Search News

Monday, March 18, 2024

• Credo Introduces HiWire AECS to Support 400G AI/ML Backend Networks
• Arm Unveils Its Largest Portfolio of Automotive Processors
• Synopsys Strengthens Polaris Software Integrity Platform with New Dynamic Security Testing Capabilities
• STMicroelectronics breaks the 20nm barrier for cost-competitive next-generation microcontrollers
• HCLTech and CAST expand partnership for custom chips
• Cycuity Sets New Standard for Semiconductor Chip Security Assurance with Next Generation of Radix Technology
• Synopsys Showcases EDA Performance and Next-Gen Capabilities with NVIDIA Accelerated Computing, Generative AI and Omniverse
• TSMC and Synopsys Bring Breakthrough NVIDIA Computational Lithography Platform to Production
• Spectral Releases Advanced Quality Assurance & Data Analytics tool to validate advanced node Memory Compilers
• Kudelski IoT and Dolphin Design unite to accelerate secure ASIC and IP projects
• Europe Leaps Ahead in Global AI Arms Race, Joining $20 Million Investment in NeuReality to Advance Affordable, Carbon-Neutral AI Data Centers

Sunday, March 17, 2024

• EU takes a step closer to regulating AI
• Cadence and NVIDIA Unveil Groundbreaking Generative AI and Accelerated Compute-Driven Innovations
• Siemens and NVIDIA expand collaboration on generative AI for immersive real-time visualization
• Revolutionary Cadence Reality Digital Twin Platform to Transform Data Center Design for the AI Era
• Weebit Nano to demo its ReRAM technology on GlobalFoundries' 22FDX® platform
• After TSMC fab in Japan, advanced packaging facility is next
• A System On Module (SoM) developed by Electra IC: BitFlex-SPB-A7 FPGA SoM

Friday, March 15, 2024

• Intel will bring a performance-improving feature to its chips one year ahead of TSMC

Thursday, March 14, 2024

• SoC Secure Boot Hardware Engine IP Core Now Available from CAST

Wednesday, March 13, 2024

• PrimisAI Unveils Premium Version of RapidGPT, Redefining Hardware Engineering
• embedded world 2024: Codasip demonstrates CHERI memory protection
• QuickLogic and Zero-Error Systems Partner to Deliver Radiation-Tolerant eFPGA IP for Commercial Space Applications
• Dolphin Design in Arm's Partner Catalog
• Canaan's RISC-V based edge AIoT SoC adopted VeriSilicon's ISP and GPU IPs

Tuesday, March 12, 2024

• New accelerated modeling for automotive development is here
• University of Western Australia Latest to Join the BrainChip University AI Accelerator Program
• Ecosystem Collaborations Bring Full Stack Software Solutions to Develop Leading-edge Automotive Applications From Day One
• Arm's Broadest Ever Automotive Enhanced IP Portfolio Designed for the Future of Computing in Vehicles
• Tenstorrent and MosChip Partner on High Performant RISC-V Design
• We'll Need Many More Fabs to Meet $1 Trillion by 2030 Goal
• Arteris Expands Ncore Cache Coherent Interconnect IP To Accelerate Leading-Edge Electronics Designs
• Siemens to demonstrate first pre-silicon simulation environment for Arm Cortex-A720AE for Software Defined Vehicles
• Arm Announces New Automotive Technologies to Accelerate Development of AI-enabled Vehicles by up to Two Years
• Arteris Expands Automotive Solutions for Armv9 Architecture CPUs
• HBM3 Initially Exclusively Supplied by SK Hynix, Samsung Rallies Fast After AMD Validation, Says TrendForce
• Cadence Collaborates with Arm to Jumpstart the Automotive Chiplet Ecosystem
• Arasan proudly releases its Radiation Hardened NAND Flash IP
• Arasan proudly introduces the VESA VDC-M Encoder and Decoder IP

Monday, March 11, 2024

• TI Commits to 100% Renewable Energy Worldwide by 2030
• University of Western Australia Latest to Join the BrainChip University AI Accelerator Program
• Pasqal aims for 10,000 qbit quantum computer in 2026
• Cold Spin-Electronics for Quantum Technologies
• The Imminent Arrival of 2-Nanometer Advanced Process
• Global Top 10 Foundries Q4 Revenue Up 7.9%, Annual Total Hits US$111.54 Billion in 2023, Says TrendForce
• Andes Technology: Cultivating Academic Collaboration for Over a Decade with Sustainable Spirit
• Tiempo Secure's TESIC RISC-V IP Secure Element successfully characterized on GlobalFoundries' 22FDX technology node
• Agile Analog delivers first full always-on IP subsystem

Monday, March 11, 2024

• Omni Design Technologies Offers Swiftâ„¢ Data Converters for Advanced Software Defined Radio (SDR) Solutions

Sunday, March 10, 2024

• Former Moortec executives create chip monitor startup
• Free configurator puts the power of full core customisation into hands of customers
• Elevate the performance of your Automotive Application by integrating the IP cores of a 14-bit wideband Time-Interleaved Pipeline Data Converters
• Omni Design Technologies Offers Swift™ Data Converters for Advanced Software Defined Radio (SDR) Solutions
• Alphawave Semi Demonstrates 3nm Silicon-Proven 24Gbps Universal Chiplet Express (UCIe) Subsystem for High-Performance AI Infrastructure
• Re-imagining Imagination Technologies
• OPENEDGES and SEMIFIVE Partnership Reinforce the SoC Platform

Thursday, March 7, 2024

• TSMC February 2024 Revenue Report
• M31's Revenue Grew Against the Trend by 18.5% Last Year and Will Increase Investment in Advanced Processes This Year
• Credo Launches 112G PAM4 SerDes IP for TSMC N3 Process Technology
• CAST Adds I3C Secondary Controller Core to MIPI IP Product Line

Wednesday, March 6, 2024

• Samsung to use recycled neon gas in chip manufacturing
• nepes corporation expands IC packaging capabilities for the 3D-IC era with advanced design flows from Siemens
• Marvell Announces Industry's First 2nm Platform for Accelerated Infrastructure Silicon
• sureCore announces ultra-low power memory IP for AI applications
• SignatureIP announces PCIe Gen 6 Controller IP