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Tuesday, September 27, 2022

• Vidatronic to Exhibit at Samsung Foundry Forum and SAFEâ„¢ Forum in San Jose in October

Monday, September 26, 2022

• Will Samsung join Arm's US listing process?
• European plugfest for MIPI I3C spec
• Synopsys Advances Silicon Lifecycle Management to Accelerate Data Transport and Significantly Reduce Test Time
• U.S. Department of Defense Awards SkyWater up to $99M in Additional Funding to Advance Rad-Hard Technology to Productization and Qualification
• SiFive and ProvenRun Collaborate to deliver Best-in-Class Security for RISC-V Microprocessors
• Imagination and Baidu PaddlePaddle create open-source machine learning library for Model Zoo
• Arm announces new Board Members and new Chief Financial Officer
• Renesas Launches Integrated Development Environment That Enables ECU-Level Automotive Software Development Without Hardware
• Chips&Media Expands to New Markets such as Autonomous Vehicles
• PUFsecurity's Crypto Coprocessor PUFcc is PSA Certified Level 2 Ready

Monday, September 26, 2022

• QuiX Quantum wins €14 million contract with the German Aerospace Center to deliver a Universal Quantum Computer

Sunday, September 25, 2022

• VinFast and Renesas Sign Strategic Partnership to Advance Automobile Technology
• Siemens automates 2.5D and 3D IC design-for-test with new Tessent Multi die solution
• HDMI 2.0 Tx PHY and Controller IP Cores is available with Source Code license (Unlimited use with modification rights)
• CXL Spec Grows, Absorbs Others to Collate Ecosystem
• GOWIN Semiconductor New 22nm High-Performance FPGA family - Arora V
• QuiX Quantum wins €14 million contract with the German Aerospace Center to deliver a Universal Quantum Computer

Thursday, September 22, 2022

• ST, CAES team on octacore RISC-V space chip with selectable cores
• Bosch plans acquisition of Radio Frequency specialist ItoM
• Functional Safety Certification Packages for Microchip FPGAs Speed Time to Market
• CAES Wins Contracts for Development of Next-Generation, Octa-Core, user-selectable CPU for Space

Thursday, September 22, 2022

• Split manufacturing for trustworthy electronics "Made in Germany"

Wednesday, September 21, 2022

• Arm Is The New RISC/Unix, RISC-V Is The New Arm
• Split manufacturing for trustworthy electronics
• Imec researchers at Ghent University and Nokia Bell Labs work to debut key building block for the deployment of 100G PON networks
• Flex Logix Selects Semifore for Advanced Inference Chip Design
• Vidatronic to Exhibit at Samsung Foundry Forum and SAFE™ Forum in San Jose in October
• IPrium releases IEEE 802.11n/ac/ax LDPC Encoder and Decoder
• Siemens collaborates with UMC to develop 3D integrated circuit hybrid-bonding workflow
• Inuitive launches NU4100, expanding its Edge-AI Vision-on-Chip IC portfolio

Tuesday, September 20, 2022

• Perforce Joins the Global Semiconductor Alliance and Debuts IP Maturity Model
• IntelliProp First to Market with Memory Fabric Based on CXL; Driving Most Disruptive Technology to Hit Data Centers in Decades
• Renesas Accelerates Deep Learning Development for ADAS and Automated Driving Applications
• CEVA Accelerates 5G Infrastructure Rollout with Industry's First Baseband Platform IP for 5G RAN ASICs
• Codasip joins OpenHW Group to contribute to RISC-V verification
• CEO interview: Alphawave IP's Pialis on chiplets and custom silicon
• Alphawave IP: Interim results for the six months ended 30 June 2022
• Agile Analog launches new Digital Standard Cell Library
• QuickLogic Raises Approximately $3.2 Million with Strategic Investment by Institutional Investors
• DRAM Market Deflates, Cyclical Downturn Looms

Monday, September 19, 2022

• CEO interview: Alphawave IPs Pialis on chiplets and custom silicon
• Getting the right balance for ADAS architectures
• CEA RF Chip Enables Ultralow-Power IoT Connectivity For Remote Devices Via Astrocast's Nanosatellite Network
• €16m project to secure the chiplet supply chain in Europe
• CAES' Quad-Core LEON4FT Processor Selected for European Next-Generation Star Sensors
• Synopsys Unveils Industry's First Unified Emulation and Prototyping System Addressing Verification Requirements Across the Chip Development Cycle
• Movellus Secures $23M in Series B Funding to Accelerate Growth
• Achronix Acquires Key IP and Expertise from FPGA Networking Solutions Leader Accolade Technology

Monday, September 19, 2022

• proteanTecs Joins UCIeâ„¢ (Universal Chiplet Interconnect Expressâ„¢) Consortium to Advance 2.5D/3D Interconnect Monitoring

Monday, September 19, 2022

• CMOS Image Sensors Stall in "Perfect Storm" of 2022

Sunday, September 18, 2022

• Expect to Find Some Thorns in 5G's Bed of Roses
• GlobalFoundries Joins the PHLX Semiconductor Sector Index (SOX)
• Samsung Widens Semiconductor Sales Gap with Intel in Q2
• Ultra-low power 5G Sub-6GHz RF Transceiver IP Cores at 22nm, available for immediate licensing for Cellular and Industrial IoT applications
• proteanTecs Joins UCIe™ (Universal Chiplet Interconnect Express™) Consortium to Advance 2.5D/3D Interconnect Monitoring
• VisionFive 2 will be made compatible with all mainstream Linux Operating Systems

Friday, September 16, 2022

• Arm execs: We respect RISC-V but it's not a rival in the datacenter

Thursday, September 15, 2022

• QuantWare awarded subsidy from Quantum Delta NL for €1.1M project to develop the use of novel materials in superconducting quantum processors
• SkyWater to Provide Foundry Service for new NIST and Google Partnership to Create Supply of Chips for Researchers and Tech Startups
• QuantWare awarded subsidy from Quantum Delta NL for €1.1M project to develop the use of novel materials in superconducting quantum processors
• CMOS Image Sensors Stall in "Perfect Storm" of 2022
• NeuReality preps 7nm data centre AI chip

Wednesday, September 14, 2022

• Shortage of Low-end Chips May Disrupt Global Chip Supply Chains
• Apple to use updated TSMC technology
• Tachyum Enters QA Testing for Prodigy Universal Processor with New EDA Supplier
• Ubilite Introduces a Wi-Fi Chip With Less-Than-Bluetooth Power Consumption
• Silicon Catalyst welcomes NXP Semiconductors as Newest Strategic Partner
• NIST and Google to Create New Supply of Chips for Researchers and Tech Startups
• Redefining the global computing infrastructure with next-generation Arm Neoverse platforms