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Tuesday, June 13, 2023

• Samsung broadens IP portfolio to narrow gap with TSMC
• PCI-SIG® Announces New Research Projecting PCI Express® Technology TAM Expected to Reach $10 Billion by 2027
• Intel in cooler chips project
• Cadence and Samsung Foundry to expand 5nm automotive IP
• Samsung Electronics to hoist foundry IP portfolio to narrow gap with TSMC
• proteanTecs Achieves ASIL-B Automotive Functional Safety Certification
• Cadence and Samsung Foundry Enter Multi-Year Agreement to Expand Design IP Portfolio
• Signature IP chooses IPro for Sales Representation in Israel
• Intel talking to Arm about becoming an anchor investor in Arm IPO
• Alphawave Semi Expands Collaboration with Samsung, Adds 3nm Connectivity IP to Meet Accelerated AI and Data Center Demand
• Exec tried to set up copy-cat Samsung fab in China
• PCI-SIG® Announces New Research Projecting PCI Express® Technology TAM Expected to Reach $10 Billion by 2027
• Synopsys and Samsung Collaborate to Deliver Broad IP Portfolio Across All Advanced Samsung Foundry Processes
• Chiplets advancing one design breakthrough at a time
• Global 300mm Fab Equipment Spending Forecast to Reach Record $119 Billion in 2026, SEMI Reports

Tuesday, June 13, 2023

• Cadence Enhances Unified Custom/Analog Flow to Boost Productivity at Nodes Down to 20nm

Tuesday, June 13, 2023

• NetLogic Microsystems Announces Definitive Agreement to Merge with RMI Corporation

Tuesday, June 13, 2023

• MIPS64 Architecture Powers New Superscalar XLP Processor from RMI Corporation

Tuesday, June 13, 2023

• RMI Announces Next Generation Multi-Core Processor Architecture and Product Family Developed on 40nm Process with Frequencies Greater than 2.0 GHz

Tuesday, June 13, 2023

• RMI and SPIRIT Form Strategic Partnership

Tuesday, June 13, 2023

• RMI Corporation Launches Industry's First Quad-Core Multi-Threaded Processor With Integrated Serial RapidIO Interface and IEEE1588 Controller for Wireless Base-Station Markets

Tuesday, June 13, 2023

• INSIDE Secure Introduces DRM Fusion Essential at the NAB Show 2015

Monday, June 12, 2023

• Intel to anchor rival chip designer Arm's IPO?
• TSMC's biggest chiplet backend fab opens for business
• Chiplets advancing one design breakthrough at a time
• Movellus Announces Industry-First Integrated Droop Response System for SoCs
• Tachyum Among Recipients of 8.1 Billion Euro IPCEI Grant
• First Generation SiMa.ai Edge AI Platform Enters Mass Production Amidst Surge in Company Momentum
• Efabless Reveals Winners of AI-Generated Silicon Design Challenge
• Achronix Pushes the Boundaries of Networking with 400 GbE and PCIe Gen 5.0 for SmartNICs
• Lockheed Martin and GlobalFoundries Collaborate to Advance Innovation and Resiliency of Chips for National Security
• AONDevices Introduces Breakthrough Super Low-Power, Low-Latency, Customizable Edge AI Speech Enhancement
• BittWare selects EdgeCortix's SAKURA-I AI Processors as its Edge Focused Artificial Intelligence Acceleration Solution

Sunday, June 11, 2023

• The Semiconductor Industry's Most Important Tool Goes Green
• Intel German fab in doubt
• Apple completes its ARM lineup with 5nm, 134billion transistor M2 Ultra
• SynSense releases the Speckâ„¢ Demo kit, enabling users to rapidly deploy and validate event-based neuromorphic vision applications
• Securing Embedded Systems - Making it the Norm
• Top 10 Foundries Report Nearly 20% QoQ Revenue Decline in 1Q23, Continued Slide Expected in Q2, Says TrendForce
• Jim Keller on AI, RISC-V, Tenstorrent's Move to Edge IP
• BrainChip Examines New Approach to Optimizing Time-series Data

Friday, June 9, 2023

• RISC-V Summit Europe 2023 ended in Barcelona but the #riscv revolution has only just begun

Friday, June 9, 2023

• TSMC Announces the Opening of Advanced Backend Fab 6, Marking a Milestone in the Expansion of 3DFabricâ„¢ System Integration Technology

