98% y-o-y
• Experts urge EU to increase investment in photonics
• Imec achieves record-low charge noise for Si MOS quantum dots fabricated on a 300mm CMOS platform
• Imagination Technologies announces new capital investment from Fortress Investment Group
• Efinix Releases Topaz Line of FPGAs, Delivering High Performance and Low Power to Mass Market Applications
• Alphawave Semi: Q2 2024 Trading and Business Update
• Comcores supports BAE systems as a key partner with JESD204C IP