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Thursday, April 17, 2025
JEDEC® and Industry Leaders Collaborate to Release JESD270-4 HBM4 Standard: Advancing Bandwidth, Efficiency, and Capacity for AI and HPC
JEDEC® and Industry Leaders Collaborate to Release JESD270-4 HBM4 Standard: Advancing Bandwidth, Efficiency, and Capacity for AI and HPC
ASML targeted in latest round of US tariffs
BrainChip Gives the Edge to Search and Rescue Operations
JEDEC® and Industry Leaders Collaborate to Release JESD270-4 HBM4 Standard: Advancing Bandwidth, Efficiency, and Capacity for AI and HPC
Creonic Unveils Bold Rebrand to Drive Innovation in Communication Technologies
Andes Technology Celebrates 20 Years with New Logo and Headquarters Expansion
Wednesday, April 16, 2025
Has AI Finally Destroyed the Need for Software Testing?
Samsung achieves 40%+ test yields with 4nm logic die
Equal1 Validates CMOS-Compatible Silicon Spin Qubit Platform Using GlobalFoundries' 22FDX Process
Taiwan to focus on silicon photonics, build new economic shield
Silicon Photonics Enables Low-power AI Accelerator Platform
Smart and compact sensors with Edge-AI
VeriSilicon Launches Ultra-Low Power OpenGL ES GPU with Hybrid 3D/2.5D Rendering for Wearables
How NoC architecture solves MCU design challenges
Secafy selects Siemens' EDA tools for innovative hardware security development
Orthogone Technologies and Blackcore® Technologies Announce Strategic Partnership to Deliver Ultra-Low Latency Solutions for High-Frequency Trading
AMD Achieves First TSMC N2 Product Silicon Milestone
Cadence to Acquire Arm Artisan Foundation IP Business
Intel Announces Strategic Investment by Silver Lake in Altera
Tuesday, April 15, 2025
Korea unveils massive $23.2B semiconductor support plan
Vertex Growth commits €10M in Dolphin Semiconductor
New TSN-MACsec IP core for secure data transmission in 5G/6G communication networks
Vertex Growth commits €10M in Dolphin Semiconductor
eDP/DP 1.4 Tx PHY & Controller IP Cores Now Available to Meet Rising Demand for High-Performance Display Solutions with Next-Gen Visual Connectivity
Doteck Integrates intoPIX JPEG XS for High-Performance ST 2110 8K & 4K Encoding
Gartner Says Worldwide Semiconductor Revenue Grew 21% in 2024
Monday, April 14, 2025
BOS Semiconductors at Auto Shanghai 2025
Omni Design Technologies Offers 3nm, Single Core-voltage Supply Rail Process, Voltage and Temperature (PVT) Monitor
EnSilica - Ongoing Investment in Space Industry Fuelling Silicon Chip Demand
Why Do Hyperscalers Design Their Own CPUs?
Expedera Achieves ISO 9001:2015 Certification for Quality Management Systems
Beware of the Open-Source Licensing Gap
Defacto Technologies Automates Front-End SoC Integration for Large RISC-V Designs
Friday, April 11, 2025
Semiconductor Companies Make Strategic Acquisitions to Bolster Portfolios
Thursday, April 10, 2025
Samsung Reportedly Begins 1nm Process Development, Targets 2029 Mass Production
Wednesday, April 9, 2025
TSMC March 2025 Revenue Report
VeriSilicon Unveils a High-Efficiency LCEVC Video Decoder Supporting 8K Ultra HD
EnSilica Signs MoU with European Satellite Operator
Ubuntu developer images now available for OrangePi RV2: a low-cost RISC-V SBC
Hailo Selects Avnet ASIC as Channel Partner for TSMC Silicon Production
Wednesday, April 9, 2025
Kandou AI Appoints Srujan Linga as CEO and Amin Shokrollahi as CTO
UMC Reports Sales for March 2025
Blumind Secures Series A Funding to Accelerate Analog AI Revolution
Cyient Announces the Launch of Semiconductor Subsidiary
Time-Sensitive Networking: the factory's traffic cop
Cadence Urges Tech Leaders to Push Data Centre Innovation
Semiwise Completes the Development of the Virtual Reality Semiconductor Fabrication Training Facility
Tuesday, April 8, 2025
Kandou AI Appoints Srujan Linga as CEO and Amin Shokrollahi as CTO
Blumind Secures Series A Funding to Accelerate Analog AI Revolution
Cyient Announces the Launch of Semiconductor Subsidiary
UMC Reports Sales for March 2025
Time-Sensitive Networking: the factory's traffic cop
Cadence Urges Tech Leaders to Push Data Centre Innovation
Semiwise Completes the Development of the Virtual Reality Semiconductor Fabrication Training Facility
Tuesday, April 8, 2025
GUC Monthly Sales Report - March 2025
Tuesday, April 8, 2025
Dnotitia and Hanyang University Launch Open-Source Platform Benchmarking AI Quantization
Monday, April 7, 2025
Siemens acquires DownStream Technologies to expand PCB design-to-manufacturing flow
Call to boost energy security in Europe
Arm Powers Software-Defined Vehicle Revolution
Alliance Aims to Deliver Memory-Optimized AI for Inferencing
ZeroPoint and Rebellions Forge Strategic Alliance to Revolutionize AI Accelerator Performance and Efficiency
Infineon further strengthens its number one position in automotive microcontrollers and boosts systems capabilities for software-defined vehicles with acquisition of Marvell's Automotive Ethernet business
JPEG XS Technology Integrated by Cobalt Digital with intoPIX TicoXS FIP Codec, supporting High Profile and new TDC Profile
Monday, April 7, 2025
Infineon Technologies to buy Marvell's auto ethernet business for $2.5 billion
Sunday, April 6, 2025
HCLTech recognized as Leader in all three service areas in ISG Provider Lens ™ 2024 - Advanced Analytics and AI Services reports for US and Europe
Analysts question TSMC-Intel JV plan
Will RISC-V reduce auto MCU's future risk?
GUC Monthly Sales Report - March 2025
Global Semiconductor Sales Increase 17.1% Year-to-Year in February
Altera Starts Production Shipments of Industry's Highest Memory Bandwidth FPGA
Friday, April 4, 2025
Siemens chooses Canada for $150M AI manufacturing research hub in Oakville
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