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Monday, September 18, 2023

• New RISC-V Market Report Will Provide 5-year Growth Projections for Semiconductor Devices and Insights on the Enabling Ecosystem
• Synopsys Aims to Advance IC Design Workforce in Vietnam
• Intel Innovation 2023: Empowering Developers to Bring AI Everywhere
• Cadence Accelerates On-Device and Edge AI Performance and Efficiency with New Neo NPU IP and NeuroWeave SDK for Silicon Design
• TSMC in talks about chiplet packaging in Arizona
• QuickLogic and Xiphera Partner to Pioneer Post-Quantum Cryptography on eFPGAs
• Creonic Expands Satellite IP Core Portfolio with DVB-S2X Multi-Carrier Demodulator
• SandBox Semiconductor Adds Hybrid Metrology Capabilities to Industry's Leading Physics-based, AI-enabled Process Optimization Platform, Creating the First Software Solution to Holistically Address Process Development Challenges
• OPENEDGES and VisioNexT Shapes the Future of Vision AI SoCs
• Rambus Added to PHLX Semiconductor Sector Index (SOX)
• Arm Announces Closing of Initial Public Offering and Full Exercise of Underwriters' Option to Purchase Additional American Depositary Shares

Sunday, September 17, 2023

• HighTec, Synopsys team for AI on Infineon's AURIX TC4x
• Arm Begins 2nd Term on Nasdaq, at $54.5 Billion Valuation
• Continental and Ethernovia Announce Partnership to Develop Automotive Switch in 7nm
• Synopsys Demonstrates Industry's First Interoperability of PCI Express 6.0 IP with Intel's PCIe 6.0 Test Chip
• Driving Europe's Chip Renaissance: TSMC's Vision with ESMC
• TCL Joins Via Licensing Alliance's ATSC 3.0 Broadcasting Patent Pool
• Quadric Announces Llama2 LLM Support Immediately Available for Chimera GPNPUs
• Flex Logix Announces Reconfigurable Block RAM with ECC Option
• LIN Controller IP Core, equipped with a Safety package (Safe LIN, ISO 26262: Safety manual, FMEDA), tailored specifically for High-End Automotive and Consumer Applications is available for immediate licensing
• Panmesia Raises $12.5 Million in Seed Funding with a Valuation Exceeding $81.4 Million in the CXL Semiconductor Arena

Thursday, September 14, 2023

• TSMC Accelerates Renewable Energy Adoption and Moves RE100 Target Forward to 2040
• Driving EuropeÂ’s Chip Renaissance: TSMCÂ’s Vision with ESMC

Wednesday, September 13, 2023

• Lawo and intoPIX Partner to Deliver Edge-Compute JPEG XS Support at IBC 2023
• Realtek and V-Nova Announce Support for MPEG-5 Part 2 LCEVC on Set-Top-Box SoCs
• X-Fab adds new passive integration technology for RF
• Arm Announces Pricing of Initial Public Offering
• Fraunhofer IIS and IHSE announce their partnership for new JPEG XS implementations at IBC 2023

Tuesday, September 12, 2023

• TSMC's semiconductor foundry in the United States will begin trial production in Q1 2024
• Cadence Accelerates On-Device and Edge AI Performance and Efficiency with New Neo NPU IP and NeuroWeave SDK for Silicon Design
• Efabless Design Challenge Winners Advance the Power of AI in Chip Design
• Optima Design Automation Receives ISO 26262 ASIL D Ready Certification from SGS-TÃœV Saar
• Alchip Collaborates With Arteris To Expand ASIC Design Services
• Marquee Semiconductor Achieves ISO 9001 Certification for Exemplary Management System
• Optima Design Automation Receives ISO 26262 ASIL D Ready Certification from SGS-TÜV Saar
• intoPIX and Cobalt unveil the future of content delivery with JPEG XS: Introducing the Sapphire mini-converters and Sapphire openGear card powered by intoPIX technology
• Fraunhofer IIS introduces Application Support Package to facilitate JPEG XS Integration
• Esperanto Technologies Introduces First Generative AI Appliance Based on RISC-V, Enabling Developers to Easily Create and Deploy Purpose-Built Vertical Applications
• TSMC Special Board of Directors Meeting Resolutions

