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Monday, February 19, 2024

• US awards USD 1.5 bn to GlobalFoundries for semiconductor production
• Xiphera Releases High-Speed ECC Accelerator
• Imec pioneers unique, low-power UWB receiver chip: 10x more resilient against Wi-Fi and (beyond) 5G interference
• T2M-IP Unveils the 12-bit 4Gsps ADC Silicon-Proven IP Core with Cutting-Edge Features, Silicon Proven and Ready to License
• M31 Launches PCI-SIG Certified PCIe 5.0 PHY IP, Partnering with SSD Storage Chipmaker InnoGrit to Advance the Next-Generation PCIe 5.0
• Samsung Electronics Collaborates With Arm on Optimized Next Gen Cortex-X CPU Using Samsung Foundry's Latest GAA Process Technology
• Intel and Cadence Expand Partnership to Enable Best-in-Class SoC Design on Intel's Advanced Processes
• IAR unveils Functional Safety version of IAR Embedded Workbench for Arm equipped with certified static analysis capabilities
• Rapid Silicon Leads the Way with First Complete Open-Source FPGA EDA Tool-Chain

Sunday, February 18, 2024

• Openedges sees revenue from TSMC foundry jump
• GlobalFoundries receives funding for essential chip manufacturing
• What does Renesas' acquisition of PCB toolmaker Altium mean?
• GlobalFoundries and Biden-Harris Administration Announce CHIPS and Science Act Funding for Essential Chip Manufacturing
• Imec launches the first design pathfinding process design kit for N2 node
• Logic Fruit's ARINC Innovation Journey: Delivering Diverse Products to DRDO Labs
• What does Renesas acquisition of PCB toolmaker Altium mean?

Thursday, February 15, 2024

• Samsung wins first 2 nm AI chip order from JapanÂ’s PFN; a snub to TSMC
• Quantum Experts discuss next Digital Revolution
• Arm CSA and AMBA release provide boost for chiplet ecosystem

Wednesday, February 14, 2024

• AccelerComm® Joins Open Compute Project Foundation Focusing on Evenstar Modular Open RAN Radio Unit Reference Design
• Renesas to Acquire PCB Design Software Leader Altium to Make Electronics Design Accessible to Broader Market and Accelerate Innovation
• Thalia releases AMALIA 24.1 with support for 12nm FinFET, porting simulation comparisons and streamlined technology analysis reporting
• AccelerComm® Joins Open Compute Project Foundation Focusing on Evenstar Modular Open RAN Radio Unit Reference Design
• New Report Suggests India Can Expand Role in Global Semiconductor Value Chains with the Right Policies
• Blumind Harnesses Analog for Ultra Low Power Intelligence
• IP block secures FPGAs with one external IC
• RISC-V Processors Addressing Edge AI Devices to Reach 129 Million Shipments by 2030
• Arm shares jump 50% on AI, China boosts to results

Wednesday, February 14, 2024

• zeroRISC, Nuvoton and Winbond Join Forces to Deliver the First Commercial Product Based on the OpenTitan® Open-Source Secure Silicon Platform

Tuesday, February 13, 2024

• ARM bids for chiplet dominance
• Logic Fruit Welcomes Vishal Sinha as a People Management Consultant
• OpenTitan® Partnership Makes History as First Open-Source Silicon Project to Reach Commercial Availability
• zeroRISC, Nuvoton and Winbond Join Forces to Deliver the First Commercial Product Based on the OpenTitan® Open-Source Secure Silicon Platform
• Ceva, Inc. Announces Fourth Quarter and Full Year 2023 Financial Results
• OpenTitan® Partnership Makes History as First Open-Source Silicon Project to Reach Commercial Availability
• Saankhya Labs receives approval under Semiconductor Design Linked Incentive (DLI) scheme for Development of a System-on-Chip (SoC) for 5G Telecom infrastructure equipment

Monday, February 12, 2024

• What Role Will Open-Source Development Play in Quantum Computing?
• EdgeQ Deploys Arteris IP for its 5G+AI Base Station-on-a-Chip for Wireless Infrastructure
• Join Secure-IC at Mobile World Congress 2024 to discover our cutting-edge solutions for mobile and connectivity
• Cadence Reports Fourth Quarter and Fiscal Year 2023 Financial Results

Sunday, February 11, 2024

• DesignEuropa Awards 2024: Celebrating Europe's Creativity, Innovation, and Sustainability
• Cadence and Dassault Systemes Unveil the First Cloud-Enabled, Collaborative Experience to Transform the Development of Electromechanical Systems
• The next frontier in semiconductor innovation: Chiplets and the rise of 3D-ICs
• Qualcomm asks Samsung Foundry and TSMC to each build 2nm Snapdragon 8 prototypes
• T2M is excited to announce the successful licensing of our partner's Silicon-Proven 1G Ethernet PHY IP Cores on a Tier-1 Foundry in Korea, using the advanced 14LPP process, in collaboration with a leading Tier-1 Korean customer
• Flex Logix Joins Intel Foundry Services Accelerator IP Alliance to Enable Fast, Low Power, Reconfigurable SoC's
• Alphawave Semi Announces Appointment of Charlie Roach as Chief Revenue Officer
• Biden-Harris Administration Announces Over $5 Billion from the CHIPS and Science Act for Research, Development, and Workforce

Thursday, February 8, 2024

• Arm shares jump 50% on AI, China boosts to results
• Fraunhofer IIS Director Albert Heuberger Defines Germany's Semiconductor Industry
• Xiphera Receives Its First US Patent

Wednesday, February 7, 2024

• SK hynix, TSMC Form AI Semiconductor Alliance: Challenge to Samsung Electronics?
• Samsung Announces 2nm AI Chip Deal With HBM3 Memory
• Post-Quantum Cryptography Alliance Launches to Advance Post-Quantum Cryptography
• Innatera Productizes SNN Accelerator As "Neuromorphic Microcontroller"
• Kalray and Arm to collaborate to bring data intensive processing and AI acceleration DPU solutions to the global Arm ecosystem
• Dolphin Design announces the successful launch of its first silicon tape out in 12nm FinFet