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Thursday, April 3, 2025

• Silicon Photonics and Co-Packaged Optics Shine a Light at OFC 2025
• Japan's Rapidus in talks with Apple, Google to mass-produce chips, Nikkei reports
• Major Manufacturing Shake-up: Intel Agrees to TSMC Takeover of Chip Foundries, Sources Say
• 2025 RISC-V CON: Andes Technology Celebrates 20 Years, Bringing Together Innovators, Engineers, and Ecosystem Leaders
• Continuous-Variable Quantum Key Distribution (CV-QKD) system demonstration
• HCLTech joins Samsung Advanced Foundry Ecosystem as a Design Solution Partner
• Frontgrade Gaisler and wolfSSL Collaborate to Enhance Cybersecurity in Space Applications
• Matrox Video and intoPIX Expand Interoperable IPMX & ST 2110 Solutions with JPEG XS Innovation at NAB 2025

Wednesday, April 2, 2025

• Europe consults on critical raw materials
• ST's Automotive MCU technology for next-generation vehicles
• QuickLogic to Exhibit at HEART Conference in Monterey
• New splitting method: Fraunhofer IIS brings satellites into the 5G era
• Alphawave IP Response to announcement from Qualcomm
• Qualcomm considers buying Alphawave Semi
• Arteris Opens New Engineering Hub in Poland
• BrainChip Partners with RTX's Raytheon for AFRL Radar Contract
• GUC Announces Tape-Out of the World's First HBM4 IP on TSMC N3P
• VeriSilicon Launches ISP9000: The Next-Generation AI-Embedded ISP for Intelligent Vision Applications
• Latest intoPIX JPEG XS Codec Powers FOR-A's FA-1616 for Efficient IP Production at NAB 2025
• Frontgrade Gaisler Launches New GRAIN Line and Wins SNSA Contract to Commercialize First Energy-Efficient Neuromorphic AI for Space Applications

Tuesday, April 1, 2025

• Will RISC-V reduce auto MCU's future risk?
• Capgemini recognized as a 'Leader' in Application Modernization and Multicloud Managed Services by independent research firm
• Siemens acquires Dotmatics to extend AI-powered software portfolio to Life Sciences
• Fraunhofer IIS Walks the Line for Edge AI
• ProMOS Adopts Silvaco Victory TCAD Solution for the Development of Next-Gen Silicon Photonics Devices
• Digital Core Design Unveils DPSI5 - The Next-Generation IP Core for PSI5 Communication

Monday, March 31, 2025

• TSMC opens up 2nm wafer fab, races to mass production
• TeraSignal to Showcase Retimer-Less PCIe 6.0 over Optics Featuring Synopsys IP at OFC 2025
• Exploring the Rationale for HAV in Complex SoCs
• GlobalFoundries and UMC Mull Potential Merger
• Movellus and RTX's SEAKR Engineering Collaborate on Advancing Mission-Critical ASICs
• Village Island Enhances its AI100 with intoPIX's JPEG XS Technology for Advanced Real-Time Analysis
• QuickLogic Announces $1.4 Million Incremental Funding Modification for its Strategic Radiation Hardened Program
• Silicon-Proven MIPI CSI-2 & DSI-2 Tx/Rx IP Cores for your Camera & Display SoCs

Monday, March 31, 2025

• Tower Semiconductor and Alcyon Photonics Announce Collaboration to Accelerate Integrated Photonics Innovation

Monday, March 31, 2025

• RISC-V in Space Workshop 2025 in Gothenburg

Sunday, March 30, 2025

• Phonemic has Full Registration on ESA STAR, Strengthening Its Position in Space FPGA Engineering
• New cryostatic systems elevate current research on Qubits
• SEALSQ and IC'ALPS Join Forces to Advance Post-Quantum Secure ASICs for Automotive Functional Safety
• X-FAB, SMART Photonics and Epiphany Design demonstrate InP-on-Silicon design flow for next-generation optical transceivers at OFC
• VeriSilicon introduces AcuityPercept: an AI-powered automatic ISP tuning system
• Avant Technology Partners with COSEDA Technologies to Enhance System-Level Software Solutions

