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Tuesday, August 2, 2022
UCIeâ„¢ (Universal Chiplet Interconnect Expressâ„¢) Consortium Announces Incorporation and New Board Members; Open for Membership
UCIe™ (Universal Chiplet Interconnect Express™) Consortium Announces Incorporation and New Board Members; Open for Membership
CXL Consortium Releases Compute Express Link 3.0 Specification to Expand Fabric Capabilities and Management
Global Semiconductor Sales Increase 13.3% in Q2 2022 Compared to Q2 2021
Imperas leads the RISC-V verification ecosystem as the first to release an open-source SystemVerilog RISC-V processor functional coverage library
Alma Technologies Announces the Immediate Availability of an Ultra-High Throughput Image Scaler IP Core
Accellera Announces Proposed Working Group to Explore Clock Domain Crossing Standard
Monday, August 1, 2022
Soitec: Paul Boudre Hands Over CEO Role to Pierre Barnabé
Mobiveil and Avery Design Systems Extend Partnership to Accelerate Design and Verification of NVMe 2.0-Enabled SSD Development
Avery Announces 800G Ethernet VIP virtual network co-simulation platform, enabling SoC pre-silicon validation in real networked application environments
OPENEDGES Passes the Eligibility Examination of the KOSDAQ listing
NSITEXE expands products lineup of RISC-V CPU supported functional safety
Rambus Appoints Desmond Lynch as Chief Financial Officer
CXL Consortium and OpenCAPI Consortium Sign Letter of Intent to Transfer OpenCAPI Specifications to CXL
Avery Design Announces CXL 3.0 VIP
PUFsecurity gains Riscure accreditation for its Anti-Tamper solution, PUFrt
Sunday, July 31, 2022
Open source chip programme expands to 90nm FDSOI
Avery Design Systems Verification IP Helps Solid State Storage Controller Startup Validate its Designs and Get to Market Faster
U.S. Passes CHIPS Act, Increasing Restrictions on China Lead to Rising Geopolitical Risk, Says Trendforce
SD/eMMC Host and Device Controller IP Cores including matching PHYs with high performance, and high storage capacity available for license to secure your removable and embedded storage
Wednesday, July 27, 2022
SkyWater Receives Funding from DOD, Partners with Google to Facilitate Open Source Design for its new 90 nm Technology Offering
NSITEXE product brand "Akaria", expand portfolio
Faraday Reports Second Quarter 2022 Results
Worldwide Silicon Wafer Shipments Set New Record in Q2 2022, SEMI Reports
Arm announces appointment of Spencer Collins as Chief Legal Officer
Renesas Announces Consolidated Forecasts
Faraday Unveiled FPGA-Go-ASIC Prototyping Platform to Accelerate FPGA-to-ASIC Conversion
Tuesday, July 26, 2022
Gartner Forecasts Worldwide Semiconductor Revenue Growth to Slow to 7% in 2022
MIPI UniPro v2.0 Doubles Peak Data Rate and Delivers Greater Throughput and Reduced Latency for Flash Memory Storage Applications
Xfuse, LLC Enters AI Vision Market with New Image Signal Processing (ISP) Technology
Monday, July 25, 2022
EnSilica turns to QLS to strengthen sales networks in North America
Intel to manufacture MediaTek Edge chips, instead of TSMC
Samsung Foundry Achieves 2X Productivity on Large-Scale Analog and Mixed-Signal IP with the Spectre FX Simulator
DCD-SEMI adds extra features to LIN IP Core and GuardKnox license the solution
Monday, July 25, 2022
Alma Technologies Scales-up the Performance of the JPEG-LS Image Compression IP Core by Employing its Ultra High Throughput - UHTâ„¢ Architecture
Sunday, July 24, 2022
History is made! Samsung beats out TSMC and starts shipping 3nm GAA chipsets
Intel and MediaTek Form Foundry Partnership
Cadence Expands into Molecular Simulation with Acquisition of OpenEye Scientific, a Pioneering Leader in Computational Molecular Design
eMMC Holds Its Own Against UFS
SMIC shipping 7nm ICs
CIX Technology joins Linaro's Windows on Arm Group
5G Sub-6GHz RF Transceiver IP Cores, available for immediate licensing to the customers for Cellular and Industrial IoT applications
CAES' Quad Core LEON4FT Processor Selected for Next-Generation On-orbit Servicing Spacecraft
Silicon Labs Selects CoreHW Advanced Bluetooth AoA Switch for Dual Polarized Antenna Array Pro Kit
Creonic Offers High-throughput Single-chip DVB-S2X Satellite Modem for Zynq UltraScale+ RFSoC
CFX announces commercial availability of anti-fuse OTP technology on 55nm CIS process
Saturday, July 23, 2022
Wi-Fi Alliance® claims Wi-Fi® delivers strong IoT advantage
Friday, July 22, 2022
STMicroelectronics and GlobalFoundries agreed to build a steel factory in France for production of chips on 300-mm FDSOI substrates
Thursday, July 21, 2022
10Gbps! The fastest LPDDR5/5X IP deliver production !
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