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Monday, October 10, 2022

• CEA & Schneider Electric Extend R&D Collaboration To Bring Secure and Resilient Digital Solutions To Energy Management and Industrial Automation
• Intel's Road to a Universal Quantum Computer Is Via Chiplets
• 8nm RFIC Flow Supports All Stages of RFIC Design Process
• eFPGA expands the ecosystem footprint one deal at a time
• No Korean Company Included in World's Top 10 in Chip Packaging
• Intel plans 3nm chiplet for satellite terminal
• DCD-SEMI introduces multiprotocol combo: HDLC, UART, SPI... with bigger FIFO and...
• SEMI ESD Alliance Adds Axiomise to Member Roster
• Andes Technology Announces Return of the Annual RISC-V CON on October 18th in the San Jose Airport DoubleTree Hotel
• Tiempo Secure becomes a Strategic Member of RISC-V International

Sunday, October 9, 2022

• Intel Horse Creek platform showcased with SiFive P550 RISC-V CPU, 8GB DDR5, PCIe Gen5
• EnOcean accelerates its growth and breadth of energy-saving solutions through the acquisition of the assets of the edge computing solutions business from Renesas
• TSMC September 2022 Revenue Report
• Introducing PCIe 4.0 PHY IP Cores in 7nm for a reliable, Low area and High-Speed Interface Peripheral slot for all your High-End Devices

Thursday, October 6, 2022

• It's Time to Consider RISC-V
• Creonic Releases DVB-RCS2 Multi-carrier Satellite Receiver IP Core
• Sondrel announces its intention to list on London Stock Exchange's AIM market on 21 October 2022

Wednesday, October 5, 2022

• The Role of Semiconductors in the Renewable Energy Transition
• Arm chops staff
• UMC Reports Sales for September 2022
• No suggestion from Softbank about Samsung investing in Arm, say reports
• GUC Monthly Sales Report - September 2022
• Samsung Electronics Unveils Plans for 1.4nm Process Technology and Investment for Production Capacity at Samsung Foundry Forum 2022
• GBT Filed a Non-Provisional Patent for Automatic Generation of Integrated Circuits Layout Blocks
• Samsung unveils advanced-chipmaking roadmap, intensifying rivalry with TSMC

Tuesday, October 4, 2022

• Perforce Delivers Enhanced Support for Test Automation in Latest Helix ALM Release
• Synopsys Unveils Breakthrough Golden Signoff ECO Solution, Delivering 10x Productivity Improvement
• Credo Introduces Screaming Eagle 112G Retimer DSP with Industry Leading 1.6 Terabit Capacity
• ARM details updated v9 architecture

Monday, October 3, 2022

• SEGGER and Cadence team up to add native J-Link support for Cadence Tensilica cores
• Nobel prize awarded for quantum entanglement
• EuroHPC JU Selects 6 Sites Across the EU for Quantum Computers
• Capgemini fuels collaboration with Panasonic Automotive Systems Company of America through transformative new data platform
• QuickLogic Partners with ChipMotion for eFPGA Implementations in SoC Designs
• Synopsys Expands Code Sight Standard Edition with IntelliJ Support
• Siemens' Aprisa digital implementation solution certified for Samsung Foundry's advanced 4nm processes
• Global Semiconductor Sales Increase 0.1% Year-to-Year in August
• EU chip plan would cost €500bn, says NXP CEO
• Samsung Foundry Certifies Cadence Voltus-XFi Custom Power Integrity Solution for 5LPE Process Technology
• Cadence and Samsung Foundry Collaborate to Certify RFIC Design Reference Flow on 8nm Process Technology

Monday, October 3, 2022

• Vidatronic Unveils OmniPOWERâ„¢ Distributed Power Systems Available for Licensing in FinFET Technologies

Monday, October 3, 2022

• easics launches nearbAIâ„¢ IP cores for XR devices that will set the standard for extreme edge AI performance and immersive experiences

Sunday, October 2, 2022

• Synopsys Unified Platform Tackles Verification Requirements
• SEMIFIVE Announces New 5nm HPC SoC Platform
• Global Fab Equipment Spending Forecast to Reach All-Time High of Nearly $100 Billion in 2022, SEMI Reports
• Synopsys and Samsung Foundry Enable 3nm Process Technology for Power- and Performance-Demanding Mobile, HPC and AI Designs
• Siemens' Calibre platform now certified for Samsung's advanced 3nm process technology
• Mobileye files for IPO, reveals data
• Introducing superfast serial interfacing with JESD204B Tx - Rx PHY IP Cores in 12nm, 28nm and 40nm for all type of ADC/DAC and ASIC/FPGA connections

Saturday, October 1, 2022

• RF Module Eyes IoT Networking Using Satellite Comms

Friday, September 30, 2022

• Veridify Security Announces Commitment to Global Cybersecurity Success, Becomes a Cybersecurity Awareness Month 2022 Champion

Thursday, September 29, 2022

• Soitec Sees Big Opportunity in EVs with SmartSiC Wafers
• Intel Tackles Next-gen Computing with Quantum and Neuromorphic Innovations
• Wafer Makers Continue to Aggressively Expand Facilities
• Vidatronic Unveils OmniPOWER™ Distributed Power Systems Available for Licensing in FinFET Technologies

Thursday, September 29, 2022

• S2C Releases Neuroâ„¢ - Advanced Prototype Resource Management Software

Wednesday, September 28, 2022

• Foundry data shows the cracks in the semiconductor market
• S2C Releases Neuro™ - Advanced Prototype Resource Management Software
• Silicon Catalyst Announces POLYN Technology as Newest Company Admitted to Semiconductor Incubator
• Supply Chain Experts Weigh In on CHIPS Act
• SEGGER licenses C++ runtime library to SiFive for code size and performance efficiency
• AI "unicorn" Graphcore set to cut jobs
• Renesas Expands RZ/V Series with Built-in Vision AI Accelerator for Accurate Image Recognition and Multi-Camera Image Support
• Intel Foundry's "No. 1" Customer - U.S. DoD - Targets GAA
• easics launches nearbAI™ IP cores for XR devices that will set the standard for extreme edge AI performance and immersive experiences