Monday, September 11, 2023

• From Synopsys to Google, New EDA Tools Apply Advanced AI to IC Design
• Cadence Unveils Next-Generation AI-Driven OrCAD X Delivering Up to 5X Faster PCB Design and Enabled with Cadence OnCloud
• 2024 Global Fab Equipment Spending Recovery Expected After 2023 Slowdown, SEMI Reports
• Bluespec's Accelerate-HLS Leverages RISC-V to Simplify and Speed the Development of HLS Applications
• Tachyum Offers Its TPU Inference IP to Edge and Embedded Markets
• Allegro DVT Launches a New Generation of High-Performance Multi-Format Video Encoder IP for 4K/8K Video Resolutions
• Faraday Unveils 2.5D/3D Advanced Package Service for Chiplets
• Meet T2M at IBC 2023 to explore High Performance, Cost-effective, and Innovative Semiconductor IP Cores for your next generation SoCs
• GlobalFoundries Officially Opens US$4 Billion Expansion Facility in Singapore, Creating 1,000 New Jobs
• Hailo Selected VeriSilicon's ISP and Video IP for its AI Vision Processors Empowering Intelligent Surveillance Cameras
• intoPIX showcases the new lightweight video compression standards and technologies driving automotive innovation at AutoSens 2023
• Signature IP Extends Global Footprint to Israel with Local Sales and Application Engineering Presence

Sunday, September 10, 2023

• Is Quantum Computing The Key To a Greener AI Future?
• Getting to grips with RF design
• Blue Pearl Adds Design Verification and Methodology Services to its Product Portfolio
• Flex Logix Announces Upgraded Emulation Models For EFLXâ„¢ eFPGA
• Renesas Commences Tender Offer for All Outstanding Shares and ADSs of Sequans
• SK hynix's memory chips next in Huawei's 5G phone saga
• Q2 2023 Global Semiconductor Equipment Billings Dip 2% Year-Over-Year, SEMI Reports
• NR-5G Polar Decoder and Encoder FEC IP Core Available For Licensing and Implementation from Global IP Core
• CAST adds Ascon Lightweight Encryption Engine to Security IP Cores Line
• Semiconductor industry sees revenue increase for the first time since 2021
• Enhanced Artel SMART openGear® Leverages intoPIX JPEG XS Technology for Ultimate Low-Latency Transport Solutions
• TSMC August 2023 Revenue Report

Friday, September 8, 2023

• CEVA Bluetooth® 5.4 IP Achieves SIG Qualification, Includes New Features to Address Rapidly Growing Electronic Shelf Label (ESL) Market

Thursday, September 7, 2023

• The Future Of Renewable Energy Is Built On Semiconductors
• Samsung Says It Will Beat TSMC's 4nm Production Capacity
• intoPIX to Celebrate Successful Collaboration with Bridge Technologies at IBC 2023
• Andes Announces General Availability of the New AndesCoreâ„¢ RISC-V Multicore Vector Processor AX45MPV
• OneNav Closes $17 Million Round, Launches GNSS Augmentation Product
• GBT Receives Patent Grant Notification Covering its Integrated Circuits Reliability Verification Analysis and Auto-Correction Technology

Wednesday, September 6, 2023

• Creonic Introduces NCR Processor IP Core for DVB-S2X/DVB-RCS2 Satellite Communication
• Global Semiconductor Sales Increase 2.3% Month-to-Month in July
• Arm IPO Likely to Lag Early Expectations, Observers Say
• Numem Announces Series A Funding Led by Cambium Capital to Propel Memory Solutions for AI and IoT
• Synopsys Extends Synopsys.ai EDA Suite with Industry's First Full-Stack Big Data Analytics Solution
• Comcores now offers standalone Reed Solomon Forward Error Correction (RSFEC) IP cores
• BrainChip Showcases Foundation for next generation AI solutions at AI Hardware & Edge AI Summit
• MediaTek Successfully Develops First Chip Using TSMC's 3nm Process, Set for Volume Production in 2024
• Rambus Completes Sale of PHY IP Assets to Cadence
• Flanders Semiconductors: The New Hub for Semiconductor Ecosystem at the Heart of Europe
• Synopsys Extends Synopsys.ai EDA Suite with Industry's First Full-Stack Big Data Analytics Solution