Search News

Monday, December 11, 2023

• Logic Fruit Technologies Launches CAN Controller IP Core
• SCALINX and Arteris Partner on Advanced Communications Innovation
• AccelerComm Expands LDPC Accelerator IP Licenses for 5G Cloud RAN High-Capacity Solutions
• Continental and Synopsys Provide Vehicle Digital Twin Capabilities to Accelerate Software Development
• Rambus Wins 2023 "Most Respected Emerging Public Semiconductor Company" Award from Global Semiconductor Alliance
• Digital Core Design Presents DAES XTS Cryptographic CPU for Unparalleled Security
• Andes Awards Imperas 2023 Partner of the Year
• Visit Quadric at CES to Discover the GPNPU that Solves The Biggest ML Inference Chip Design Challenges

Sunday, December 10, 2023

• Infineon is one of the most sustainable companies globally
• Imec Presents Fundamentally New Way to Render Colors with Sub-micron Pixel Sizes that Revolutionizes Camera Performance
• EnSilica enters strategic partners with design and custom module developer IndesmaTech
• China Continues to Enhance AI Chip Self-Sufficiency, but High-End AI Chip Development Remains Constrained, Says TrendForce
• NEO Semiconductor Releases Technology CAD (TCAD) Simulation Data for Ground-Breaking 3D X-DRAM
• 12-bit 2GS/s high-speed ADC IP Core with Seamless Integration, Ultimate Precision is ready for Immediate Licensing

Thursday, December 7, 2023

• Layer transfer tech comes to high volume chiplet, 2nm manufacturing
• TSMC November 2023 Revenue Report
• Getting Ready for IoT Security in the AI Era

Wednesday, December 6, 2023

• Ceva Wins Product of the Year Award at Prestigious EE Awards Asia Event
• What Is Holding Back Neuromorphic Computing?
• CEA-Leti Paper in Nature Communications Reports First Complete Memristor-Based Bayesian Neural Network Implementation For Real-World Task
• NovaSparks Expands Its Operations in Asia-Pacific
• Access Advance Announces Major Additions to its HEVC and VVC Patent Pools
• Bluetooth Channel Sounding: Achieving 10cm Ranging Accuracy
• Siemens' new Calibre DesignEnhancer boosts Samsung Foundry design quality and speeds time to market

Wednesday, December 6, 2023

• ProvenRun secures €15 million Series A to accelerate its growth in security-by-design for the Internet of Things (IoT)

Tuesday, December 5, 2023

• 3GPP to Officially Begin Development of the 6G Specification
• Pragmatic Semiconductor secures £182m ($231m) investment led by M&G and UK Infrastructure Bank
• Tech Alert: BrainChip's "This is Our Mission" Podcast Discusses Trends in Edge AI with Arm Fellow Ian Bratt
• Using AI to find microplastics
• Siemens And Intel To Collaborate On Advanced Semiconductor Manufacturing
• Renesas Champions the RISC-V Cause With Its Own 32-bit RISC-V CPU
• China's 'Big Fund' is investing $1 billion in another domestic foundry, to advance sub-10nm chip manufacturing
• Samsung Electronics Tense Over TSMC-Apple-Amkor 'Arizona Alliance'
• JEDEC Publishes New CAMM2 Memory Module Standard
• Breker Verification Systems Appoints Andy Stein Vice President of Worldwide Sales as Company Scales New Business Opportunities
• Top 10 Foundries Experience 7.9% QoQ Growth in 3Q23, with a Continued Upward Trend Predicted for Q4, Says TrendForce
• Ceva Launches New Brand Identity Reflecting its Focus on Smart Edge IP Innovation
• ProvenRun secures €15 million Series A to accelerate its growth in security-by-design for the Internet of Things (IoT)
• Intrinsic ID Launches First Hardware Root-of-Trust Solution to Meet Functional Safety Standards for Automotive Market
• Lattice Collaborates with NVIDIA to Accelerate Edge AI
• Global Semiconductor Sales Increase 3.9% Month-to-Month in October; Annual Sales Projected to Increase 13.1% in 2024
• Pragmatic Semiconductor secures £182m ($231m) investment led by M&G and UK Infrastructure Bank
• UMC Reports Sales for November 2023

Monday, December 4, 2023

• Keeping It 100: RISC-V Reality Check
• Applied Materials and CEA-Leti Unveil Joint Lab For Rapidly Growing Specialty Chip Markets
• Tenstorrent Strengthens Presence in Asia with Rapidus Partnership
• Agile Analog partners with sureCore on CryoCMOS Innovate UK project
• Xiphera Announces Support for Extreme-Speed IPsec
• Rambus Protects Data Center Infrastructure with Quantum Safe Engine IP
• GUC Monthly Sales Report - November 2023

Sunday, December 3, 2023

• Cadence Powers Samsung Foundry's Breakthrough Success on 5G Chip Design
• Quantum effect technology breakthrough in analogue circuit design
• BrainChip Attracts Former Intel AI Sales Executive to Head Up Sales
• Canonical joins the RISC-V Software Ecosystem (RISE)
• USPTO announces Semiconductor Technology Pilot Program in support of CHIPS for America Program
• Gartner Forecasts Worldwide Semiconductor Revenue to Grow 17% in 2024
• Silicon Proven DisplayPort v1.4 Tx PHY IP Core in 12nm, Alongside Production-Ready Controller IP core available for Immediate Licensing
• EMA Design Automation to Spin-Off IP & Services Group to Enable Digital Transformation for the Entire CAD Industry
• Q3 2023 Global Semiconductor Equipment Billings Drop 11% Year-Over-Year, SEMI Reports
• ADTechnology is accelerating its performance and targeting infrastructure markets by joining Arm Total Design.

Thursday, November 30, 2023

• Energy Collaborative to Help Accelerate Installation of Greener Energy Sources in APAC
• Leadership Spotlight: Sanjeev Kumar Earns Global CEO Business Excellence Award
• Lockheed Martin Prepares First 5G.MIL® Payload for Orbit
• Faraday Receives ISO/IEC 27001:2022 Certification for Information Security Management System

Wednesday, November 29, 2023

• Cadence Signoff Solutions Empower Samsung Foundry's Breakthrough Success on 5G Networking SoC Design
• BrainChip Details Olfactory Capabilities of Identifying Bacteria in the Blood in New Research Report
• Agile Analog's New VP Sales to Expand Ties With Foundries
• Credo Technology Group Holding Ltd Reports Second Quarter of Fiscal Year 2024 Financial Results
• Agnisys Announces Wacom Selects IDesignSpecâ„¢ to Automate Its IP and Chip Development Flow from Executable Specifications
• Synopsys Posts Financial Results for Fourth Quarter and Fiscal Year 2023
• QuickLogic Secures New eFPGA IP Contract on UMC's 22nm Process
• Renesas Unveils the First Generation of Own 32-bit RISC-V CPU Core Ahead of Competition