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Tuesday, July 11, 2023
Intelligent terminals applications given an innovation enhancement through AI acceleration
Cadence Digital, Custom/Analog Design Flows Certified and Design IP Available for Intel 16 FinFET Process
T2M Presents Silicon Proven MIPI D-PHY and DSI Controller IP Cores in 12FFC & 22ULL For Your Next Generation Display Products
Crypto Quantique Selected for European Innovation Council (EIC) Grant Funding
Cycuity Achieves ISO/SAE 21434 Certification for Automotive Cybersecurity Compliance
Monday, July 10, 2023
Arasan's MIPI CSI-2 IP achieves ISO26262 ASIL-C Certification for MIPI C-PHY Connectivity
Faraday's Launched SerDes Advanced Service to Accelerate ASICs into Production
Spectral Design & Test Inc joins TSMC OIP IP Alliance
Synopsys Delivers Certified EDA Flows and High-Quality IP for Intel 16 Process
Siemens' Calibre platform now certified for IFS' Intel 16 process technology
'Correct by construction' tool for chip power layout down to 2nm
Imperas details verification of automotive AI RISC-V vector processor IP
Second contest for Generative AI chip design
proteanTecs and Teradyne Partner to Bring Machine Learning-driven Telemetry to SoC Testing
TSMC to construct second chip plant in Japan, aims to start production in 2026
Sunday, July 9, 2023
TSMC June 2023 Revenue Report
Siemens expand collaboration with AWS to help IC and electronics design customers accelerate innovation
Siemens advances intelligent custom IC verification platform with new, AI-powered Solido Design Environment
Electronic System Design Industry Logs $4 Billion in Revenue in Q1 2023, ESD Alliance Reports
Cadence and Imperas Support NSITEXE in the Development of Advanced RISC V Vector Processor IP for Automotive AI Applications
Siemens unveils Calibre DesignEnhancer for Calibre correct-by-construction IC layout optimization
Alphawave Semi Spearheads Chiplet-Based Custom Silicon for Generative AI and Data Center Workloads with Successful 3nm Tapeouts of HBM3 and UCIe IP
Xpeedic Launches High-Speed Digital Signal Integrity, Power Integrity Suite at Design Automation Conference
End-to-end design and verification for PCIe 6.0
Siemens advances intelligent custom IC verification platform with new, AI-powered Solido Design Environment
Samsung Reports Net Zero Progress, Pledges Over $5B by 2030
Bespoke EDA Differentiates Silicon Chips
T2M invites Customers to explore High Performance, Cost-effective and Innovative IP Cores Solutions at DAC 2023
Thursday, July 6, 2023
Efabless Corporation Launches Its Second AI-Generated Chip Design Contest
sureCore and Universal Quantum announce tape out of cryogenic IP demonstrator chip
Global Semiconductor Sales Increase 1.7% Month-to-Month in May
Wednesday, July 5, 2023
Empowering Greener Future: Role Of Energy Storage Systems
SilTerra Leverages Silvaco's Library Characterization and Optimization Tools to Boost Efficiency in the Development of its Foundry Standard Cell IPs
Codasip welcomes Axel Strotbek as new chairman of the board
Imperas Helps Navigate the Journey to RISC-V Based Silicon at DAC 2023
UMC Reports Sales for June 2023
Despite Export Ban on Equipment, China's Semiconductor Expansion in Mature Processes Remains Strong, Says TrendForce
IC Manage GDP-XL Enterprise IP Catalog enables NXP to Improve IP Asset Management and Reuse
True Circuits Attends 60th Design Automation Conference, Celebrates 25 Years of Timing Excellence
New PNG Encoder IP Core Expands CAST's Lossless Compression Suite
Tuesday, July 4, 2023
proteanTecs to Showcase the Future of Health and Performance Monitoring at DAC and SEMICON West 2023
imec looks to process flow for sub-nm stacked CFET transistors
Truechip: Exhibiting and Showcasing Latest Verification IPs and NOC IPs at Design Automation Conference (DAC) 2023
GUC Monthly Sales Report - June 2023
True Circuits Announces Availability of JSPICEâ„¢ Simulation and Design Environment
Faraday to Exhibit FPGA-Go-ASIC, SONOS eFlash, and eFPGA Solutions at DAC 2023
EUROPRACTICE starts offering access to Pragmatic's flexible integrated circuit foundry services through imec
Monday, July 3, 2023
Infineon and Kontrol join forces to improve the safety of autonomous vehicles
Advanced Packaging, Performance, power, size, weight, cost... The choice is yours!
Samsung tapes out 2nm backside routing test chip
Imec Advances GaN-on-Si and InP-on-Si Technologies for Next-Gen Wireless Communication
AI Can't Design Chips Without People
Sunday, July 2, 2023
Canada's semiconductor industry seeks renaissance from AI, shifting geopolitics
Rapidus CEO Chasing Single-Wafer-Processing Dream
Tiempo Secure's new TESIC RISC-V IP successfully passes SERMA CC EAL5+ security assessment tests
AccelerComm Announces 5G PUSCH Channel Equalizer
OPENEDGES Showcases Live Demo of PHY Vision at Design Automation Conference (DAC) 2023
ADTechnology Joins Synopsys IP OEM Partner Program
StarFive and Youyeetoo jointly delivered the official metal case for VisionFive 2
Synopsys and Golden Electronics Collaborate to Expand Chip Design Talent in Jordan
Single Carrier Modem Available For Immediate Licensing From Global IP Core
Bluetooth Dual Mode V5.3 RF Transceiver IP Cores in 40nm ULP is Available for Immediate Licensing
Thursday, June 29, 2023
CAST Introduces New MACsec Protocol Engine IP Cores
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