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Thursday, March 6, 2025

• From AI to satellite: Mobile World Congress 2025
• Baya Systems Revolutionizes AI Scale-Up and Scale-Out with NeuraScale™ Fabric
• Axelera AI Secures up to €61.6 Million Grant to Develop Scalable AI Chiplet for High-Performance Computing

Thursday, March 6, 2025

• Synopsys Responds to U.K. Competition and Markets Authority's Phase 1 Announcement Regarding Ansys Acquisition

Thursday, March 6, 2025

• EnSilica Secures €2.13 Million European Space Agency Development Contract

Thursday, March 6, 2025

• QuantWare raises €20 million Series A to power the world's largest quantum computers

Thursday, March 6, 2025

• Codasip selected to design a high-end RISC-V processor for the EU-funded DARE project

Wednesday, March 5, 2025

• Neurons cast in silicon: AI chip SENNA accelerates spiking neural networks
• Nordic Semiconductor partners with Skylo for IoT expansion
• €240m DARE project for AI RISC-V chiplets
• Infineon, Synopsys to show virtual prototype of first automotive RISC-V microcontroller
• Pragmatic launches platform for mixed-signal flexible ASIC design
• Renesas and Altium Announce Introduction of Renesas 365, Powered by Altium: Groundbreaking Industry Solution for Software-Defined Products
• Intel Foundry's Moment of Truth: Will 18A Deliver?
• Infineon brings RISC-V to the automotive industry and is first to announce an automotive RISC-V microcontroller family
• Europe takes a major step towards digital autonomy in supercomputing and AI with the launch of DARE project
• QuantWare raises €20 million Series A to power the world's largest quantum computers
• EnSilica Secures €2.13 Million European Space Agency Development Contract
• EMASS and Weebit Nano collaborate on ultra-low-power edge AI demonstration using ReRAM
• Weebit Nano - 1H FY25 financial results
• EMASS and Weebit Nano collaborate on ultra-low-power edge AI demonstration using ReRAM

Wednesday, March 5, 2025

• MosChip® Launches MosChip DigitalSky GenAIoTâ„¢ to Accelerate the Development of Next-Gen Connected, Intelligent Products

Wednesday, March 5, 2025

• Omni Design Technologies Extends Swiftâ„¢ Data Converter Solutions for FR1 and FR2 5G Subsystems

Wednesday, March 5, 2025

• Malaysia taps ARM for $250m chip boost

Tuesday, March 4, 2025

• Vietnam approves $500 million for semiconductor plant
• Arm Compute Platform at the Heart of Malaysia's Silicon Vision
• Synopsys Responds to U.K. Competition and Markets Authority's Phase 1 Announcement Regarding Ansys Acquisition
• Quantware raises €20m for 1m qubit quantum computer
• AONDevices Partners with Faraday to Enhance Production Capabilities
• MosChip® Launches MosChip DigitalSky GenAIoT™ to Accelerate the Development of Next-Gen Connected, Intelligent Products
• Pragmatic Semiconductor launches next-generation platform for mixed-signal flexible ASIC design with early-access programme
• Omni Design Technologies Extends Swift™ Data Converter Solutions for FR1 and FR2 5G Subsystems
• Quintauris launches the first RISC-V profile for today's real-time automotive applications

Tuesday, March 4, 2025

• Marvell Demonstrates Industry's Leading 2nm Silicon for Accelerated Infrastructure

Monday, March 3, 2025

• TSMC Intends to Expand Its Investment in the United States to US$165 Billion to Power the Future of AI
• Silvaco Expands Product Offering with Acquisition of Cadence's Process Proximity Compensation Product Line
• STMicroelectronics Announces Two New Generations of Microcontrollers (MCUs) for IoT Devices
• indie Semiconductor and GlobalFoundries Announce Strategic Collaboration to Accelerate Automotive Radar Adoption
• Broadcom, NVIDIA Reportedly Running Test Chips Through Intel's Foundry Business
• Arm vs. Qualcomm: The Legal Tussle Continues
• MIPS Drives Real-Time Intelligence into Physical AI Platforms
• Ceva Collaborates with Arm and SynaXG to Redefine Energy Efficient 5G NR Processing for Sustainable LEO Satellites and 5G-Advanced Wireless Infrastructure
• Semidynamics' Aliado SDK Accelerates AI Development for RISC-V with Seamless ONNX Integration

Sunday, March 2, 2025

• Marvell Demonstrates Industry's Leading 2nm Silicon for Accelerated Infrastructure
• SEALSQ Enters Into Exclusive Negotiations to Acquire 100% of IC'ALPS
• Ceva and Sharp Collaborate on "Beyond 5G" IoT Terminals
• intoPIX Expands its offering for Medical, Human & Machine Vision Applications with TicoRAW & JPEG-XS on Lattice Low-Power FPGAs
• CAST Releases First Commercial SNOW-V Stream Cipher IP Core
• eMemory and PUFsecurity Launch World's First PUF-Based Post-Quantum Cryptography Solution to Secure the Future of Computing
• Agile Analog extends leadership in customizable analog security IP with new clock attack monitor

Saturday, March 1, 2025

• Does Your NPU Do VLMs? It Better!

