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Friday, December 19, 2025

• Semiconductor technology trends and predictions for 2026
• Trends for semiconductor and IC packaging materials market 2025-35
• Six IoT semiconductor predictions for 2026
• India Launches DHRUV64, First Indigenous 64-Bit Dual-Core Processor
• Cadence Tapes Out UCIe IP Solution at 64G Speeds on TSMC N3P Technology
• Qualcomm Completes Acquisition of Alphawave Semi
• QuickLogic Announces Expanded Scope of Strategic Radiation Hardened FPGA Contract
• Omni Design Technologies Appoints Hinesh Shah as Vice President of Strategic Sales

Thursday, December 18, 2025

• VeriSilicon responds to the termination of the acquisition of Nuclei Smart Fusion: The RISC-V business layout plan remains unchanged, and the Point Semiconductor merger is proceeding concurrently.
• GlobalFoundries Accelerates and Strengthens Europe’s Semiconductor Ecosystem through Strategic Partnership with Cloudberry
• The Green Paradox: How Semiconductor Giants are Racing to Decarbonize the AI Boom
• Siemens' new PAVE360 Automotive drives next-generation vehicle development with real-world validation
• Canada Tempers AI Aspirations with Data Sovereignty
• Global Trends Overview: The Rapid Evolution of the USB-C Charging Cable Market
• Keysight Joins Forces with Singapore's Quantum Leaders to Advance Capabilities in the Design and Control of Qubits
• Using Synopsys Tools, Complex AI SoC Achieves Verification in 5 Weeks
• onsemi to Develop Next-Generation GaN Power Devices with GlobalFoundries
• Significant 8 nm Order at Samsung Foundry Linked to Futuristic Intel 900-series Chipset
• Addressing the Biggest Bottleneck in the AI Semiconductor Ecosystem
• Chinese SMIC Achieves 5 nm Production on N+3 Node Without EUV Tools
• Keysight Accelerates Automotive Innovation from Design to Defense at CES 2026
• Chiplet Technology in Automotive Applications: A Cost-Effective Path to Advanced Electronics
• India Unveils DHRUV64: Nation’s First Indigenous 64-Bit Dual-Core Microprocessor
• Intel Installs ASML TWINSCAN EXE:5200B High-NA EUV Machine for 14A Node
• Samsung nears 2nm foundry deal with AMD as it closes gap with TSMC
• Global Semiconductor Equipment Sales Projected to Reach a Record of $156 Billion in 2027, SEMI Reports
• Keysight Accelerates Electronic Design Productivity with Secure AI-Powered Assistants
• Toshiba to accelerate semiconductor design innovation with Siemens’ EDA software
• Quobly marks a new milestone towards industrialization with Soitec’s 28Si FD-SOI substrates now cycling in ST’s 300mm fab
• SiFive and IAR Collaborate to Advance the Automotive Ecosystem and Drive RISC-V Innovation in Automotive Electronics

Wednesday, December 17, 2025

• Europe picks its own lane at EFECS 2025 – Turning semiconductor strategy into competitive strength
• Deep Dive Into VSF TR-07 JPEG XS TS With A Wireshark Dissector
• Cadence's Zhuo Li discusses how their latest platform is reshaping LEC, low-power signoff, and ECO implementation using AI technologies.
• Rapidus unveils new AI design tools for advanced semiconductor manufacturing
• S2C, MachineWare, and Andes Introduce RISC-V Co-Emulation Solution to Accelerate Chip Development

Tuesday, December 16, 2025

• Nordic Semiconductor secures Skylo certification for nRF9151 module enabling global IoT connectivity
• Renesas Fast-Tracks SDV Innovation with R-Car Gen 5 SoC-Based End-to-End Multi-Domain Solution Platform
• BOS Semiconductors and LIG Nex1 Sign Strategic MOU on Physical AI for Robotics & Drones
• SEMI Reports Global Semiconductor Equipment Sales to Reach $156 Billion in 2027
• Projections to 2030: How Korea’s Chipmakers Could Re-Shape the Semi World
• Joachim Kunkel Joins Quadric Board of Directors
• DI3CM-HCI, A High-Performance MIPI I3C Host Controller IP Core for Next-Generation Embedded Designs
• IntoPIX At CES 2026: Premium Visual Experiences — No Compromise. IntoPIX Delivers Real-Time, Low-Power Video Technologies At CES 2026

