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Monday, July 8, 2024

• JEDEC® Announces Publication of Compute Express Link® (CXL®) Support Standards

Sunday, July 7, 2024

• Vybium, develops European AI/ML accelerators based on the Stream Computing NPU IP
• QuickLogic Announces $5.26 Million Contract Award
• JEDEC® Announces Publication of Compute Express Link® (CXL®) Support Standards
• GUC Monthly Sales Report - June 2024
• Global Semiconductor Sales Increase 19.3% Year-to-Year in May
• Addressing AI While Keeping the MIPSiness In MIPS

Thursday, July 4, 2024

• HCLTech sweeps top honors in the Institutional Investor Research Annual Asia Executive Team survey

Wednesday, July 3, 2024

• UMC Reports Sales for June 2024
• TSMC Reportedly Secures 3nm Order After Tapeout for Google's Tensor G5
• Quantum communication : How will 'quantum-secure' communication technologies develop in future?
• METASAT Project Celebrates 18 Months of Innovation: Key Developments in Satellite Technology
• How RISC-V is changing the server market
• EU project to develop advanced navigation for satellites

Tuesday, July 2, 2024

• YorChip predicts 2026 will be the year of the chiplet
• Siemens and Boson Energy enter agreement to accelerate the green energy transition through waste-to-hydrogen (to-X) technology
• New European Semiconductor Company, Vybium, develops European AI/ML accelerators based on the Stream Computing NPU IP
• How AI impacts the qualification of safety-critical automotive software
• Google Shifts Foundry Partnership from Samsung to TSMC for Tensor G5 Chip
• eMemory's Security-Enhanced OTP Qualifies on TSMC N5A Process Specializing in High-Performance Automotive Chips

Monday, July 1, 2024

• Tiempo Secure and Menta announce strategic partnership to enhance security solutions
• Renesas and Altium Announce the Conclusion of the Regulatory Review for Renesas' Proposed Acquisition of Altium
• Mixel Announces Immediate Availability of MIPI C-PHY/D-PHY Combo IP on STMicroelectronics 40LP Process Technology
• Introducing Next-Generation Security IPs: Unmatched Protection with EEC, AES, SHA-2, CRP1A, and ECDSA
• GlobalFoundries acquires Tagore Technology's GaN technology
• Flex Logix Boosts AI Accelerator Performance and Long-Term Efficiency
• C-DAC partners with MosChip and Socionext for design of HPC Processor AUM based on Arm architecture

Sunday, June 30, 2024

• Creating a Center of Excellence for IC Design
• CEO Interview: Sameer Wasson of MIPS -- "Have a Steady Hand, Don't be Distracted"
• Building Intel's Foundry Ecosystem for the AI Era
• Arteris Joins Russell 2000® Index
• Arteris Joins Russell 2000® Index
• Altair Signs Agreement to Acquire Metrics Design Automation Inc. Expands Footprint in EDA Industry

Saturday, June 29, 2024

• EDA Companies Unite With Samsung for AI and 3D IC Technology

Thursday, June 27, 2024

• STMicroelectronics restructures for the AI age
• RISC-V Summit Europe News - Processor IP, Verification Tools, and More

Wednesday, June 26, 2024

• Rambus offers DDR5 server PMICs to address AI workloads
• Frontgrade Gaisler Awarded ESA Contract to Qualify Spacecraft Avionics Microcontroller for Flight
• Faraday Joins Intel Foundry Accelerator Design Services Alliance to Target Advanced Applications
• Crafting a Silicon Lifecycle Management Strategy for HPC and Data Centers
• Axelera AI raises $68m for data centre push
• All systems go for 7nm FDSOI

Wednesday, June 26, 2024

• Lattice Introduces New Secure Control FPGA Family with Advanced Crypto-Agility and Hardware Root of Trust

Tuesday, June 25, 2024

• M31 Debuts at the North American Design Automation Conference, Showcasing IP Solutions for Advanced Processes
• Cadence Expands System IP Portfolio with Network on Chip to Optimize Electronic System Connectivity
• Tenstorrent To Offer AI Workstation For Developers
• FortifyIQ Introduces FortiPKA-RISC-V: A Breakthrough in Public Key Cryptography Acceleration

Tuesday, June 25, 2024

• Cypress Delivers Media Transfer Protocol Reference Design For Portable Media Players