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Friday, February 21, 2025

• Veriest Solutions Strengthens North American Presence at DVCon US 2025

Thursday, February 20, 2025

• Breker RISC-V SystemVIP Deployed across 15 Commercial RISC-V Projects for Advanced Core and SoC Verification

Thursday, February 20, 2025

• STMicroelectronics to ramp new silicon photonics process

Wednesday, February 19, 2025

• STMicroelectronics Unveils Silicon Photonics, BiCMOS Technologies to Power Next-Gen AI Data Centers
• Ex-Intel team raise $21.5m to pursue RISC-V for AI
• Driving the efficiency of artificial intelligence
• EU funding for Infineon Dresden smart power fab approved
• Logic Fruit Technologies to Showcase Innovations at Embedded World Europe 2025
• Intel in advanced talks to sell Altera to Silverlake
• CEA and Quobly Report Simultaneous, Microsecond Qubit-Readout Solution With 10x Power-Use Reduction
• CEA and Quobly Report Simultaneous, Microsecond Qubit-Readout Solution With 10x Power-Use Reduction

Wednesday, February 19, 2025

• 2025 Outlook with Paul Wells of sureCore

Tuesday, February 18, 2025

• Getting Started with Chip Eco-Design Methodology
• YorChip announces Low latency 100G ULTRA Ethernet ready MAC/PCS IP for Edge AI
• CEA and Quobly report microsecond qubit-readout solution with 10x power-use reduction
• RaiderChip NPU for LLM at the Edge supports DeepSeek-R1 reasoning models
• Arteris Revolutionizes Semiconductor Design with FlexGen - Smart Network-on-Chip IP Delivering Unprecedented Productivity Improvements and Quality of Results

Monday, February 17, 2025

• €29m for 6G chiplet packaging line in Finland
• VeriSilicon: The "IP family" is on fire, and the three major markets will go hand in hand in 2025
• Synopsys Teams Up with SEMI Foundation to Drive Workforce Development Initiatives in Semiconductor Industry
• Unlocking Quantum Advantage Lies Not Just with Qubits but with Gates
• S2C Teams Up with Arm, Xylon, and ZC Technology to Drive Software-Defined Vehicle Evolution
• AccelerComm® announces 5G NR NTN Physical Layer Solution that delivers over 6Gbps, 128 beams and 4,096 user connections per chipset
• AccelerComm® announces 5G NR NTN Physical Layer Solution that delivers over 6Gbps, 128 beams and 4,096 user connections per chipset

Sunday, February 16, 2025

• Mirabilis Design Accelerates SoC Development with New System-Level IP Library for Cadence Tensilica Processors
• Funding to boost Europe's semiconductor production
• Blueshift Memory starts £2.77 million development project with AP Memory and Syntronix of Taiwan
• TSMC Will Not Take Over Intel Operations, Observers Say
• ARM signs Meta as first chip product customer, says report

Thursday, February 13, 2025

• Arm takes manufacturing into its own hands as it plans to sell chips
• Qualitas Semiconductor entered into IP Licensing Agreement with a Leading Korean System Semiconductor Design Company
• Why RISC-V is a viable option for safety-critical applications

Wednesday, February 12, 2025

• New Memory Architectures for SoCs and Multi-Die Systems
• What Will Sustainable Semiconductor Manufacturing Look Like by 2035?
• Ceva, Inc. Announces Fourth Quarter and Full Year 2024 Financial Results
• Synopsys Expands the Industry's Highest Performance Hardware-Assisted Verification Portfolio to Propel Next-Generation Semiconductor and Design Innovation
• Paras Defence Invests in Logic Fruit Technologies to Boost Defence Tech Capabilities at AERO India 2025
• Worldwide Silicon Wafer Shipments and Revenue Start Recovery in Late 2024, SEMI Reports
• Can silicon photonics overcome scaling challenges for AI and data centers?

Tuesday, February 11, 2025

• Soitec Accelerates Diversification to Withstand Down Cycles
• OpenAI to tape-out on TSMC 3nm this year
• Semiconductor Giants Navigate AI Boom & Trade War
• Could Thomas Caulfield lead Intel or a merged Intel-GloFo?
• Siemens to accelerate customer time to market with advanced silicon IP through new Alphawave Semi partnership
• TSMC Board of Directors Meeting Resolutions

Monday, February 10, 2025

• intoPIX Drives Innovation in Automotive Ethernet and Data Transmission
• ListenAI Licenses Ceva-Waves Wi-Fi 6 IP, Bringing Seamless Wireless Connectivity to its Edge AI Portfolio
• Groundbreaking Formal Verification Further Enhances the Quality of CHERIoT-Ibex

Monday, February 10, 2025

• Rambus to Present at Loop Capital Expert Call and Morgan Stanley Technology, Media & Telecom Conference
• Exploring Rapidus' Path to 2nm Mass Production: 3 Key Challenges Ahead

Sunday, February 9, 2025

• Silicon Creations Expands Clocking IP Portfolio on TSMC N2P Technology including Novel Temperature Sensor Design
• UMC Reports Sales for January 2025
• CEA-Leti Announces FAMES Pilot Line In Nature Reviews Electrical Engineering
• Gelsinger Invests In British AI Chip Startup Fractile
• EnSilica: Unaudited Results for the Half Year Ended 30 November 2024
• Onsemi's Treo Taps Weebit ReRAM
• Qualcomm says Arm has withdrawn license breach notice
• Logic Fruit Announces Strategic Partnership with PACE at Aero India 2025
• TSMC January 2025 Revenue Report and the Statement on the Impact of Earthquake
• EnSilica: Unaudited Results for the Half Year Ended 30 November 2024
• QuickLogic Integrates Synopsys Synplify Synthesis for Best-in-Class Quality of Results
• QuickLogic Unveils Aurora 2.9: Enhanced Performance and Seamless Integration
• T2M IP Announces Licensing of ASIL-B Qualified CAN XL, QSPI, LIN 2.0, I2C IP Cores to Leading Automotive Customer
• CEA-Leti Announces FAMES Pilot Line in Nature Reviews Electrical Engineering
• SoftBank in talks to buy server chip firm Ampere
• CEA-Leti Announces FAMES Pilot Line In Nature Reviews Electrical Engineering
• Gartner Says Worldwide Semiconductor Revenue Grew 18% in 2024
• Veriest Solutions Strengthens North American Presence at DVCon US 2025