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Monday, August 15, 2022
Andes Technology and Green Hills Software Team Up to Deliver Advanced Automotive Safety Platform for RISC-V
Nordic Semiconductor announces its first Wi-Fi chip, the dual-band Wi-Fi 6 nRF7002
Exclusive CEO Interview: Latest Funding Drives Ventana's First RISC-V Chiplets in Data Centers
MIPI D-PHY IP Cores along with MIPI DSI Controller IP Cores for both Tx & Rx is available for immediate licensing for high-performance, cost-optimized cameras and displays
Sunday, August 14, 2022
2022 RISC-V Taipei Day to be held in September to explore RISC-V driven developments in EV, smart vehicles
New US EDA Software Ban May Affect China's Advanced IC Design, Says TrendForce
Edgewater Wireless Expands Intellectual Property Monetization Initiatives
Intel Elects Lip-Bu Tan to Its Board of Directors
Thursday, August 11, 2022
Vidatronic Expands Portfolio of Power Management, Analog, and Security IP with Additional 180 nm to 22 nm Technologies for IoT Applications Available for Licensing
Truechip Announces First Customer Shipment of CXL 3 Verification IP and CXL Switch Model
Wednesday, August 10, 2022
Neuromorphic Chip Gets $1 Million in Pre-Orders
Tudor Brown resigns from SMIC
SMIC Reports 2022 Second Quarter Results
Opinion: CHIPS Act Escalates Long-Standing U.S.-China Tech Rivalry
Arasan refreshes its Total USB IP Solution with its next generation of USB 2.0 PHY IP
Wednesday, August 10, 2022
Cadence Library Characterization Solution Accelerates Delivery and Enhances Quality of Arm Memory Products
Tuesday, August 9, 2022
Arteris Announces Financial Results for the Second Quarter 2022 and Estimated Third Quarter and Full Year 2022 Guidance
Siemens selected by Microsoft for Rapid Assured Microelectronics Prototypes (RAMP) Program
CEVA, Inc. Announces Second Quarter 2022 Financial Results
Monday, August 8, 2022
Renesas looks to simplify industrial ethernet implementations
GlobalFoundries CEO: Earnings benefited from balanced supply chain, diverse end markets
CEVA Celebrates 15 Billionth CEVA-powered Chip Shipped
Logic Fruit appoints Vijay Pal Sharma as VP - Engineering
Sunday, August 7, 2022
SiFive Is Leading The Way For Innovation On RISC-V
GlobalFoundries and Qualcomm Announce Extension of Long-term Agreement to Secure U.S. Supply through 2028
Space Codesign Systems joins Siemens Digital Industries Software Solution Partner Program as a Software and Technology Partner
Arm achieves record revenue and shipments in Q1 FY 2022
Enhance your SD Card experience by integrating SD 4.1 UHS-II PHY IP Core to achieve Ultra High Speeds
Thursday, August 4, 2022
Intel tGPU Setback Expected to Slow TSMC's 3 nm Ramp
Nordic Semi sets up RISC-V design team
Brite Semiconductor provides xSPI/Hyperbusâ„¢/Xcellaâ„¢ controller and PHY total solution
Brite Semiconductor provides xSPI/Hyperbus™/Xcella™ controller and PHY total solution
GUC Monthly Sales Report - July 2022
Cadence Accelerates Hyperscale SoC Design with Industry's First Verification IP and System VIP for CXL 3.0
Wednesday, August 3, 2022
STMicroelectronics Supports the World Transitions to Digitalization and Decarbonization with its Pioneered FD-SOI Technology
Neuromorphic Device with Low Power Consumption
Edge Impulse Releases Deployment Support for BrainChip Akida Neuromorphic IP
Rambus Reports Second Quarter 2022 Financial Results
Architect of CHIPS Act Speaks on Its Impact
Efinix® Extends Breakthrough Family of Titanium Products with Launch of the Titanium Ti180 FPGA
June Swoon - IC Sales Turn Negative as Economy Weighs on Market
UMC Reports Sales for July 2022
Intel Orders Delayed, TSMC Slows Three-Nanometer Expansion, Says TrendForce
IPrium releases CCSDS TC Telecommand LDPC Encoder and Decoder
Access Advance VVC Patent Pool Momentum Grows
Cadence Library Characterization Solution Accelerates Delivery and Enhances Quality of Arm Memory Products
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