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Monday, April 15, 2024

• Emotors adopts Siemens' Simcenter solutions for NVH testing of next-generation automotive e-drives
• TSMC Reports Solid Earnings Boost Amid Surging AI Demand
• STMicroelectronics Publishes 2024 Sustainability Report
• Challenges in designing automotive radar systems
• Arm accelerates Edge AI with Ethos-U NPU and IoT reference design platform
• ITRI launches AIoT certification center with Arm
• IP block covers Wi-Fi 6, Bluetooth 5.4 dual mode and IEEE 802.15.4 for IoT chips
• Movellus Extends Droop Management Leadership with Aeonic Generateâ„¢ AWM3
• Fraunhofer IIS offers JPEG XS plugin for NVIDIA´s Holoscan for Media Architecture
• CMC Microsystems and AIoT Canada Sign Memorandum of Understanding to support IoT and semiconductor ecosystem growth in Canada
• Movellus Extends Droop Management Leadership with Aeonic Generate™ AWM3
• Fraunhofer IIS offers JPEG XS plugin for NVIDIAs Holoscan for Media Architecture
• OPENEDGES Unveils ENLIGHT Pro: A High-Performance NPU IP Quadrupling its Previous Generation's Performance

Sunday, April 14, 2024

• U.S. Subsidy for TSMC Has AI Chips, Tech Leadership in Sight
• Samsung gets $6.4bn Chips Act money
• Rapidus opens sales office in Silicon Valley
• A Brief and Personal History of EDA, Cadence, Synopsys, and Mentor Graphics - The EDA Era
• Ceva Wireless Platform IP Family Accelerates Enhanced Connectivity in MCUs and SOCs
• Siemens and Microsoft to converge Digital Twin Definition Language with W3C Thing Description Standard
• Semiconductor Capacity Is Up, But Mind the Talent Gap
• New Wave Design and Verification Announces Strategic Brand Evolution to Sharpen Focus on Innovation and Growth
• Microchip Technology Acquires Neuronix AI Labs
• Khronos Releases OpenXR 1.1 to Further Streamline Cross-Platform XR Development
• intoPIX Unveils Titanium at NAB for Accelerating IP Media Workflows
• Brazil and Europe sign innovative project with RISC-V technology for HPC
• Unveiling Silicon-proven USB 3.0 PHY IP Core in 22nm, Elevating High-Speed Data Transmission with Advanced Transceiver Technology, backward compatible with USB 2.0

Friday, April 12, 2024

• VISC: The New Coprocessing RISC-V Architecture for AI Efficiency

Thursday, April 11, 2024

• Kudelski IoT's Semiconductor Alliances set to redefine IoT provisioning
• Logic Fruit Technologies Inc. Excitedly Welcomes Mr. Akshaya Sharma as the new CEO of US Operations
• Creonic GmbH Introduces Fast Fourier Transform IP Core
• intoPIX Unveils Latest JPEG XS FPGA Cores with Nextera-Adeas ST2110/IPMX, Streamlining IPMX Development at NAB Show

Wednesday, April 10, 2024

• Think Silicon and Edge Impulse Democratize ML on NEOX® for Wearables and AIoT
• Think Silicon and Edge Impulse Democratize ML on NEOX® for Wearables and AIoT
• Xiphera and Kaviaz Technology Announce a Partnership for IP Distribution in Taiwan

Tuesday, April 9, 2024

• Winners of the Embedded World awards
• Innova finalizes its flow and resource management software platform and opens up to the international market
• TSMC Arizona and U.S. Department of Commerce Announce up to US$6.6 Billion in Proposed CHIPS Act Direct Funding, the Company Plans Third Leading-Edge Fab in Phoenix
• Tiempo Secure - CryptoNext Security partnership, bringing High-End Post-Quantic IP Security innovation to the next level.
• Google Cloud Delivers Customized Silicon Powered by Arm Neoverse for General-Purpose Compute and AI Inference Workloads
• TSMC March 2024 Revenue Report

