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Monday, October 16, 2023

• Chipmakers Fail to Meet Carbon-Emission Target, Experts Say
• TSMC abandons plans for 2nm chip plant after Taiwanese locals protest
• CEA-Leti Launches R&D Program to Improve "Cooperation" Between Autonomous Vehicles Via V2X Communication
• CEVA Joins Intel Foundry Services Accelerator IP Alliance Program to Empower Cutting-Edge SoCs
• Codasip announces next-generation RISC-V processor family for Custom Compute
• Silicon Creations Named 2023 TSMC OIP Partner of the Year for Analog / Mixed-Signal IP
• Fraunhofer IESE Partners With Arteris To Accelerate Advanced Network-on-chip Architecture Development for AI/ML Applications
• Synopsys Partners with Indian Institute of Technology Bombay to Develop Talent for Semiconductor Industry

Sunday, October 15, 2023

• The Path to A Sustainable Semiconductor Industry
• Fraunhofer-Roadmap: European Commission and expert community discuss a sustainable and competitive bioeconomy for the EU
• LeapMind's New AI Chip Paves the Way for Unprecedented Cost-Effective AI Computing
• Electronic System Design Industry Posts $4 Billion in Revenue in Q2 2023, ESD Alliance Reports
• Access Advance Announces Newest VVC Advance Licensors and Licensees
• eMemory Won TSMC OIP Partner of the Year Award for the 14th Consecutive Year
• 14-bit, 4.32GSps Wide Band ADC with Time-Interleaved Pipeline Architecture, Now Available for WhiteBox Licensing - Unlimited Usage and Modification Rights Included
• OPENEDGES Extends Partnership with InnoGrit Corp for 6nm LPDDR5/4X/4 Memory Controller IP
• GOWIN Semiconductor Expands its GW1NZ Series of Low-Cost, Small-Size, and Low-Power Devices

Thursday, October 12, 2023

• Semiconductor startup, Enosemi, launches with a committed commercial license to key silicon photonics design IP created by Luminous Computing
• Imagination Optimizes PPA and Speeds the Delivery of Low-Power GPUs Using AI-Driven Cadence Cerebrus in the OnCloud Platform

Wednesday, October 11, 2023

• Denso invests $500 million in silicon carbide wafer company
• European Innovation Award EARTO 2023 for sustainable and cost-effective manufacturing process of aerogels
• Ericsson Antenna Technology Germany starts research project for 6G communication technologies
• Workshop Sustainable and Greener Manufacturing of ECS
• Chips JU Consultation Workshop : "Sustainable and Greener Manufacturing of ECS"
• Credo Joins with Industry Players to Announce Effort to Standardize CXL Active Electrical Cables & Optics at OCP Global Summit 2023
• Thalia appoints Sou Bennani-McCord as Global VP of Sales

Tuesday, October 10, 2023

• Artificial Intelligence (AI) Utilizing Deep Learning Techniques to Enhance ADAS
• Soitec inaugurates new plant for SmartSiC wafer production
• ADTechnology to start 3nm 2.5D ASIC design project for HPC application
• Embedded Flash memory developer Floadia has raised 1.05 billion yen from INABATA and others
• Tasking, Synopsys team for safer automotive virtual ECUs
• Achronix Announces FPGA-Powered Accelerated Automatic Speech Recognition Solution
• Highly configurable 32-Bit MCU features embedded hardware security module
• SiFive Announces Differentiated Solutions for Generative AI and ML Applications Leading RISC-V into a New Era of High-Performance Innovation
• JEDEC and Open Compute Project Foundation Pave the Way for a New Era of Chiplet Innovation
• BrainChip and Circle8 Clean Technologies/AVID Group Work to Reduce and Recycle Waste Through Joint Development of Intelligent "Smart Bins"
• Arteris Interconnect IP Deployed in NeuReality Inference Server for Generative AI and Large Language Model Applications

Tuesday, October 10, 2023

• GlobalFoundries and Microchip Announce Microchip's 28nm SuperFlash® Embedded Flash Memory Solution in Production

Monday, October 9, 2023

• New Synopsys Research Reveals Vast Majority of Organizations Report DevOps Delays Due to Critical Security Issues
• RISC-V group says export ban on open-source chip standard would slow innovation
• Siemens launches Tessent tool for Verilog and RTL design for test
• AMD to Acquire Open-Source AI Software Expert Nod.ai
• Accellera Releases Portable Test and Stimulus Standard 2.1
• Efabless Raises $6.3 Million in Series A-1 Extension, Featuring Investments from GlobalFoundries, Synopsys, and New North Ventures
• Update on Israel situation; Weebit's operations unaffected
• Omni Design to Present Next Generation LiDAR Solutions at CadenceLIVE Europe
• Leti Innovation Days Tokyo 2023

Sunday, October 8, 2023

• Siemens extends leadership in EDA design-for-test with the launch of Tessent RTL Pro
• TSMC looks to standardise chiplet protocols in "world changing" move
• TSMC September 2023 Revenue Report
• 1G Ethernet PHY IP Core is now available in 14nm LPP for Blackbox License and in 28FDSOI as Whitebox License for maximum flexibility

Thursday, October 5, 2023

• Samsung Electronics and TSMC Grapple with 3-Nano Yield Challenges
• GUC Monthly Sales Report - September 2023
• UMC Reports Sales for September 2023
• Marquee Semiconductor Expands Presence in India with New Location at Veer Surendra Sai University of Technology Campus in Odisha
• ADTechnology and Zaram Technology to develop the next-generation of telecommunications semiconductor chips
• Arteris Wins Autonomous Vehicle Technology of the Year Award
• EDGX Announces Collaboration with BrainChip to Develop Disruptive Data Processing Solutions for Space

Wednesday, October 4, 2023

• JUPITER Exascale Supercomputer, lead customer for SiPearl
• Global Semiconductor Sales Increase 1.9% Month-to-Month in August
• Using Open-Source Hardware to Speed Product Development
• Swiss-Based Enclustra Announces US Operations in San Diego to Realize the Full Potential of Embedded Chip Technologies
• SmartDV Rolls Out Multi-Phase Expansion Plan
• MachineWare announces new ARM processor simulation and SystemC profiling products, adds Windows support
• Renesas Extends Tender Offer and Receives CFIUS Clearance for Proposed Acquisition of Sequans
• Tenstorrent Selects Samsung Foundry to Manufacture Next-Generation AI Chiplet
• Cadence Completes Acquisition of Intrinsix
• ELES and proteanTecs Partner to Enhance Reliability Testing with Deep Data Analytics
• Marquee Semiconductor Joins Singapore Semiconductor Industry Association to Catalyze Development of Singaporean Hub