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Thursday, November 20, 2025

• Breker Verification Systems and Frontgrade Gaisler Collaborate on High-Reliability RISC-V Fault-Tolerant Processor Core
• Mixel MIPI IP Integrated into Automotive Radar Processors Supporting Safety-critical Applications
• Dnotitia Revolutionizes AI Storage at SC25: New VDPU Accelerator Delivers Up to 9x Performance Boost
• Three Ethernet Design Challenges in Industrial Automation
• Scintil Photonics: AI at the speed of light
• Denmark Opens 300-mm Wafer Fab to Strengthen Europe’s Sovereignty
• Arm Neoverse platform integrates NVIDIA NVLink Fusion to accelerate AI data center adoption
• AMD maps out strategy for leadership in future compute and AI
• GlobalFoundries and BAE Systems Collaborate on Semiconductors for Space
• proteanTecs and Akeana Announce Joint Initiative to Drive Next-Generation RISC-V Processor Performance
• RISC-V And Its Modularity Shine Across Applications
• Siemens and Microsoft team up to deliver Polarion X on Azure
• Cadence Debuts Its First System Chiplet Silicon To Accelerate Physical AI Development
• Chinese crypto-mining manufacturers order next-gen 2nm GAA chips from Samsung Foundry
• GlobalFoundries Acquires Advanced Micro Foundry, Accelerating Silicon Photonics Global Leadership and Expanding AI Infrastructure Portfolio
• CEA-Leti to Launch Multilateral Program to Accelerate AI with MicroLED Data Links

Wednesday, November 19, 2025

• QuickLogic eFPGA Hard IP Selected by Chipus for 12 nm High Performance Data Center ASIC
• EagleChip Selects CAST TSN IP Core to Enhance Advanced Intelligent Control SoC

Tuesday, November 18, 2025

• Moreh and Tenstorrent reveal joint AI data center solution
• SAICEC and Siemens to accelerate chip-to-vehicle validation using digital twin technology

Monday, November 17, 2025

• d-Matrix and Andes Team on World's Highest Performing, Most Efficient Accelerator for AI Inference at Scale
• Ceva Receives 2025 IoT Edge Computing Excellence Award from IoT Evolution World
• AI's Speed Problem Sparks Light-Based Chip Revolution
• Samsung & Nvidia: Rewiring Manufacturing With AI Megafactory
• GlobalFoundries Reports Third Quarter 2025 Financial Results
• Bluetooth Channel Sounding: The Next Leap in Bluetooth Innovation
• EPI announces the open-source release of the CEA-List VPSim simulator
• EPI announces SC25 attendance to present results: Proactive Compute showcases FAUST and FEVER
• Renesas’ Industry-First Gen6 DDR5 Registered Clock Driver Sets Performance Benchmark by Delivering 9600 MT/s
• Silicon Photonic Chiplets with In-memory Computing Accelerate LLM Inference, Surpassing H100 Efficiency
• TSMC, Samsung Reportedly Cut 8-Inch Wafer Output, Boosting Korea’s DB HiTek
• Intel's 18A process technology – a lifeline for the Intel Foundry department?
• EnSilica to develop quantum-resilient secure processor chip for critical national infrastructure applications backed by £5m UK Government ‘Contract for Innovation’
• GUC and Ayar Labs Partner to Advance Co-Packaged Optics for Hyperscalers

Friday, November 14, 2025

• IntelPro Licenses Ceva Wi-Fi 6 and Bluetooth 5 IPs to Launch AIoT Matter-Ready SoCs
• CAST Introduces JPEG XL Encoder IP Core for High-Quality, On-Camera Still-Image Compression
• SkyeChip Berhad and Persimmons, Inc. Announce Strategic IP Licensing Partnership

Thursday, November 13, 2025

• Light into data: How silicon photonics is powering the AI data center revolution
• European Technological Sovereignty: Visionary or Illusory?
• TSMC sales solid, but may be slowing
• Keysight Named a Leader in 2025 Gartner® Magic Quadrant™ for AI-Augmented Software Testing Tools
• Key ASIC Signals Strong Growth Momentum Amid AI Boom
• Siemens and NVIDIA Preview Industrial Tech Stack for AI-Era Manufacturing
• Metalenz and UMC Bring Breakthrough Face Authentication Solution Polar ID to Mass Production
• TSMC Board of Directors Meeting Resolutions
• QuickLogic Reports Fiscal Third Quarter 2025 Financial Results
• Cadence Welcomes ChipStack
• Innatera signs Joya as ODM customer, bringing neuromorphic edge AI into everyday connected products
• VeriSilicon and Google Jointly Launch Open-Source Coral NPU IP
• lowRISC® and Partners to Deliver Commercial-Quality, Open-Source CHERI Secure Enclave with InnovateUK Support
• How Advanced Packaging is Unleashing Possibilities for Edge AI
• GlobalFoundries Licenses GaN Technology from TSMC to Accelerate U.S.-Manufactured Power Portfolio for Datacenter, Industrial and Automotive Customers

Wednesday, November 12, 2025

• United Micro Technology and Ceva Collaborate for 5G RedCap SoC to Accelerate Connected Vehicle Adoption
• Ceva, Inc. Announces Third Quarter 2025 Financial Results
• Secure-IC, now a part of Cadence, unveils Securyzr™ Xperience, an Exclusive Gateway to Security Innovation

Tuesday, November 11, 2025

• Blaize Deploys Arteris NoC IP to Power Scalable, Energy-Efficient Edge AI Solutions
• CAST Reaches 200 CAN IP Core Customers

Monday, November 10, 2025

• The ISA Wars Have Ended And The Heterogeneous CPU Era Has Arrived
• Day 2 of PIC Summit: Photonic Chip Applications Taking Centre Stage
• High Tech Campus Eindhoven Invests in, and Constructs Building and Cleanroom Facilities for TNO’s 6-inch Photonic Chip Pilot Line
• TSMC Reportedly Plans 12 New Advanced Process and Packaging Fabs in Taiwan as 2nm Supply Tightens
• TSMC’s 3nm Process Has Entered ‘Golden Period Of Mass Production,’ Estimates State That Monthly Wafer Production Can Reach 160,000 Units By The End Of 2025
• QuickLogic Accelerates Space Innovation with Secure, Customizable eFPGA Hard IP
• Keysight Recognized with 2025 TSIA STAR Award for Excellence in Omnichannel Customer Experience Optimization
• Global Semiconductor Sales Increase 15.8% from Q2 to Q3; Month-to-Month Sales Grow 7.0% in September
• Adeia Initiates Patent Infringement Litigation Against AMD
• TSMC October 2025 Revenue Report