Monday, April 8, 2024

• Xiphera Launches nQruxâ„¢ Family of Hardware Trust Engines for Hardware-Isolated Cryptographic Services and Computing Environments
• Semiconductor design innovation: how EDA initiates the digitalization journey for a smarter, sustainable future.
• Intel Unleashes Enterprise AI with Gaudi 3, AI Open Systems Strategy and New Customer Wins
• Synopsys Launches New Offering for Comprehensive Software Supply Chain Security
• RISC-V compiler toolset targets automotive functional safety
• AI-Driven HBM Uptake Is Power-Sensitive
• MIPS Continues To Expand With The Addition Of Industry Leaders from NVIDIA, Google and SiFive
• Rebellions Selects Arteris for Its Next-Generation Neural Processing Unit Aimed at Generative AI
• Electronic System Design Industry Posts $4.4 Billion in Revenue in Q4 2023, ESD Alliance Reports
• Xiphera Launches nQrux™ Family of Hardware Trust Engines for Hardware-Isolated Cryptographic Services and Computing Environments
• Autotalks and Secure-IC Collaborate to Create the Most Secure V2X Communication Chipset
• Xiphera Launches nQrux™ Family of Hardware Trust Engines for Hardware-Isolated Cryptographic Services and Computing Environments
• TASKING presents compiler toolset for RISC-V in safety- and security-critical automotive applications
• SiFive Unveils the HiFive Premier P550, the First Commercially Available Out-of-Order RISC-V Development Board
• Ambiq and PUFsecurity Join Forces on Energy-Efficient, Security-Enhanced SoC with PUF-based Root of Trust
• Arm Accelerates Edge AI with Latest Generation Ethos-U NPU and New IoT Reference Design Platform
• VeriSilicon showcased its latest power-efficient IP applications at Embedded World 2024

Sunday, April 7, 2024

• TSMC Arizona and U.S. Department of Commerce Announce up to US$6.6 Billion in Proposed CHIPS Act Direct Funding, the Company Plans Third Leading-Edge Fab in Phoenix
• Industry Leading PPA EFPGA And DSP/AI In Development For TSMC N5/4/3
• Enhancing Security with Securyzrâ„¢ iSE with integrated Hypervisor
• UMC Reports Sales for March 2024
• IAR, Nuclei, and MachineWare Join Forces To Speed Up Innovation in RISC-V ASIL Compliant Automotive Solution
• GUC Monthly Sales Report - March 2024
• Ceva Launches Multi-Protocol Wireless Platform IP Family to Accelerate Enhanced Connectivity in MCUs and SOCs for IoT and Smart Edge AI Applications
• Enhancing Security with Securyzr™ iSE with integrated Hypervisor
• Secure-IC partners with COONTEC to help strengthen Embedded Cybersecurity in South Korea
• Sondrel CEO steps down as chip firm faces re-organization
• PCIe 7.0 specification reaches "half way point"
• Imagination's new Catapult CPU is driving RISC-V device adoption
• Silicon-Proven 12-Bit 5Msps ADC IP Core for High-Speed Data Conversion, Now Available for Licensing
• MIPS Expands RISC-V Ecosystem Support to to Enable Early Software Development for Multi-threaded Cores
• RISC-V International Achieves Milestone with Ratification of 40 Specifications in Two Years
• Via LA Announces Extension of HEVC Patent Pool to Include VVC and Welcomes TCL Into Newly Formed Program

Thursday, April 4, 2024

• It Is Time To Take Intel Seriously As A Chip Foundry
• Semidynamics announces All-In-One AI IP for super powerful, next generation AI chips

Wednesday, April 3, 2024

• Japan Approves $3.9 Billion Subsidy for Rapidus
• Why Schneider Electric Backs AI & Data to Power Net Zero
• New RISC-V microprocessor can run CPU, GPU, and NPU workloads simultaneously
• RED Semiconductor announces VISCâ„¢ licensable high performance processor architecture for RISC-V
• Global Semiconductor Sales Increase 16.3% Year-to-Year in February
• Why have all broadcast powerhouses embraced intoPIX JPEG XS? Unraveling the secret behind industry leaders' unanimous adoption!
• NeuReality Boosts AI Acelerator Utilization With NAPU
• The Crucial Role Of Semiconductors In The Transition Toward A Greener World
• sureCore announces low power memory compiler for 16nm FinFET
• Defacto now part of Arm's Partner Catalog