Monday, December 15, 2025

• Samsung Reportedly Nears 2nm Foundry Deal With AMD, Decision Possible Around Early 2026
• Quadric Appoints Ravi Chakaravarthy VP SW Engineering
• Tata and Intel Announce Strategic Alliance to Establish Silicon and Compute Ecosystem in India
• EU injects €623m to boost semiconductor manufacturing in Germany
• South Korea to consider setting up $3.1 bln foundry to grow local chip sector
• Synopsys to Showcase Future of Automotive Engineering at CES 2026
• Hardware security to bolster interconnect IPs for SoCs, chiplets
• BOS Semiconductors @ AISFC 2025
• ISOLDE Project Demonstrates Advancements in European Open-Source RISC-V for Automotive, Space, and IoT
• Quintauris and SiFive Announce Partnership to Advance RISC-V Ecosystem Development
• Three PCIe Encryption Weaknesses Expose PCIe 5.0+ Systems to Faulty Data Handling
• Industry’s First End-to-End eUSB2V2 Demo for Edge AI and AI PCs at CES
• Intel Foundry Collaborates with Partners to Drive an Open Chiplet Marketplace
• UMC Inaugurates the Circular Economy & Recycling Innovation Center
• Samsung’s 4nm Process Has Witnessed Yield Improvements In The 60-70% Range, Enabling It To Reportedly Win A $100 Million Order To Develop An Omni Processing Unit For A U.S. Firm
• Siemens and GlobalFoundries collaborate to deploy AI-driven manufacturing to strengthen global semiconductor supply
• Qualitas Semiconductor Signs First ASIL-B-Compliant MIPI Sub-system IP Agreement for Autonomous ADAS SoC

Saturday, December 13, 2025

• Taiwan helps Slovakia build semiconductor lab

Friday, December 12, 2025

• RaiderChip NPU leads edge LLM benchmarks against GPUs and CPUs in academic research paper
• Silicon Creations and Chip Interfaces Announce Successful Interoperability for JESD204B/C, Interlaken, and CPRI
• BrainChip Announces $25 Million (USD) Funding Ahead of CES to Power Next-Gen Edge AI
• Arteris to Expand Portfolio with Acquisition of Cycuity, a Leader in Semiconductor Cybersecurity Assurance

Thursday, December 11, 2025

• Nordic Semiconductor launches nRF9151 software and development kit combining satellite and cellular IoT connectivity
• Synopsys Posts Financial Results for Fourth Quarter and Fiscal Year 2025
• CoMira Announces One of the Industry’s First Commercially Available UALink IP Solutions for Next-Generation AI Scale-Up Networks
• Semiconductor industry enters unprecedented ‘giga cycle’, says report — scale of artificial intelligence is rewriting compute, memory, networking, and storage economics all at once
• Korea unveils $534 bil. plan to lead global chip race in AI era
• Qualcomm Acquires Ventana Micro Systems, Deepening RISC-V CPU Expertise
• India Paves Dual RISC-V Tracks with C-DAC and Startup Silicon
• Tenstorrent Blackhole Support & Other New RISC-V + ARM64 Hardware In Linux 6.19
• CEA-Leti & STMicroelectronics’ Paper at IEDM 2025 Demonstrates Path to Fully Monolithic Silicon RF Front-Ends with 3D Sequential Integration
• TSMC November 2025 Revenue Report
• Developing high-performance compute and storage systems
• UMC Licenses imec’s iSiPP300 Technology to Extend Silicon Photonics Capabilities for Next-Generation Connectivity
• CAST Introduces Microsecond Channel Controller IP Core for Automotive Power and Sensor Interfaces

Wednesday, December 10, 2025

• Meeting the Demands of Next-Gen Client Computing with a High-Performance, High-Reliability SPD Hub
• Synopsys records record-breaking full-year revenue as it beats expectations again
• MEMTECH Unveils New LPDDR3 Memory Subsystem Family with Hyper-Bandwidth, Automotive Safety, and Ultra-Low Power Innovations
• Andes Announces First Customer Tape-Out Delivery of the AX46MPV for Cloud AI Acceleration
• HCLTech partners with Dolphin Semiconductor to develop energy-efficient chips for IoT and data center applications

Tuesday, December 9, 2025

• FortifyIQ Partners with Nexus-GT to Expand its Security Market Reach in Israel
• TES Launches 3.3 V CAN Transceiver IP for Single‑Chip Solutions
• Silicon-Proven 16-bit 5MSps SAR ADC IP Cores Optimised for Automotive, Industrial, and IoT

Monday, December 8, 2025

• DVB-S2 Demodulator Available For Integration From Global IP Core
• Perceptia Announces Availability of Cryogenic 10-bit ADC and DAC IP in GF 22FDX
• SoftBank's Arm plans to set up chip training facility in South Korea
• Silicon’s Green Revolution: How Cutting-Edge Innovations are Forging a Sustainable Future for Semiconductors
• Silicon Photonics Momentum Builds: Samsung Ramps R&D in Singapore, UMC Teams With IMEC
• First-ever quantum chip combining electronics and photonics made in commercial CMOS foundry
• Global cybersecurity agencies publish secure AI integration principles for OT
• Nordic Semiconductor unveils nRF54LV10A - a breakthrough low-voltage Bluetooth LE SoC for next-gen healthcare wearables
• Ceva-XC21 Named "Best IP/Processor of the Year" at EE Awards Asia
• Innatera and 42T join forces to power the next wave of intelligent product innovation
• Risc-v Cores and Neuromorphic Arrays Enable Scalable Digital Processors for EdgeAI Applications
• CXL Adds Port Bundling to Quench AI Thirst
• UMC and Polar Collaborate to Meet Growing Demand for U.S. Onshore Semiconductor Manufacturing
• TSMC Strengthening Foundry 2.0 Leadership Amid Strong AI and Packaging Demand