Friday, February 28, 2025

• Guest Post: Current Challenges With Protecting Quantum Computing IP

Thursday, February 27, 2025

• Weebit Nano accelerates commercial activity through a licence with onsemi
• SEALSQ Enters Into Exclusive Negotiations to Acquire 100% of IC'ALPS
• Nvidia's Record $39.3 Billion Q1, Synopsys Q1 and Blackwell, Plus Chips Act Funding

Thursday, February 27, 2025

• Attopsemi Expands its Proven I-fuse® OTP Portfolio on X-FAB's 180nm Platform

Wednesday, February 26, 2025

• GlobalFoundries and MIT Collaborate to Advance Research and Innovation on Essential Chips for AI
• Ceva Unveils Latest High-Performance, High-Efficiency Communication DSPs for Advanced 5G and 6G Applications
• X-Silicon Revolutionizes AI and Graphics at the Edge with "Constellation" Software Platform
• Arm Drives Next-Generation Performance for IoT with World's First Armv9 Edge AI Platform
• SkyWater to Acquire Infineon's Austin Fab and Establish Strategic Partnership to Expand U.S. Foundry Capacity for Foundational Chips
• VeriSilicon unveils low-power AI Noise Reduction and AI Super Resolution IPs
• Dolphin Semiconductor Provides High-Performance LDO Regulators in TSMC 22nm to Ingenic for IPC Applications
• Attopsemi Expands its Proven I-fuse® OTP Portfolio on X-FAB's 180nm Platform
• Sustainable design is an evolution of industrial design

Tuesday, February 25, 2025

• Jim Keller joins ex-Intel chip designers in RISC-V startup focused on breakthrough CPUs
• Synopsys shares gain on stronger-than-expected earnings forecast
• Interview with Xiphera CEO - Adapting to Market Changes
• PsiQuantum Announces Omega, a Manufacturable Photonic Quantum Computing Chipset
• Socionext Announces Strategic Partnership with Google Quantum AI in Quantum Computing Development
• QuickLogic Announces $1.1M eFPGA IP Contract with new Defense Industrial Base Customer
• Intel, Synopsys, TSMC All Unveil Record Memory Densities The move to nanosheet transistors is a boon for SRAM
• Meet T2M @ MWC 2025 to learn about Cutting-Edge RF, Wireless, Automotive Semiconductor IP Cores & ASIC services
• BrainChip Collaborates with Onsor Technologies To Power Epileptic Seizure-Detecting Glasses
• Semiconductor Industry Faces a Seismic Shift
• Baya Systems and Semidynamics Collaborate to Accelerate RISC-V System-on-Chip Development

Monday, February 24, 2025

• Dnotitia and Finders Establish Strategic Partnership to Develop AI-driven Insurance Solution
• Andes Technology and proteanTecs Partner to Bring Performance and Reliability Monitoring to RISC-V Cores
• Arteris Releases the Latest Generation of Magillem Registers to Automate Semiconductor Hardware/Software Integration
• Imagination takes efficiency up a level with latest D-Series GPU IP
• Q.ANT and IMS CHIPS Launch Production of High-Performance AI Chips, Establish Blueprint for Strengthening Chip Sovereignty
• sureCore PowerMiser IP enables KU Leuven chip for AI applications to achieve dynamic power saving of greater than 40%

Sunday, February 23, 2025

• TSMC's Efforts In 2nm Production Could See The Company Reaching 50,000 Monthly Wafers In 2025; With Both Facilities Operational, Output Could Reach 80,000 Units
• Maximum efficiency at minimum power consumption: New options for integrating RFicient® receivers
• Intel set to begin 18A tape-outs later this year, according to reports
• Cortus MINERVA Out-of-Order 4GHz 64-bit RISC-V Processor Platform targets automotive applications
• Quadric Announces Lee Vick is New VP Worldwide Sales
• ZeroPoint Technologies Unveils Groundbreaking Compression Solution to Increase Foundational Model Addressable Memory by 50%
• AheadComputing Raises $21.5M Seed Round and Introduces Breakthrough Microprocessor Architecture Designed for Next Era of General-Purpose Computing
• Siemens delivers certified and automated design flows for TSMC 3DFabric technologies