Thursday, June 8, 2023

• D&R IP SoC Day China
• TSMC Announces the Opening of Advanced Backend Fab 6, Marking a Milestone in the Expansion of 3DFabric™ System Integration Technology
• TSMC May 2023 Revenue Report

Thursday, June 8, 2023

• Infineon's HYPERRAMâ„¢ 3.0 memory and Autotalks' 3rd generation chipset drive next-generation automotive V2X applications

Wednesday, June 7, 2023

• EU approves €21bn regional IPCEI microelectronics project
• Leading Aerospace and Defense Company purchases Interlaken IP core from Comcores
• Cortus Launches ULYSS automotive MCU family
• Computex 2023 Reveals Taiwan's Critical Role in AI
• Infineon's HYPERRAM™ 3.0 memory and Autotalks' 3rd generation chipset drive next-generation automotive V2X applications
• Q1 2023 Global Semiconductor Equipment Billings Grow 9% Year-Over-Year, SEMI Reports
• Imec's process technology roadmap to 2036
• Arasan announces the Industry's First CAN FD Light Bus Controller IP

Tuesday, June 6, 2023

• MIPI DevCon 2023 - Cancelled
• Renesas Completes Acquisition of Panthronics
• Cadence expands Arm agreement for EDA tool verification
• Kalray Announces Production Launch of New "Coolidgeâ„¢2" DPU Processor Optimized for AI and Intensive Data Processing
• Green Hills Software adds support for production-ready RTOS and tools to Imagination Technologies' RISC-V CPUs
• intoPIX and PlexusAV Pioneer IPMX Standard-Based AV-over-IP Solutions
• S2C Accelerates Development Timeline of Bluetooth LE Audio SoC
• Kalray Announces Production Launch of New "Coolidge™2" DPU Processor Optimized for AI and Intensive Data Processing
• Arm SystemReady surpasses 100 certifications, driving standardization where it matters
• Global Semiconductor Sales Increase 0.3% Month-to-Month in April
• Defacto will celebrate its 20th anniversary at DAC with customer presentations and major technical announcements

Monday, June 5, 2023

• Startup to raise €3bn for European green datacentres
• Neuromorphic computing systems for software-defined radio devices
• It's a go for the GF-ST joint FDSOI fab in Crolles
• The challenges Intel faces to compete with TSMC, Samsung
• TSMC studying 2nd fab in Kumamoto, focusing on mature technologies
• Marquee Semiconductor Acquires Semikunn Technology Services, Expanding Design Services Portfolio
• UMC Reports Sales for May 2023
• VeriSilicon Obtained Bluetooth 5.3 Certification for Its Complete Bluetooth Low Energy Solution
• Actions Technology Partners with PUFsecurity to Secure Wireless Bluetooth and IoT Applications

Sunday, June 4, 2023

• INTERVIEW: 'Intel is committed to reaching net-zero greenhouse gas emissions by 2040, already runs operations globally by over 90% on renewable electricity': CSO

• Complete RISC-V analog IP subsystem targets IoT
• Dolphin Design picks Imperas for processor functional verification
• Dolphin Design Selects Imperas for Processor Functional Design Verification
• Consortium's Move Will Boost RISC-V Ecosystem, Thankfully
• Microchip Slashes Time to Innovation with Industry's Most Power-Efficient Mid-Range FPGA Industrial Edge Stack, More Core Library IP and Conversion Tools
• Andes Technology Showcases Pioneering RISC-V CPU IP Solutions at RISC-V Summit Europe
• GUC Monthly Sales Report - May 2023
• Are Chiplets Enough to Save Moore's Law?
• GlobalFoundries and STMicroelectronics Finalize Agreement for New 300mm Semiconductor Manufacturing Facility in France
• Silicon Proven 12bit 1Gsps DAC IP Core designed for Wireless RF Applications is available for immediate license
• BrainChip and Lorser Industries to Develop Neuromorphic Computing Systems for Software-Defined Radio Devices
• Agile Analog launches first complete RISC-V analog IP subsystem at RISC-V Summit Europe
• Imperas at the RISC-V Summit Europe, June 5-9 2023

Thursday, June 1, 2023

• RISE project gives RISC-V an open source software lift
• Axiomise Launches Next-Generation formalISA App for RISC-V Processors