Friday, March 28, 2025

• LDRA Updates Tools to Automate Worst-Case Execution Time Analysis for RISC-V

Thursday, March 27, 2025

• How Soitec Engineers Substrates for Cloud and Edge AI
• Intel brings 3nm production to Europe in 2025
• intoPIX Powers Ikegami's New IPX-100 with JPEG XS for Seamless & Low-Latency IP Production

Wednesday, March 26, 2025

• Korea's science ministry partners with Samsung, SK hynix, and DB HiTek for MoaFab upgrades
• Pragmatic Semiconductor set to revolutionise NFC connectivity with sustainable flexible chips
• Crypto Quantique Simplifies CRA Compliance for Embedded Security
• Sarcina Technology launches AI platform to enable cost-effective customizable AI packaging solutions
• SiliconIntervention Announces Availability of Silicon Based Fractal-D Audio Amplifier Evaluation Board
• EnSilica Agrees $18m 7 Year Design and Supply ASIC Contract
• Qualcomm initiates global anti-trust complaint about Arm
• Tower Semiconductor and Alcyon Photonics Announce Collaboration to Accelerate Integrated Photonics Innovation
• Faraday Technology Selects Silvaco FlexCAN IP for Advanced Automotive ASIC Design
• Tower Semiconductor and Alcyon Photonics Announce Collaboration to Accelerate Integrated Photonics Innovation
• Sarcina Technology launches AI platform to enable cost-effective customizable AI packaging solutions
• Qualcomm initiates global anti-trust complaint about Arm
• SiliconIntervention Announces Availability of Silicon Based Fractal-D Audio Amplifier Evaluation Board
• EnSilica Agrees $18m 7 Year Design and Supply ASIC Contract
• Faraday Technology Selects Silvaco FlexCAN IP for Advanced Automotive ASIC Design

Wednesday, March 26, 2025

• X-FAB, SMART Photonics, and Epiphany Design Collaborate on Advanced Heterogeneous Photonics Integration Platform

Tuesday, March 25, 2025

• PolarFire® SoC FPGAs Achieve AEC-Q100 Qualification
• SiliconIntervention Announces Availability of Silicon Based Fractal-D™ Audio Amplifier Evaluation Board
• Siemens acquires Altair to create most complete AI-powered portfolio of industrial software
• TSMC Reportedly Speeds Up AP7 and AP8 Build-Outs, Targets Doubling SoIC Capacity
• intoPIX JPEG XS Cores Power Delta Video's IP Video Transmission Solutions
• Alphawave Semi Reveals Suite of Optoelectronics Silicon Products addressing Hyperscaler Datacenter and AI Interconnect Market
• EnSilica Opens Second Brazilian Design Centre Following Multimillion Pound Design and Manufacturing Contract Win
• PolarFire® SoC FPGAs Achieve AEC-Q100 Qualification

Tuesday, March 25, 2025

• Siemens is European patent champion
• Cadence Launches Conformal AI Studio, Improves SoC Productivity by 10x

Monday, March 24, 2025

• Spanish government invests €13.8m in 5G satellites
• Renesas Introduces Low-Power Bluetooth Low Energy SoC for Automotive Applications
• AI platform enables customisable packaging solutions for AI applications
• Fraunhofer to show AI, robotics and connected data for healthcare
• Rapidus Announces Strategic Partnership with Quest Global to Enable Advanced 2nm Solutions for the AI Chip Era

Monday, March 24, 2025

• Delivering sustainable electronics manufacturing

Sunday, March 23, 2025

• Accellera Announces IEEE Standard 1801â„¢-2024 is Available Through IEEE GET Program
• Strategies for Addressing More Complex Custom Chip Design
• EnSilica Agrees a Multimillion Pound Design and Manufacturing Services Contract
• M31 Technology - AI-Powered Automotive Dual Engines and 2nm Technology Boost Revenue to Record Highs
• 'World-Leading' Semiconductor Design Centre Will 'Strengthen Wales' Leadership in Chip Design'
• Accellera Announces IEEE Standard 1801?-2024 is Available Through IEEE GET Program
• Brite Semiconductor Releases DDR3/4, LPDDR3/4 Combo IP
• SoCs Get a Helping Hand from AI Platform FlexGen